EP2C35F672C8 Altera, EP2C35F672C8 Datasheet - Page 85
![IC CYCLONE II FPGA 33K 672-FBGA](/photos/6/72/67269/ep2c35f672c8_sml.jpg)
EP2C35F672C8
Manufacturer Part Number
EP2C35F672C8
Description
IC CYCLONE II FPGA 33K 672-FBGA
Manufacturer
Altera
Series
Cyclone® IIr
Datasheet
1.EP2C5T144C8N.pdf
(168 pages)
Specifications of EP2C35F672C8
Number Of Logic Elements/cells
33216
Number Of Labs/clbs
2076
Total Ram Bits
483840
Number Of I /o
475
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
672-FBGA
Family Name
Cyclone® II
Number Of Logic Blocks/elements
33216
# I/os (max)
475
Frequency (max)
402.58MHz
Process Technology
90nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
33216
Ram Bits
483840
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
672
Package Type
FBGA
For Use With
NANO-CYCLONE - KIT NANOBOARD AND CYCLONEII DC807-1002 - DAUGHTER CARD ALTERA CYCLONE IIP0301 - DE2 CALL FOR ACADEMIC PRICING544-1733 - PCI KIT W/CYCLONE II EP2C35N
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Not Compliant
Other names
544-1089
EP2C35F672C8ES
EP2C35F672C8ES
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EP2C35F672C8
Manufacturer:
ALTERA
Quantity:
20 000
Company:
Part Number:
EP2C35F672C8N
Manufacturer:
YAGEO
Quantity:
500 000
Company:
Part Number:
EP2C35F672C8N
Manufacturer:
ALTERA
Quantity:
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Part Number:
EP2C35F672C8N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
Hot-Socketing
Feature
Implementation
in Cyclone II
Devices
Altera Corporation
February 2007
the power supply can provide current to the device’s V
planes. This condition can lead to latch-up and cause a low-impedance
path from V
a large amount of current, possibly causing electrical damage.
Altera has ensured by design of the I/O buffers and hot-socketing
circuitry, that Cyclone II devices are immune to latch-up during hot
socketing.
The hot-socketing feature turns off the output buffer during power up
(either V
generates an internal HOTSCKT signal when either V
below the threshold voltage. Designs cannot use the HOTSCKT signal for
other purposes. The HOTSCKT signal cuts off the output buffer to ensure
that no DC current (except for weak pull-up leakage current) leaks
through the pin. When V
even after the internal POR signal (not available to the FPGA fabric used
by customer designs) is released and the configuration is finished. The
CONF_DONE, nCEO, and nSTATUS pins fail to respond, as the output
buffer cannot drive out because the hot-socketing circuitry keeps the I/O
pins tristated at this low V
has been removed on these configuration output or bidirectional pins to
ensure that they are able to operate during configuration. These pins are
expected to drive out during power-up and power-down sequences.
Each I/O pin has the circuitry shown in
CCINT
CC
or V
to ground within the device. As a result, the device extends
CCIO
supplies) or power down. The hot-socket circuit
CC
CC
ramps up slowly, V
voltage. Therefore, the hot-socketing circuit
Cyclone II Device Handbook, Volume 1
Figure
Hot Socketing & Power-On Reset
CC
4–1.
is still relatively low
CCINT
CC
and ground
or V
CCIO
is
4–3