Z0840004PSC Zilog, Z0840004PSC Datasheet - Page 76

• Manufacturer Part Number: Z0840004PSC
• Description: IC 4MHZ Z80 NMOS CPU 40-DIP
• Manufacturer: Zilog

Specifications of Z0840004PSC

• Processor Type: Z80
• Features: NMOS
• Speed: 4MHz
• Voltage: 5V
• Mounting Type: Through Hole
• Package / Case: 40-DIP (0.620", 15.75mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ZiLOG
4. Storage/Unpacking Caution
5. Soldering
6. Desoldering
It is important that the above precautions are followed to ensure integrity of the packages.
ZAC03-0004
The plastic body of a surface mount product may be subjected to high temperatures during the
printed circuit board assembly operation. Any moisture that may be present in the plastic may
expand and damage the unit. Therefore, it is very important that the surface mount IC be dry
before the printed circuit board operation begins.
ZiLOG assures that the unit is thoroughly dry before final packing for shipment. The units are
shipped in a "dry pack" envelope designed to keep moisture away from the IC's. The user
should carefully observe the following practices to assure that the units remain moisture free at
the time of the printed circuit board soldering operation:
Recommended surface mount profile is as follows:
Parts removed due to board assembly problems or suspected failure.
If boxed-in type desoldering fixture is used, the following are recommended operating
parameters:
Do not open the dry pack until you are ready to solder. Product may be exposed to ambient
conditions of 30C/60%RH (or less) for no more than 168 hours. This corresponds to a
moisture sensitivity level of 3.
Unopened dry packs may be stored at <40
When the dry pack must be opened for a short period of time (such as for incoming
inspection) it should be resealed as soon as possible, ensuring that the desiccant remains
inside the dry pack. Resealing should be done with heat seal for best closure of the bag.
If the units have been exposed to more than 168 hours at ambient conditions of
30C/60%RH(or less) or if the humidity indicator card in the bag shows humidity above
20%, devices should be baked for 8 hours at 125
Maximum 3
Maximum 220
Minimum 1 min. cool down from peak temp. to 50
Dwell Time: 1 min. max.
Package Temp: 220
o
C/sec. ramp up.
o
C peak temp.
o
C max.
o
C/90% RH.
o
C, before board soldering.
o
C.
2002 Quality and Reliability Report
6-3