PCX8240VTPU200EZD3 Atmel, PCX8240VTPU200EZD3 Datasheet - Page 14

• Manufacturer Part Number: PCX8240VTPU200EZD3
• Description: IC MPU 32BIT 200MHZ 352TBGA
• Manufacturer: Atmel

Specifications of PCX8240VTPU200EZD3

• Processor Type: PowerPC 603e 32-Bit RISC
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

Heat Sink Selection Example
14
PC8240
The board designer can choose between several types of thermal interface. Heat sink
adhesive materials should be selected based upon high conductivity, yet adequate
mechanical strength to meet equipment shock/vibration requirements. There are several
commercially-available thermal interfaces and adhesive materials provided by the fol-
lowing vendors:
For preliminary heat sink sizing, the die-junction temperature can be expressed as
follows:
T
Where:
T
T
T
P
During operation the die-junction temperatures (T
value specified in Table. The temperature of the air cooling the component greatly
depends upon the ambient inlet air temperature and the air temperature rise within the
electronic cabinet. An electronic cabinet inlet-air temperature (T
40 C. The air temperature rise within a cabinet (T
The thermal resistance of the thermal interface material (
Assuming a T
tion (P
Die-junction temperature: T
For preliminary heat sink sizing, the heat sink base-to-ambient thermal resistance is
needed from the heat sink manufacturer.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances
are a common figure-of-merit used for comparing the thermal performance of various
microelectronic packaging technologies, one should exercise caution when only using
this metric in determining thermal management because no single parameter can ade-
quately describe three-dimensional heat flow.
JC
INT
SA
Dow-Corning Corporation
Dow-Corning Electronic Materials
PO Box 0997
Midland, MI 48686-0997
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4014
Thermagon Inc.
3256 West 25th Street
Cleveland, OH 44109-1668
Loctite Corporation
1001 Trout Brook Crossing
Rocky Hill, CT 06067-3910
J
J
A
R
D
= T
is the die-junction temperature.
is the inlet cabinet ambient temperature.
is the air temperature rise within the computer cabinet.
is the power dissipated by the device.
is the junction-to-case thermal resistance.
is the heat sink base-to-ambient thermal resistance.
is the adhesive or interface material thermal resistance.
A
D
) of 5.0 watts, the following expression for T
+ T
R
+ (
A
of 30 C, a T
JC
+
INT
+
R
J
SA
= 30 C + 5 C + (1.8 C/W + 1.0 C/W +
of 5 C, a TBGA package
) x P
D
800-248-2481
Internet: www.dow.com
781-935-4850
Internet: www.chomerics.com
888-246-9050
Internet: www.thermagon.com
860-571-5100
Internet: www.loctite.com
J
R
) should be maintained less than the
J
) may be in the range of 5 to 10 C.
is obtained:
JC
= 1.8, and a power consump-
INT
) is typically about 1 C/W.
A
) may range from 30 to
SA
) x 5.0W
2149A–HIREL–05/02