XC2VP7-5FFG896I Xilinx Inc, XC2VP7-5FFG896I Datasheet - Page 381

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XC2VP7-5FFG896I

Manufacturer Part Number
XC2VP7-5FFG896I
Description
IC FPGA VIRTEX-II PRO 896-FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-II Pror
Datasheet

Specifications of XC2VP7-5FFG896I

Number Of Logic Elements/cells
11088
Number Of Labs/clbs
1232
Total Ram Bits
811008
Number Of I /o
396
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
896-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-

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FF1696 Flip-Chip Fine-Pitch BGA Package
As shown in
Following this table are the
Table 14: FF1696 — XC2VP100
DS083 (v4.7) November 5, 2007
Product Specification
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
Table
14, XC2VP100 Virtex-II Pro devices are available in the FF1696 flip-chip fine-pitch BGA package.
FF1696 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
IO_L03P_0/VREF_0
IO_L09P_0/VREF_0
IO_L27P_0/VREF_0
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L05_0/No_Pair
Pin Description
IO_L02N_0
IO_L02P_0
IO_L03N_0
IO_L06N_0
IO_L06P_0
IO_L07N_0
IO_L07P_0
IO_L08N_0
IO_L08P_0
IO_L09N_0
IO_L19N_0
IO_L19P_0
IO_L20N_0
IO_L20P_0
IO_L21N_0
IO_L21P_0
IO_L25N_0
IO_L25P_0
IO_L26N_0
IO_L26P_0
IO_L27N_0
IO_L28N_0
IO_L28P_0
IO_L29N_0
IO_L29P_0
IO_L30N_0
IO_L30P_0
IO_L34N_0
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
www.xilinx.com
Pin Number
C32
C33
G33
B33
G32
H32
D32
B32
H30
G31
H31
D30
D31
C31
G30
E33
F33
K32
L32
A33
F32
E32
A32
K31
L31
E31
F31
B31
K30
L30
F30
B30
J32
J31
pitch).
No Connects
XC2VP100
Module 4 of 4
253

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