MPC852TVR50A Freescale Semiconductor, MPC852TVR50A Datasheet - Page 75

IC MPU POWERQUICC 50MHZ 256PBGA

MPC852TVR50A

Manufacturer Part Number
MPC852TVR50A
Description
IC MPU POWERQUICC 50MHZ 256PBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC Ir
Datasheet

Specifications of MPC852TVR50A

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
1.8V
Mounting Type
Surface Mount
Package / Case
256-PBGA
Processor Series
MPC8xx
Core
MPC8xx
Data Bus Width
32 bit
Development Tools By Supplier
MPC852TADS-KIT
Maximum Clock Frequency
50 MHz
Operating Supply Voltage
0 V to 3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Ram Size
8 KB
I/o Voltage
3.3 V
Interface Type
SPI, UART
Minimum Operating Temperature
0 C
Program Memory Size
4 KB
Program Memory Type
EPROM/Flash
Core Size
32 Bit
Cpu Speed
50MHz
Embedded Interface Type
SPI
Digital Ic Case Style
BGA
No. Of Pins
256
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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16.2
For more information on the printed-circuit board layout of the PBGA package, including thermal via
design and suggested pad layout, refer to Plastic Ball Grid Array Application Note (order number:
AN1231) that is available from your local Freescale sales office.
dimensions of the PBGA package.
Freescale Semiconductor
Figure 65. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
Mechanical Dimensions of the PBGA Package
Notes:
Note: Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC852TVRXXX.
1. All dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M—1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC852TZTXXX.
MPC852T PowerQUICC™ Hardware Specifications, Rev. 4
Figure 65
Mechanical Data and Ordering Information
shows the mechanical
75

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