SE95D NXP Semiconductors, SE95D Datasheet
SE95D
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SE95D Summary of contents
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SE95 Ultra high accuracy digital temperature sensor and thermal watchdog Rev. 07 — 2 September 2009 1. General description The SE95 is a temperature-to-digital converter using an on-chip band gap temperature sensor and Sigma Delta analog-to-digital conversion technique. The device ...
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... I Industrial controllers 4. Ordering information Table 1. Ordering information Type Package number Temperature range SE95D +125 C SE95DP +125 C SE95U +125 C SE95_7 Product data sheet Ultra high accuracy digital temperature sensor and thermal watchdog 1 C from +100 C Name Description SO8 plastic small outline package; 8 leads; body width 3.9 mm TSSOP8 plastic thin shrink small outline package ...
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... Rev. 07 — 2 September 2009 OTP Conf Temp Tos INTERRUPTION Thyst LOGIC REGISTER BANK 1 4 GND 1 SDA SCL 2 SE95DP 3 OS GND 4 002aac536 Fig 3. Pin configuration for TSSOP8 © NXP B.V. 2009. All rights reserved. SE95 002aae892 8 V ...
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... NXP Semiconductors Table 2. Symbol Functional description 7.1 General operation The SE95 uses the on-chip band gap sensor to measure the device temperature with a resolution of 0.03125 C and stores the 13-bit two’s complement digital data, resulting from 13-bit analog to digital conversion, into register Temp. Register Temp can be read at any time by a controller on the I conversion in progress during the read operation ...
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... NXP Semiconductors In OS interrupt mode, the OS output is used for thermal interruption. When the device is powered-up, the OS output is first activated only when Temp exceeds T active indefinitely until being reset by a read of any register. Once the OS output has been activated by crossing T below T register ...
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... NXP Semiconductors 7.2 OS output and polarity The OS output is an open-drain output and its state represents results of the device watchdog operation as described in external pull-up resistor is needed. The resistor should be as large as possible 200 minimize the Temp reading error due to internal heating by the high OS sinking current ...
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... NXP Semiconductors 7.5 Shutdown mode The device operation mode is selected by programming bit SHUTDOWN of register Conf. Setting bit SHUTDOWN to logic 1 will put the device into shutdown mode. Resetting bit SHUTDOWN to logic 0 will return the device to normal mode. In shutdown mode, the device draws a small current of approximately 7.5 A and the power dissipation is minimized ...
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... NXP Semiconductors false alert if the address 0Ch is sent and cannot be active on the I used. Consider using the SE98 since it supports SMBus ARA as well as time-out features and provides 1 C accuracy. Table 4. MSB 1 8.2 Register list The SE95 contains 7 data registers. The registers can be 1 byte or 2 bytes wide, and are defi ...
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... NXP Semiconductors At power-up, the pointer value is preset to logic 0 for register Temp; users can then read the temperature without specifying the pointer byte. 8.4 Configuration register The Configuration (Conf) register is a read/write register and contains an 8-bit non-complement data byte that is used to configure the device for different operating conditions ...
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... NXP Semiconductors When reading register Temp, all 16 bits of the two data bytes (MSByte and LSByte) must be collected and then the two’s complement data value according to the desired resolution must be selected for the temperature calculation. two’s complement data value, data value. ...
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... NXP Semiconductors Obviously, for 9-bit Temp data application in replacing the industry standard LM75, just use only 9 MSB bits of the two bytes and disregard 7 LSB of the LSByte. The 9-bit Temp data with 0.5 C resolution of the SE95 is defined exactly in the same way as for the standard LM75 and it is here similar to the Tos and Thyst registers ...
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... NXP Semiconductors 8.7 Protocols for writing and reading the registers The communication between the host and the SE95 must follow the rules strictly as defined by the I operations are illustrated in 1. Before a communication, the I and SDA lines must both be released by all devices on the bus, and they become HIGH by the bus pull-up resistors ...
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... NXP Semiconductors SCL SDA device address START acknowledge Fig 5. Write configuration register (1-byte data SCL SDA device address START 1 2 SCL (cont.) SDA (cont device address Fig 6. Read configuration register including pointer byte (1-byte data SCL SDA START Fig 7. ...
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... NXP Semiconductors 1 SCL SDA S 1 START 1 SCL (cont.) SDA (cont.) D7 Fig 8. Write Tos or Thyst register (2-byte data SCL SDA device address START SCL (cont) SDA (cont device address Fig 9. Read Temp, Tos or Thyst register including pointer byte (2-byte data SCL SDA ...
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... NXP Semiconductors 9. Limiting values Table 15. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol I(SCL) V I(SDA) V I(A0) V I(A1) V I(A2) I I(PIN) I O(OS) V O(OS) V ESD T stg T j 10. Recommended operating conditions Table 16. Symbol amb SE95_7 Product data sheet Ultra high accuracy digital temperature sensor and thermal watchdog ...
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... NXP Semiconductors 11. Static characteristics Table 17. Static characteristics +125 C; unless otherwise specified. CC amb Symbol Parameter T temperature accuracy acc T temperature resolution res t temperature conversion time conv(T) I supply current CC V HIGH-level input voltage IH V LOW-level input voltage IL V hysteresis of input voltage I(hys) ...
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... NXP Semiconductors 12. Dynamic characteristics Table 18. Dynamic characteristics +125 C; unless otherwise specified. CC amb Symbol Parameter T SCL clock period CLK t HIGH period of the SCL clock (SCL)H t LOW period of the SCL clock (SCL)L t hold time (repeated) START condition HD;STA t data set-up time SU ...
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... NXP Semiconductors 13. Performance curves 25 I CC( 3 Fig 12. Shutdown supply current as a function of temperature 300 200 100 Fig 14. Typical normal I C-bus inactive supply current as a function of temperature 25 t conv(T) (ms Fig 16. Typical conversion time as a function of temperature SE95_7 Product data sheet ...
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... NXP Semiconductors 14. Application information The SE95 is sensitive to power supplies with ramp-up time 2 ms and could NACK or hang the I supplies have a >2 ms ramp-up time. If the power supply ramp-up time is 2 ms, use an RC network with R = 300 the ramp-up time. The 10 F capacitor is the same as the bypass capacitor that is typically used to prevent fl ...
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... NXP Semiconductors 15. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 21. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 17. Abbreviations Table 21. Acronym ADC ESD HBM 2 I C-bus I/O LSB LSByte MM MSB MSByte OTP ...
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... NXP Semiconductors 18. Revision history Table 22. Revision history Document ID Release date SE95_7 20090902 • Modifications: Figure 1 “Block diagram of • Section 14 “Application – Added first paragraph – Figure 18 “Typical application circuit” • Added soldering information • Added SE95_6 20090604 SE95_5 20071213 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 7.1 General operation . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 OS output and polarity . . . . . . . . . . . . . . . . . . . 6 7.3 OS comparator and interrupt modes . . . . . . . . 6 7.4 OS fault queue . . . . . . . . . . . . . . . . . . . . . . . . . 6 7 ...