Z0840004PSC Zilog, Z0840004PSC Datasheet - Page 95
Z0840004PSC
Manufacturer Part Number
Z0840004PSC
Description
IC 4MHZ Z80 NMOS CPU 40-DIP
Manufacturer
Zilog
Datasheet
1.Z0840004PSC.pdf
(98 pages)
Specifications of Z0840004PSC
Processor Type
Z80
Features
NMOS
Speed
4MHz
Voltage
5V
Mounting Type
Through Hole
Package / Case
40-DIP (0.620", 15.75mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
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Part Number
Manufacturer
Quantity
Price
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Part Number:
Z0840004PSC
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ZILOG
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Part Number:
Z0840004PSC
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Part Number:
Z0840004PSC (Z80CPU)
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Part Number:
Z0840004PSC(Z80CPU)
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ZiLOG
ZAC03-0004
TERM
Oxynitride:
P:
PDIP:
PE:
PECVD:
PGA:
PLCC:
PM:
POA:
PPM:
PPOT:
PROM:
PSG:
Package:
Photolithography:
Photomask:
Photoresist:
Plasma ash:
Plasma deposition:
Plasma etch:
Poly:
DEFINITION
A plasma deposited passivation or interlayer dielectric film
consisting of silicon, oxygen, and nitrogen.
Phosphorous.
Plastic Dual In-Line Package.
Product Engineer.
Plasma Enhanced Chemical Vapor Deposition.
Pin Grid Array (package).
Plastic Leaded Chip Carriers.
Procedural Manual that contains ZiLOG’s policies and procedures.
Point of Acceptance.
PPM Quality Data, Parts per Million defective; 1000 PPM = 0.1
percent defective.
Pressure Pot.
Programmable Read Only Memory.
Phosphosilicate Glass. A glass containing phosphorus (in the form
of P
The container used to hold an active semiconductor device.
The portion of the process involving the use of light sensitive
photoresist material for layer definition.
(1) A patterned chrome on glass photographic plate used to transfer
a pattern to photo-resist in dry masking. (2) A process segment
involving the patterning of a given layer by use of a photomask.
A light sensitive polymer material which is used as a mask for
etching and ion implant steps. See also Negative and Positive
Photoresist.
A process using a gas transformed by an RF field into a reactive
plasma.
Deposition of thin films using gaseous reactants in the presence of
a plasma for lower temperatures.
An etching process using a gas transformed by an RF field into a
reactive plasma.
Polycrystalline silicon made up of many tiny crystals (as opposed
to single crystal silicon.
2
0
5
). LTO, Pyrox and Pyroglass are all types of PSG.
2002 Quality and Reliability Report
11- 6