PKB4513PINBLC Ericsson Power Modules, PKB4513PINBLC Datasheet - Page 2

DC/DC Switching Controllers DC/DC CONV in 36-60V output 12V 4A 48W

PKB4513PINBLC

Manufacturer Part Number
PKB4513PINBLC
Description
DC/DC Switching Controllers DC/DC CONV in 36-60V output 12V 4A 48W
Manufacturer
Ericsson Power Modules
Datasheet

Specifications of PKB4513PINBLC

Number Of Outputs
1
Output Voltage
12 V
Output Current
4 A
Output Power
48 W
Switching Frequency
230 KHz to 270 KHz
Mounting Style
Screw
Package / Case
Eighth Brick
Maximum Operating Temperature
+ 120 C
Minimum Operating Temperature
- 40 C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
E
Prepared (also subject responsible if other)
MICJOHH
Approved
PKB 4513 Direct Converters
Input 48 V, Output 4 A / 48 W
Ordering Information
Product program
PKB4513PINB
Product number and Packaging
Options
Input voltage
Remote Control logic
Lead length
Delivery package information
Options
n
n
n
n
Example a extend input voltage range, negative logic, short pin
product with tray packaging would be PKB4513PINBOVLC/B.
* Standard variant (i.e. no option selected).
General Information
Reliability
The Mean Time Between Failure (MTBF) is calculated at
full output power and an operating ambient temperature
(T
and Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses Telcordia SR332.
Predicted MTBF for the series is:
-
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in ICT equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
1
2
3
4
A
) of +40°C, which is a typical condition in Information
1.6 million hours according to Telcordia SR332, issue
1, Black box technique.
PKB 4513PINB n
Description
OV
L
LC
/B
/C
36-60V*
30-60V
Negative, non latching
protections OTP, OVP*
Negative, latching OTP, OVP
2.79 mm*
Tray
Tape and Reel
Output
12 V, 4 A / 48 W
1
n
2
n
3
n
4
n
ο
1
n
ο
Checked
2
n
ο
3
n
ο
4
Ericsson Internal
PRODUCT SPECIFICATION
No.
1/1301-BMR 636 31/53C45 Uen
Date
2010-02-09
Compatibility with RoHS requirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
-
-
-
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use
to boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson Power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose
(including, but not limited to, use in life support
applications, where malfunctions of product can cause
injury to a person’s health or life).
© Ericsson AB 2009
The information and specifications in this technical
specification is believed to be correct at the time of
publication. However, no liability is accepted for
inaccuracies, printing errors or for any consequences
thereof. Ericsson AB reserves the right to change the
contents of this technical specification at any time without
prior notice.
Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
Technical Specification
EN/LZT 146 407 R2A February 2010
© Ericsson AB
Rev
A
Reference
2 (4)
2

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