DS26303L-120+ Maxim Integrated Products, DS26303L-120+ Datasheet - Page 79
DS26303L-120+
Manufacturer Part Number
DS26303L-120+
Description
IC LIU E1/T1/J1 3.3V 144-ELQFP
Manufacturer
Maxim Integrated Products
Type
Line Interface Units (LIUs)r
Datasheet
1.DS26303L-120.pdf
(101 pages)
Specifications of DS26303L-120+
Number Of Drivers/receivers
8/8
Protocol
T1/E1/J1
Voltage - Supply
3.135 V ~ 3.465 V
Mounting Type
Surface Mount
Package / Case
144-LQFP Exposed Pad, 144-eLQFP, 144-HLQFP
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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9 THERMAL CHARACTERISTICS
Table 9-1. Thermal Characteristics
Power Dissipation with RIMPMS = 0 (Notes 1, 2)
Power Dissipation with RIMPMS = 1(Notes 1, 2)
Ambient Temperature (Note 3)
Junction Temperature
Theta-JA (θ
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
RCLK1-n = TCLK1-n = 1.544MHz.
Power dissipation with all ports active, TTIP and TRIN driving a 25 Ω load, for an all-ones data density.
The package is mounted on a four-layer JEDEC standard test board.
Theta-JA ( θ
board and the die attach pad is soldered to the test board.
Theta-JA ( θ
board and the die attach pad is not soldered to the test board.
JA
) in Still Air for 144-Pin LQFP with Exposed Pad
JA
JA
) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test
) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test
PARAMETER
DS26303: 3.3V, T1/E1/J1, Short-Haul, Octal Line Interface Unit
79 of 101
MIN
-40
(Note 4)
(Note 5)
+21.3
TYP
29.0
0.7
0.9
MAX
+125
1.40
1.65
+85
UNITS
°C/W
°C
°C
W
W
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