MPC852TVR50A Freescale Semiconductor, MPC852TVR50A Datasheet - Page 10

• Manufacturer Part Number: MPC852TVR50A
• Description: IC MPU POWERQUICC 50MHZ 256PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC Ir

Specifications of MPC852TVR50A

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 50MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 256-PBGA
• Processor Series: MPC8xx
• Core: MPC8xx
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC852TADS-KIT
• Maximum Clock Frequency: 50 MHz
• Operating Supply Voltage: 0 V to 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 8 KB
• I/o Voltage: 3.3 V
• Interface Type: SPI, UART
• Minimum Operating Temperature: 0 C
• Program Memory Size: 4 KB
• Program Memory Type: EPROM/Flash
• Core Size: 32 Bit
• Cpu Speed: 50MHz
• Embedded Interface Type: SPI
• Digital Ic Case Style: BGA
• No. Of Pins: 256
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Thermal Calculation and Measurement
where:
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity T
7.2
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
where:
R
affect the case-to-ambient thermal resistance, R
the device, add a heat sink, change the mounting arrangement on the printed-circuit board, or change the
thermal dissipation on the printed-circuit board surrounding the device. This thermal model is most useful
for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink
to the ambient environment. For most packages, a better model is required.
7.3
A simple package thermal model that has demonstrated reasonable accuracy (about 20%) is a two-resistor
model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case
covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the
top of the package. The junction-to-board thermal resistance describes the thermal performance when most
of the heat is conducted to the printed-circuit board. Thermal performance of most plastic packages and
especially PBGA packages is strongly dependent on the board temperature. If the board temperature is
known, an estimate of the junction temperature in the environment can be made using the following
equation:
where:
10
θJC
is device-related and cannot be influenced by the user. The user adjusts the thermal environment to
T
R
P
R
R
R
R
T
P
A
D
D
B
θJA
θJA
θJC
θCA
θJB
Estimation with Junction-to-Case Thermal Resistance
Estimation with Junction-to-Board Thermal Resistance
= ambient temperature (ºC)
= board temperature (ºC)
= power dissipation in package
= power dissipation in package
= junction-to-case thermal resistance (ºC/W)
= junction-to-board thermal resistance (ºC/W)
= package junction-to-ambient thermal resistance (ºC/W)
= junction-to-ambient thermal resistance (ºC/W)
= case-to-ambient thermal resistance (ºC/W)
R
T
θJA
J
= T
= R
B
+(R
θJC
θJB
MPC852T PowerQUICC™ Hardware Specifications, Rev. 4
+ R
× P
θCA
D
)
J
θCA
– T
A
. For instance, the user can change the airflow around
) are possible.
Freescale Semiconductor