PCX8240VTPU200EZD3 Atmel, PCX8240VTPU200EZD3 Datasheet - Page 11

• Manufacturer Part Number: PCX8240VTPU200EZD3
• Description: IC MPU 32BIT 200MHZ 352TBGA
• Manufacturer: Atmel

Specifications of PCX8240VTPU200EZD3

• Processor Type: PowerPC 603e 32-Bit RISC
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

2149A–HIREL–05/02
Figure 5 depicts the die junction-to-ambient thermal resistance for four typical cases:
1. A heat sink is not attached to the TBGA package and there exists high board-
2. A heat sink is not attached to the TBGA package and there exists low board-
3. A heat sink (e.g. ChipCoolers #HTS255-P) is attached to the TBGA package and
4. A heat sink (e.g. ChipCoolers #HTS255-P) is attached to the TBGA package and
Figure 5. Die Junction-to-Ambient Resistance
level thermal loading of adjacent components.
level thermal loading of adjacent components.
there exists high board-level thermal loading of adjacent components.
there exists low board-level thermal loading of adjacent components.
18
16
14
12
10
8
6
4
2
0
0.5
Airflow Velocity (m/s)
1
No heat sink and high thermal board–level loading of
adjacent components
No heat sink and low thermal board–level loading of
adjacent components
Attached heat sink and high thermal board–level loading
of adjacent components
Attached heat sink and low thermal board–level loading
of adjacent components
1.5
2
PC8240
2.5
11