XPC8260VVHFBC Freescale Semiconductor, XPC8260VVHFBC Datasheet
XPC8260VVHFBC
Specifications of XPC8260VVHFBC
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XPC8260VVHFBC Summary of contents
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... PowerQUICC II family of communications processors: the MPC8260 and the MPC8255. Throughout this document, the MPC8260 and the MPC8255 are collectively referred to as the MPC8260. © 2010 Freescale Semiconductor, Inc. All rights reserved. Document Number: MPC8260EC Rev. 2, 05/2010 Contents 1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 ...
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... SCC3 SCC4 SMC1 Serial Interface 3 MII 2 UTOPIA 3 Ports Ports Figure 1. MPC8260 Block Diagram System Interface Unit (SIU) 60x Bus Bus Interface Unit 60x-to-Local Local Bus Bridge 32 bits MHz Memory Controller Clock Counter System Functions 2 SMC2 SPI I C Non-Multiplexed I/O Freescale Semiconductor ...
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... Byte selects for 64 bus width (60x) and byte selects for 32 bus width (local) — Dedicated interface logic for SDRAM • CPU core can be disabled and the device can be used in slave mode to an external core • Communications processor module (CPM) MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Features 3 ...
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... UART (low-speed operation) — One serial peripheral interface identical to the MPC860 SPI — One inter-integrated circuit (I – Microwire compatible – Multiple-master, single-master, and slave modes MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev controller (identical to the MPC860 controller) Freescale Semiconductor ...
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... Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no more than 100 mSec. VDDH should not exceed VDD/VCCSYN by more than 2.0 V during normal operation. 4 Caution: VIN must not exceed VDDH by more than 2 any time, including during power-on reset. MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Table 1. Absolute Maximum Ratings Symbol VDD VCCSYN ...
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... MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev Symbol VDD VCCSYN VDDH VIN T j NOTE: Core, PLL, and I/O Supply Voltages GND Not to exceed 10 SDRAM_CLK Figure 2. Overshoot/Undershoot Voltage 1 2 2.5-V Device Unit 2.4–2.7 V 2.4–2.7 V 3.135 – 3.465 V GND (-0.3) – 3.465 V 105 ° Freescale Semiconductor ...
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... Output high voltage – except XFC, UTOPIA mode, and open drain pins In UTOPIA mode -8.0mA OH PA[0-31] PB[4-31] PC[0-31] PD[4-31] In UTOPIA mode 8.0mA OL PA[0-31] PB[4-31] PC[0-31] PD[4-31] MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Table 3. DC Electrical Characteristics Symbol IHC V ILC ...
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... DP(5)/TBEN/IRQ5/EXT_DBG3 DP(6)/CSE(0)/IRQ6 DP(7)/CSE(1)/IRQ7 PSDVAL TA TEA GBL/IRQ1 CI/BADDR29/IRQ2 WT/BADDR30/IRQ3 L2_HIT/IRQ4 CPU_BG/BADDR31/IRQ5 CPU_DBG CPU_BR IRQ0/NMI_OUT IRQ7/INT_OUT/APE PORESET HRESET SRESET RSTCONF QREQ MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev (continued) Symbol Min Max V — 0.4 OL Freescale Semiconductor Unit V ...
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... The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC current recommended to either pull unused pins to GND or VDDH configure them as outputs. 2 The leakage current is measured for nominal VDD, VCCSYN, and VDD. MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Electrical and Thermal Characteristics 1 (continued) Symbol ...
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... JA in °C can be obtained from the following °C/W junction to ambient , , . neglected an approximate relationship between P , INT I/O θ Using this value of K the values Unit Air Flow 1 2 °C/W NC °C/W 1 m/s 3 °C/W NC °C/W 1 m/s and T can be obtained Freescale Semiconductor (1) and D (2) (3) ...
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... 2.8 Vddl does not apply to HiP3 Rev C silicon. MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor power supply should be bypassed to ground using at least four CC and ground should be kept to less than half an CC and GND circuits. Pull up all unused inputs or signals that will (when the ambient temperature is 70° ...
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... Typical Impedance (Ω) 60x bus Local bus Memory controller Parallel I/O Note: 1 These are typical values at 65° C. The impedance may vary by ±25% with process and temperature. Characteristic NOTE: Rise/Fall Time on CPM Input Pins Max Delay (ns) Min Delay (ns) 66 MHz Freescale Semiconductor 66 MHz ...
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... Note that although the specifications generally reference the rising edge of the clock, the following AC timing diagrams also apply when the falling edge is the active edge. MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Table 8. AC Characteristics for CPM Inputs Characteristic ...
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... FCC input signals FCC output signals Note: When GFMR[TCI FCC output signals Note: When GFMR.[TCI MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev sp17b sp36b/sp37b Figure 3. FCC External Clock Diagram sp17a sp36a/sp37a Figure 4. FCC Internal Clock Diagram sp36b/sp37b sp36a/sp37a Freescale Semiconductor ...
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... Input sampled on the rising edge and output driven on the falling edge. 3. Input sampled on the falling edge and output driven on the falling edge. 4. Input sampled on the falling edge and output driven on the rising edge. Figure 6. SCC/SMC/SPI/I MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 2 C external clock. sp18b sp38b/sp39b ...
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... Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are measured at the pin. MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev Sys clk sp22 (See note) (See note) TIMER/PIO output signals Table 9. AC Characteristics for SIU Inputs Characteristic sp23 sp23 sp22 sp42/sp43 sp42/sp43 1 Setup (ns) Hold (ns) 66 MHz 66 MHz Freescale Semiconductor ...
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... Input sampled on the rising edge and output driven on the falling edge. 3. Input sampled on the falling edge and output driven on the falling edge. 4. Input sampled on the falling edge and output driven on the rising edge. MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Characteristic NOTE sp20 ...
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... MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev sp11 sp12 sp15 sp31 sp32 sp33a sp35 Figure 9. Bus Signals CLKin sp13 sp14 DP mode input signal DP mode output signal Figure 10. Parity Mode Diagram sp10 sp10 sp10 sp30 sp30 sp30 sp30 sp10 sp10 sp33b/sp30 Freescale Semiconductor ...
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... CLKin T1 CLKin T1 CLKin T1 Figure 12. Internal Tick Spacing for Memory Controller Signals MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor sp34/sp30 Figure 11. MEMC Mode Diagram NOTE Tick Spacing (T1 Occurs at the Rising Edge of CLKin 1/4 CLKin 1/2 CLKin ...
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... MHz 5 166 MHz 2.5 166 MHz 3 200 MHz 2.5 166 MHz 3 200 MHz 1 CPM Core Multiplication Factor Frequency 66 MHz 4 66 MHz 5 66 MHz 6 66 MHz 7 66 MHz 8 Freescale Semiconductor Core 2 133 MHz 166 MHz 200 MHz 233 MHz 266 MHz ...
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... MHz 0011_101 33 MHz 0011_110 33 MHz 0011_111 33 MHz 0100_000 33 MHz 0100_001 0100_010 0100_011 0100_100 0100_101 0100_110 MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 1 CPM Multiplication CPM 2,3 Factor Frequency 3 100 MHz 3 100 MHz 3 100 MHz 3 100 MHz 3 100 MHz ...
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... MHz 4 266 MHz 4.5 300 MHz 2 133 MHz 2.5 166 MHz 3 200 MHz 3.5 233 MHz 4 266 MHz 4.5 300 MHz 2 133 MHz 2.5 166 MHz 3 200 MHz 3.5 233 MHz 4 266 MHz 4.5 300 MHz Freescale Semiconductor Core 2 ...
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... Identical to CLKIN. 5 CPM multiplication factor = CPM clock/bus clock 6 CPU multiplication factor = Core PLL multiplication factor 4 Pinout This section provides the pin assignments and pinout list for the MPC8260. MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Table 13 are applicable. Pinout 23 ...
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... Pinout 4.1 Pin Assignments Figure 13 shows the pinout of the MPC8260 480 TBGA package as viewed from the top surface Not to Scale Figure 13. Pinout of the 480 TBGA Package as Viewed from the Top Surface MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev Freescale Semiconductor ...
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... A9 A10 A11 A12 A13 A14 A15 A16 A17 MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor View Die Attach Die Glob-Top Filled Area Glob-Top Dam Wire Bonds Figure 14. Side View of the TBGA Package Table 15 defines conventions and acronyms used in Table 14 ...
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... A28 A29 A30 A31 TT0 TT1 TT2 TT3 TT4 TBST TSIZ0 TSIZ1 TSIZ2 TSIZ3 AACK ARTRY DBG DBB/IRQ3 MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev Table 14. Pinout List (continued) Pin Name Ball B20 A18 A16 A13 E12 D9 A6 Freescale Semiconductor ...
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... D27 D28 D29 D30 D31 D32 D33 D34 D35 D36 D37 D38 D39 D40 D41 MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Table 14. Pinout List (continued) Pin Name Pinout Ball B5 A20 E17 B15 B13 A11 D19 D17 D15 ...
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... GBL/IRQ1 CI/BADDR29/IRQ2 MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev Table 14. Pinout List (continued) Pin Name Ball A14 B12 A10 C18 E16 B14 C12 B10 B18 B16 E14 D12 C10 B22 A22 E21 D21 C21 B21 A21 E20 V3 C22 Freescale Semiconductor ...
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... ALE BCTL0 PWE0/PSDDQM0/PBS0 PWE1/PSDDQM1/PBS1 PWE2/PSDDQM2/PBS2 PWE3/PSDDQM3/PBS3 PWE4/PSDDQM4/PBS4 PWE5/PSDDQM5/PBS5 PWE6/PSDDQM6/PBS6 PWE7/PSDDQM7/PBS7 PSDA10/PGPL0 PSDWE/PGPL1 POE/PSDRAS/PGPL2 PSDCAS/PGPL3 PGTA/PUPMWAIT/PGPL4/PPBS PSDAMUX/PGPL5 MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Table 14. Pinout List (continued) Pin Name Pinout Ball F25 C29 E27 E28 F26 F27 F28 ...
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... Table 14. Pinout List (continued) Pin Name Ball H28 H27 H26 G29 D27 C28 E26 D25 C26 B27 D28 N27 T29 R27 R26 R29 R28 W29 P28 N26 AA27 P29 AA26 N25 AA25 AB29 AB28 P25 AB27 H29 J29 J28 J27 J26 J25 Freescale Semiconductor ...
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... LCL_D28 LCL_D29 LCL_D30 LCL_D31 LCL_DP0 LCL_DP1 LCL_DP2 LCL_DP3 IRQ0/NMI_OUT IRQ7/INT_OUT/APE TRST TCK TMS MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Table 14. Pinout List (continued) Pin Name Pinout Ball K25 L29 L27 L26 L25 M29 M28 M27 M26 N29 ...
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... Table 14. Pinout List (continued) Pin Name Ball AE6 AF5 AB4 AG6 AH5 AF6 AA3 AJ4 AB2 AH4 2 AC29 2 AC25 2 AE28 2 AG29 2 AG28 2 AG26 2 AE24 2 AH25 2 AF23 2 AH23 2 AE22 2 AH22 2 AJ21 2 AH20 2 AG19 2 AF18 2 AF17 2 AE16 2 AJ16 2 AG15 2 AJ13 2 AE13 Freescale Semiconductor ...
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... PB12/FCC3_MII_CRS/L1CLKOB1/L1RSYNCC1/TXD2 PB13/FCC3_MII_COL/L1RQB1/L1TSYNCC1/L1GNTC1/L1TXD1A2 PB14/FCC3_MII_TX_EN/RXD3/L1RXDC1 PB15/FCC3_MII_TX_ER/RXD2/L1TXDC1 PB16/FCC3_MII_RX_ER/L1CLKOA1/CLK18 PB17/FCC3_MII_RX_DV/L1RQA1/CLK17 PB18/FCC2_UT8_RXD4/FCC2_RXD3/L1CLKOD2/L1RXD2A2 PB19/FCC2_UT8_RXD5/FCC2_RXD2/L1RQD2/L1RXD3A2 PB20/FCC2_UT8_RXD6/FCC2_RXD1/L1RSYNCD2/L1TXD1A1 PB21/FCC2_UT8_RXD7/FCC2_RXD0/FCC2_RXD/L1TSYNCD2/L1GNTD2/ L1TXD2A1 PB22/FCC2_UT8_TXD7/FCC2_TXD0/FCC2_TXD/L1RXD1A1/L1RXDD2 PB23/FCC2_UT8_TXD6/FCC2_TXD1/L1RXD2A1/L1TXDD2 PB24/FCC2_UT8_TXD5/FCC2_TXD2/L1RXD3A1/L1RSYNCC2 PB25/FCC2_UT8_TXD4/FCC2_TXD3/L1TSYNCC2/L1GNTC2/L1TXD3A1 PB26/FCC2_MII_CRS/FCC2_UT8_TXD1/L1RXDC2 PB27/FCC2_MII_COL/FCC2_UT8_TXD0/L1TXDC2 MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Table 14. Pinout List (continued) Pin Name Pinout Ball 2 AF12 2 AG11 2 AH9 2 AJ8 2 AH7 2 AF7 2 ...
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... Table 14. Pinout List (continued) Pin Name Ball 2 AE3 2 AE2 2 AC5 2 AC4 2 AB26 2 AD29 2 AE29 2 AE27 2 AF27 2 AF24 2 AJ26 2 AJ25 2 AF22 2 AE21 2 AF20 2 AE19 2 AE18 2 AH18 2 AH17 2 AG16 2 AF15 2 AJ15 2 AH14 2 AG13 2 AH12 2 AJ11 2 AG10 2 AE10 2 AF9 2 AE8 2 AJ6 2 AG2 2 AF3 Freescale Semiconductor ...
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... SPICLK/FCC2_UTM_RXADDR3/FCC2_UTS_RXADDR0 PD19/FCC1_UTM_TXADDR4/FCC1_UTS_TXADDR4/FCC1_UTM_TXCLAV3/ SPISEL/BRGO1/FCC2_UTM_TXADDR3/FCC2_UTS_TXADDR0 PD20/RTS4/TENA4/FCC1_UT16_RXD2/L1RSYNCA2 PD21/TXD4/FCC1_UT16_RXD3/L1RXD0A2/L1RXDA2 PD22/RXD4/FCC1_UT16_TXD5/L1TXD0A2/L1TXDA2 PD23/RTS3/TENA3/FCC1_UT16_RXD4/L1RSYNCD1 PD24/TXD3/FCC1_UT16_RXD5/L1RXDD1 PD25/RXD3/FCC1_UT16_TXD6/L1TXDD1 PD26/RTS2/TENA2/FCC1_UT16_RXD6/L1RSYNCC1 PD27/TXD2/FCC1_UT16_RXD7/L1RXDC1 PD28/RXD2/FCC1_UT16_TXD7/L1TXDC1 PD29/RTS1/TENA1/FCC1_UTM_RXADDR3/FCC1_UTS_RXADDR3/ FCC1_UTM_RXCLAV2/FCC2_UTM_RXADDR4/FCC2_UTS_RXADDR1 PD30/FCC2_UTM_TXENB/FCC2_UTS_TXENB/TXD1 PD31/RXD1 VCCSYN MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Table 14. Pinout List (continued) Pin Name Pinout Ball 2 AF2 2 AE1 2 AD1 2 AC28 2 AD27 2 AF29 2 ...
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... AJ19, AH10, AJ10, AJ5 AA5, AF21, AF14, AF8, AE7, AF11, AE17, AE23, AC26, AB25, Y26, V25, T26, R25, P26, M25, K27, H25, G26, D7, D10, D14, D16, D20, D23, C9, E11, E13, E15, E19, E22, B3, G5, H4, K5, M3, P5, T4, Y5, AA2, AC3 Meaning Freescale Semiconductor ...
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... Interconnects Pitch Nominal unmounted package height 1.55 mm MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Table 15. Symbol Legend (continued) Indicates that a signal is part of the UTOPIA slave interface Indicates that a signal is part of the 8-bit UTOPIA interface Indicates that a signal is part of the 16-bit UTOPIA interface Indicates that a signal is part of the media independent interface 16. The package type is a 37.5 × ...
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... ASME Y14.5M-1994. 2. Dimensions in millimeters. 3. Dimension b is measured at the maximum solder ball diameter, parallel to primary data A. Millimeters Dim Min Max A 1.45 1.65 A1 0.60 0.70 A2 0.85 0.95 A3 0.25 — b 0.65 0.85 D 37.50 BSC D1 35.56 REF e 1.27 BSC E 37.50 BSC E1 35.56 REF Freescale Semiconductor ...
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... Section 1, • Addition of “Note” at bottom of page 5. • Table 13: Note 3. MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor Figure 16. Freescale Part Number Key Table 17. Document Revision History Substantive Change(s) (Table 10) was changed. This change was not previously recorded in this Section 1, “ ...
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... Temporary revisions 0.1 1/2000 — 0 — Initial version MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev Substantive Change(s) 8, Table 9, and Table 10: revision 0.7 of this document incorrectly included values for Table 5, “Power Dissipation” Figure 9, Table 2,Table 10, Table 11 Freescale Semiconductor ...
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... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...