ISP1362BDFA ST-Ericsson Inc, ISP1362BDFA Datasheet - Page 142

IC USB OTG CONTROLLER 64-LQFP

ISP1362BDFA

Manufacturer Part Number
ISP1362BDFA
Description
IC USB OTG CONTROLLER 64-LQFP
Manufacturer
ST-Ericsson Inc
Datasheet

Specifications of ISP1362BDFA

Controller Type
USB 2.0 Controller
Interface
Parallel/Serial
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Supply
-
Other names
568-1219
ISP1362BD,151
ISP1362BD-S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ISP1362BDFA
Manufacturer:
STE
Quantity:
5
Part Number:
ISP1362BDFA
Manufacturer:
ST-Ericsson Inc
Quantity:
10 000
NXP Semiconductors
ISP1362_5
Product data sheet
21.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 160. SnPb eutectic process (from J-STD-020C)
Table 161. Lead-free process (from J-STD-020C)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 160
and
Figure
161
41.
Rev. 05 — 8 May 2007
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
41) than a PbSn process, thus
Single-chip USB OTG Controller
220
220
350
> 2000
260
245
245
© NXP B.V. 2007. All rights reserved.
ISP1362
141 of 152

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