TEA1522PN NXP Semiconductors, TEA1522PN Datasheet
TEA1522PN
Specifications of TEA1522PN
Related parts for TEA1522PN
TEA1522PN Summary of contents
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TEA152x family SMPS ICs for low-power systems Rev. 02 — 25 January 2006 1. General description The TEA152x family STARplug Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains implemented ...
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Philips Semiconductors 3. Applications Chargers Adapters Set Top Box (STB) DVD CD(R) TV/monitor standby supplies PC peripherals Microcontroller supplies in home applications and small portable equipment, etc. 4. Quick reference data Table 1: Symbol V drain R DSon V CC ...
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Philips Semiconductors 5. Ordering information Table 2: Ordering information Type number Package Name Description TEA1520P DIP8 plastic dual in-line package; 8-leads (300 mil) TEA1521P TEA1522P TEA1523P TEA1520T SO14 plastic small outline package; 14-leads; body width 3.9 mm TEA1521T TEA1522T 6. ...
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Philips Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Pin configuration DIP8 7.2 Pin description Table 3: Symbol V CC GND GND GND GND RC REG AUX GND GND SOURCE n.c. n.c. DRAIN TEA152X_FAM_2 Product data sheet ...
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Philips Semiconductors 8. Functional description The TEA152x family is the heart of a compact flyback converter, with the IC placed at the primary side. The auxiliary winding of the transformer can be used for indirect feedback to control the isolated ...
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Philips Semiconductors 8.4 Valley switching A new cycle is started when the primary switch is switched on (see certain time (determined by the oscillator voltage RC and the internal regulation level), the switch is turned off and the secondary stroke ...
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Philips Semiconductors Figure 5 the output voltage V the factor N (determined by the turns ratio of the transformer). system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on losses to a minimum. ...
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Philips Semiconductors 8.9 Overtemperature protection An accurate temperature protection is provided in the device. When the junction temperature exceeds the thermal shutdown temperature, the IC stops switching. During thermal protection, the IC current is lowered to the start-up current. The ...
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Philips Semiconductors 9. Limiting values Table 4: In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground; positive currents flow into the device; pins V current driven and pins REG and AUX ...
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Philips Semiconductors 10. Thermal characteristics Table 5: Symbol R th(j-a) [1] Thermal resistance R printed-circuit board. See the TEA152x application notes for details. 11. Characteristics Table overtemperature; all voltages are measured with respect to ...
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Philips Semiconductors Table overtemperature; all voltages are measured with respect to ground; currents are amb positive when flowing into the IC; unless otherwise specified. Symbol V REG(clamp) Valley switching dV/dt valley f valley t ...
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Philips Semiconductors 12. Application information mains R1 Fig 6. Primary sensed application; configuration for TEA152xP Further application information can be found in the TEA152x application notes. 13. Test information 13.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 ...
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Philips Semiconductors 14. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...
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Philips Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...
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Philips Semiconductors 15. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However completely safe you must take normal precautions appropriate to handling integrated circuits. 16. Soldering 16.1 Introduction This text gives a very ...
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Philips Semiconductors Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range ...
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Philips Semiconductors 16.3.3 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 ...
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Philips Semiconductors 17. Abbreviations Table 8: Acronym BiCMOS DMOS ESR EZ-HV SOI FET PWM SMPS SOPS 18. Revision history Table 9: Revision history Document ID Release date TEA152X_FAM_2 20060125 • Modifications: The format of this data sheet has been redesigned ...
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Philips Semiconductors 19. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 24. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...