IDTSTAC9753AXNAED1XR IDT, Integrated Device Technology Inc, IDTSTAC9753AXNAED1XR Datasheet - Page 100
IDTSTAC9753AXNAED1XR
Manufacturer Part Number
IDTSTAC9753AXNAED1XR
Description
IC CODEC AC'97 MIC/JACK 32-QFN
Manufacturer
IDT, Integrated Device Technology Inc
Type
Audio Codec '97r
Datasheet
1.IDTSTAC9752AXNAED1XR.pdf
(106 pages)
Specifications of IDTSTAC9753AXNAED1XR
Resolution (bits)
20 b
Number Of Adcs / Dacs
2 / 2
Sigma Delta
Yes
S/n Ratio, Adcs / Dacs (db) Typ
85 / 92
Voltage - Supply, Analog
3.14 V ~ 3.47 V; 4.75 V ~ 5.25 V
Voltage - Supply, Digital
3.14 V ~ 3.47 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
32-QFN
Single Supply Voltage (typ)
3.3/5V
Single Supply Voltage (min)
3.135V
Single Supply Voltage (max)
3.465/5.25V
Package Type
VFQFPN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
STAC9753AXNAED1XR
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IDT™
AC’97 2.3 CODECS WITH STEREO MICROPHONE & UNIVERSAL JACK
STAC9752A/9753A
AC’97 2.3 CODECS WITH STEREO MICROPHONE & UNIVERSAL JACK
13.3. PC Board Recommendations for 32-pad QFN Package
0.50 mm typical
NOTES:
1. Oblong pad is preferred geometry.
2. Oblong pad may be replaced with Rectangular pad of the same overall
3. Oblong pad may be replaced with Bullet pad of the same overall dimensions. If
4. Solderpaste shall be oblong pad regardless of the pad geometry. Solderpaste
5. Recommended solderpaste stencil thickness is 0.127 mm, electropolished.
6. Soldermask is to be 1 mm larger in X- and Y-dimensions.
dimensions.
a Bullet pad is used, flat shall be to the outside.
opening shall be the same dimensions as pad detail.
2.375 mm
4.75 mm
SUGGESTED FOOTPRINT
Figure 28. Recommended PCB Layout for 32-pad QFN Package
1
8
32
16
2.375 mm
24
4.75 mm
100
0.375 mm
PAD DETAIL
0.75 mm
STAC9752A/9753A
0.15 mm
0.30 mm
PC AUDIO
V 1.5 1206
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