G6ZU-1FE-DC5 Omron, G6ZU-1FE-DC5 Datasheet - Page 14

• Manufacturer Part Number: G6ZU-1FE-DC5
• Description: Low Signal Relays - PCB LATCHING 5VDC 75 OHM E-terminals
• Manufacturer: Omron
• Series: G6Zr

Specifications of G6ZU-1FE-DC5

• Contact Form: 1 Form C
• Coil Voltage: 5 VDC
• Coil Current: 40 mA
• Coil Type: Single Latching
• Power Consumption: 200 mW
• Termination Style: Solder Terminal
• Isolation: 60 dB to 65 dB at 900 MHz / 30 dB to 45 dB at 2.6 GHz
• Insertion Loss: 0.1 dB to 0.2 dB at 900 MHz / 0.3 dB to 0.5 dB at 2.6 GHz
• Maximum Switching Current: 0.5 A
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: G6ZU-1FEDC5

Safety Precautions
■ Precautions for Correct Use
Please observe the following precautions to prevent failure to
operate, malfunction, or undesirable effect on product performance.
High-frequency Characteristics Measurement Method
and Measurement Substrate
High-frequency characteristics for the G6Z are measured in the way
shown below. Consult your OMRON representative for details on
50-Ω models.
Measurement Method for 75-W Models
Through-hole Substrate (75-W Models, E-shape or Y-shape)
SMD-type Substrate (75-W Models, E-shape or Y-shape)
354
(Unit: mm)
40
(Unit: mm)
40
Network vector analyzer
(Agilent Technologies)
30
30
HP8753D
6.3
6.3
High-frequency Relay
50Ω/75Ω adapter
(Agilent Technologies)
11852B-004
0.4
1.4
40
30
40
30
0.4
1.4
G6Z
G6Z
4-dia. through-hole
0.6-dia. through-hole
4-dia. through-hole
0.6-dia. through-hole
3.59
3.91
1
1
75-Ω terminating
resistance
0.95
0.95
Substrate for High-frequency Characteristic Compensation
(75-W Models, E-shape or Y-shape)
Substrate Types
Material: FR-4 glass epoxy (glass cloth impregnated with epoxy
Thickness: 1.6 mm
Thickness of copper plating:18 μm
Note:
Note:
Note:
Note:
Note:
Handling
Do not use the Relay if it has been dropped. Dropping the Relay may
adversely affect its functionality.
Protect the Relay from direct sunlight and keep the Relay under nor-
mal temperature, humidity, and pressure.
Flow Soldering
Solder: JIS Z3282, H63A
Soldering temperature: Approx. 250°C (260°C if the DWS method is
used)
Soldering time: Approx. 5 s max. (approx. 2 s for the first time and
approx. 3 s for the second time if the DWS method is used)
Be sure to make a molten solder level adjustment so that the solder
will not overflow on the PCB.
40
(Unit: mm)
30
0.95
1. The compensation substrate is used when measuring the
2. For convenience, the diagrams of the high-frequency
3. Be sure to mount a standoff tightly to the through-hole
4. Use measuring devices, connectors, and substrates that
5. Ensure that there is no pattern under the Relay.
resin and copper laminated to its outer surface)
Relay’s insertion loss. The insertion loss is obtained by
subtracting the measured value for the compensation
substrate from the measured value with the Relay
mounted to the high-frequency measurement substrate.
measurement substrates given here apply both to models
with an E-shape terminal structure and to models with a
Y-shape terminal structure.
substrate.
are appropriate for 50 Ω and 75 Ω respectively.
Otherwise, the impedance may be adversely affected and
the Relay may not be able to attain its full characteristics.
1
30.7
20
4-dia. through-hole
0.6-dia. through-hole