AAT1230ITP-T1 Analogic Tech, AAT1230ITP-T1 Datasheet - Page 15
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AAT1230ITP-T1
Manufacturer Part Number
AAT1230ITP-T1
Description
Switching Converters, Regulators & Controllers 18V 100mA Step-Up Converter
Manufacturer
Analogic Tech
Datasheets
1.AAT1230ITP-T1.pdf
(21 pages)
2.AAT1230ITP-T1.pdf
(21 pages)
3.AAT1230ITP-T1.pdf
(21 pages)
4.AAT1230ITP-T1.pdf
(21 pages)
Specifications of AAT1230ITP-T1
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AAT1230ITP-T1
Manufacturer:
TYCO
Quantity:
4 123
Part Number:
AAT1230ITP-T1
Manufacturer:
ANALOGIX
Quantity:
20 000
PCB Layout Guidelines
Boost converter performance can be adversely
affected by poor layout. Possible impact includes
high input and output voltage ripple, poor EMI per-
formance, and reduced operating efficiency. Every
attempt should be made to optimize the layout in
order to minimize parasitic PCB effects (stray
resistance, capacitance, inductance) and EMI cou-
pling from the high frequency SW node.
A suggested PCB layout for the AAT1230/1230-1
boost converter is shown in Figures 3 and 4. The
following PCB layout guidelines should be consid-
ered:
1. Minimize the distance from Capacitor C1 and
1230.2006.10.1.4
C2 negative terminal to the PGND pins. This
is especially true with output capacitor C2,
which conducts high ripple current from the
output diode back to the PGND pins.
Figure 3: AAT1230/1230-1 Evaluation
Board Top Side.
2. Place the feedback resistors close to the output
3. Minimize the distance between L1 to D1 and
4. Maintain a ground plane and connect to the IC
5. Consider additional PCB area on D1 cathode
6. When using the TDFN33-12 package, connect
terminals. Route the output pin directly to resis-
tor R1 to maintain good output regulation. R3
should be routed close to the output GND pin,
but should not share a significant return path
with output capacitor C2.
switching pin SW; minimize the size of the PCB
area connected to the SW pin.
RTN pin(s) as well as the GND terminals of C1
and C2.
to maximize heatsinking capability. This may
be necessary when using a diode with a high
V
paddle to SW pin or leave floating. Do not con-
nect to RTN/GND conductors.
Figure 4: AAT1230/1230-1 Evaluation
18V 100mA Step-Up Converter
F
and/or thermal resistance.
Board Bottom Side.
AAT1230/1230-1
15