Z0840004PSC Zilog, Z0840004PSC Datasheet - Page 98

• Manufacturer Part Number: Z0840004PSC
• Description: IC 4MHZ Z80 NMOS CPU 40-DIP
• Manufacturer: Zilog

Specifications of Z0840004PSC

• Processor Type: Z80
• Features: NMOS
• Speed: 4MHz
• Voltage: 5V
• Mounting Type: Through Hole
• Package / Case: 40-DIP (0.620", 15.75mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ZiLOG
ZAC03-0004
TERM
UV:
V/I:
Visual:
VLSI:
VQFP:
Vt:
Wafer:
Wafer flat:
Waterfall Guardbanding: The technique of testing a circuit at different levels of the
Wet masking:
Wet etch:
Wire bonding:
ZD:
ZEPI:
ZUS:
DEFINITION
Ultra Violet.
A monitor measuring voltage and current between probes applied
to a semiconductor layer. Measures layer resistivity.
A check of process quality by examination of wafers under a light
microscope.
Very Large Scale Integration.
Very small Quad Flat Pack package.
Transistor threshold voltage. Voltage at which the transistor turns
on.
A thin piece of silicon sliced from a cylinder shaped crystal. It is
polished so that the surface is like a mirror. It is most commonly
found in 4, 5, and 6-inch diameters. The wafer is the base material
for most of the world’s integrated circuits.
A flat area ground onto the original silicon ingot from which the
wafers are sliced. Gives crystallographic orientation.
manufacturing process, to insure above marginal product
performance and compliance.
Process segment following “dry masking” in which the wafer,
covered with the resist pattern, is etched to transfer the resist
pattern to the wafer. The resist is then removed (includes wet
and/or plasma etching).
Etching in a liquid acid or solution.
The process of connecting thin wires from the chip’s bond pads to
the package lead. (This is done at assembly.)
Zero Defects.
ZiLOG Electronics Philippines, Inc.
ZiLOG Corporate Headquarters, San Jose, California.
2002 Quality and Reliability Report
11- 9