FW80960VH100 Intel, FW80960VH100 Datasheet - Page 35

• Manufacturer Part Number: FW80960VH100
• Description: IC MPU I960VH 3V 100MHZ 324-BGA
• Manufacturer: Intel

Specifications of FW80960VH100

• Rohs Status: RoHS non-compliant
• Processor Type: i960
• Features: VH suffix, 32-Bit, 16K Cache
• Speed: 100MHz
• Voltage: 3V
• Mounting Type: Surface Mount
• Package / Case: 324-BGA
• Other names: 820682

3.2.1.3
3.2.2
Preliminary Datasheet
Table 14. 324-Lead PBGA Package Thermal Characteristics
Thermal Resistance
The thermal resistance value for the case-to-ambient,
solution’s thermal performance.
Thermal Analysis
Table 14
without a heat sink.
To calculate T
T
Compute P by multiplying I
Junction temperature (T
T
Similarly, when T
follows:
T
The
airflow.
Without Heatsink
NOTE:
1. This table applies to a PBGA device soldered directly onto a board.
A
JC
JA
J
C
JC
CA
= T
= T
= T
(thermal resistance from junction to case) using the following equation:
=
(Junction-to-Case)
(Case-to-Ambient)
JA
C
A
C
JC
+ P (
(Junction-to-Ambient) for this package is currently estimated at 26.54° C/Watt with no
- P (
+ P (
lists the case-to-ambient thermal resistances of the 80960VH for different air flow rates
+
Parameter
CA
A
CA
JC
CA
, the maximum ambient temperature to conform to a particular case temperature:
)
)
A
)
is known, the corresponding case temperature (T
J
) is commonly used in reliability calculations. T
CC
and V
25.18
Thermal Resistance — °C/Watt
1.36
(0)
0
JA
CC
. Values for
(0.50)
20.30
1.36
100
JC
JC
Airflow — ft./min (m/sec)
CA
and
(1.01)
18.29
1.36
, is used as a measure of the cooling
200
CA
are given in
CA
(2.03)
16.57
C
1.36
400
) can be calculated as
J
can be calculated from
Table
(3.04)
15.55
1.36
600
14.
80960VH
(4.06)
14.75
1.36
800
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