MPC852TVR50A Freescale Semiconductor, MPC852TVR50A Datasheet - Page 7

• Manufacturer Part Number: MPC852TVR50A
• Description: IC MPU POWERQUICC 50MHZ 256PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC Ir

Specifications of MPC852TVR50A

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 50MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 256-PBGA
• Processor Series: MPC8xx
• Core: MPC8xx
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC852TADS-KIT
• Maximum Clock Frequency: 50 MHz
• Operating Supply Voltage: 0 V to 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 8 KB
• I/o Voltage: 3.3 V
• Interface Type: SPI, UART
• Minimum Operating Temperature: 0 C
• Program Memory Size: 4 KB
• Program Memory Type: EPROM/Flash
• Core Size: 32 Bit
• Cpu Speed: 50MHz
• Embedded Interface Type: SPI
• Digital Ic Case Style: BGA
• No. Of Pins: 256
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1
This device contains circuitry protecting against damage that high-static voltage or electrical fields cause;
however, Freescale recommends taking normal precautions to avoid application of any voltages higher
than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if
unused inputs are tied to an appropriate logic voltage level (for example, either GND or V
4
Table 3
1
2
3
4
5
6
Freescale Semiconductor
Temperature
Temperature (extended)
Junction-to-ambient
Junction-to-board
Junction-to-case
Junction-to-package top
Minimum temperatures are guaranteed as ambient temperature, T
temperature, T
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal
Per JEDEC JESD51-6 with the board horizontal
Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages
where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to
the exposed pad without contact resistance.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2
Thermal Characteristics
shows the thermal characteristics for the MPC852T.
1
Rating
(standard)
5
j
.
4
1
6
MPC852T PowerQUICC™ Hardware Specifications, Rev. 4
Rating
Natural convection
Airflow (200 ft/min)
Natural convection
Airflow (200 ft/min)
Table 3. MPC852T Thermal Resistance Data
Table 2. Operating Temperatures
Environment
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
A
. Maximum temperatures are guaranteed as junction
Symbol
T
T
T
T
A(min)
A(min)
j(max)
j(max)
Symbol
R
R
R
R
R
R
θJMA
θJMA
θJMA
Ψ
Ψ
θJA
θJB
θJC
JT
JT
2
3
3
3
Thermal Characteristics
Value
– 40
100
95
Value
0
49
32
41
29
24
13
3
2
DD
).
°C/W
Unit
Unit
°C
°C
°C
°C
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