ISP1301BS-T ST-Ericsson Inc, ISP1301BS-T Datasheet

no-image

ISP1301BS-T

Manufacturer Part Number
ISP1301BS-T
Description
IC USB OTG TRANSCEIVER 24-HVQFN
Manufacturer
ST-Ericsson Inc
Type
Transceiverr
Datasheet

Specifications of ISP1301BS-T

Number Of Drivers/receivers
1/1
Protocol
USB 2.0
Voltage - Supply
2.7 V ~ 4.5 V
Mounting Type
Surface Mount
Package / Case
24-VQFN Exposed Pad, 24-HVQFN, 24-SQFN, 24-DHVQFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-1881-2
ISP1301BS,118
Dear customer,
As from August 2
ST-NXP Wireless.
As a result, the following changes are applicable to the attached document.
If you have any questions related to the document, please contact our nearest sales office.
Thank you for your cooperation and understanding.
ST-NXP Wireless
Company name - Philips Semiconductors is replaced with ST-NXP Wireless.
Copyright - the copyright notice at the bottom of each page “© Koninklijke Philips
Electronics N.V. 200x. All rights reserved”, shall now read: “© ST-NXP Wireless 200x -
All rights reserved”.
Web site -
http://www.stnwireless.com
Contact information - the list of sales offices previously obtained by sending an email
to sales.addresses@www.semiconductors.philips.com, is now found at
http://www.stnwireless.com
http://www.semiconductors.philips.com
nd
2008, the wireless operations of NXP have moved to a new company,
IMPORTANT NOTICE
under Contacts.
is replaced with
www.stnwireless.com

Related parts for ISP1301BS-T

ISP1301BS-T Summary of contents

Page 1

IMPORTANT NOTICE Dear customer from August 2 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless result, the following changes are applicable to the attached document. ● Company name - Philips ...

Page 2

ISP1301 Universal Serial Bus On-The-Go transceiver Rev. 03 — 21 February 2006 1. General description The ISP1301 is a Universal Serial Bus (USB) On-The-Go (OTG) transceiver device that is fully compliant with Universal Serial Bus Specification Rev. 2.0 and On-The-Go ...

Page 3

... Mobile phone Digital camera Personal digital assistant Digital video recorder 4. Ordering information Table 1: Ordering information Type number Package Name Description ISP1301BS HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 ISP1301_3 Product data sheet 0.85 mm Rev. 03 — 21 February 2006 ...

Page 4

... SE0/VM 12 RCV SPEED 8 SUSPEND 4 RESET_N exposed die pad DGND Fig 1. Block diagram ISP1301_3 Product data sheet V VREG3V3 CC(I/ 3.3 V DC-DC REGULATOR ISP1301BS SERIAL CONTROLLER LEVEL SHIFTER USB TRANSCEIVER 17 AGND Rev. 03 — 21 February 2006 USB OTG transceiver BUS CHARGE PUMP 19 V BUS ...

Page 5

... ADR/PSW SDA 2 SCL 3 ISP1301BS 4 RESET_N INT_N 5 SPEED 6 Transparent top view SPEED 6 DGND (exposed INT_N 5 die pad) 4 RESET_N ISP1301BS SCL 3 SDA 2 1 ADR/PSW terminal 1 index area Bottom view Rev. 03 — 21 February 2006 ISP1301 USB OTG transceiver AGND DAT/VP 13 SE0/VM ...

Page 6

Philips Semiconductors 6.2 Pin description Table 2: Symbol ADR/PSW SDA SCL RESET_N INT_N SPEED VREG3V3 SUSPEND OE_N/ INT_N VM VP RCV SE0/VM ISP1301_3 Product data sheet Pin description [1] [2] Pin Type Reset state 1 I/O high-Z 2 I/OD high-Z ...

Page 7

Philips Semiconductors Table 2: Symbol DAT/ AGND ID V BUS CGND V CC(I/O) DGND [1] Symbol names ending with underscore N (for example, NAME_N) indicate active LOW signals. [ input ...

Page 8

Philips Semiconductors 7. Functional description 7.1 Serial controller The serial controller includes the following functions: • C-bus slave interface • Interrupt generator • Mode Control registers • OTG registers • Interrupt related registers • Device identification registers The ...

Page 9

Philips Semiconductors 7.4 ID detector In either active or suspended power mode, the ID detector senses the condition of the ID line and differentiates between the following three conditions: • Pin ID is floating; bit ID_FLOAT = 1 • Pin ...

Page 10

Philips Semiconductors 7.9 Power-On Reset (POR) When will be typically 200 ns. The pulse is started when V PORP The POR function can be explained by viewing dips and ...

Page 11

... Philips Semiconductors ISP1301BS Fig 5. Using external charge pump 7.10.2 SCL and SDA The SCL (serial clock) and SDA (serial data) signals implement a two-wire serial I 7.10.3 RESET_N Active LOW asynchronous reset for all digital logic. Either connect this pin to V power-on reset or apply a minimum LOW pulse for hardware reset. ...

Page 12

... SE0/VM, DAT/VP and RCV pins during the receive comparator or an output from the charge pump. BUS to a voltage of 4 5.25 V, with an output current capability of at least V CC ISP1301BS Rev. 03 — 21 February 2006 USB OTG transceiver C1 C ext C2 ...

Page 13

Philips Semiconductors Table 3: C ext 47 nF 100 nF [1] For output voltage V 7.10.12 V CC(I/O) This pin is an input and sets logic thresholds. It also powers the pads of the following logic pins: • ADR/PSW • ...

Page 14

Philips Semiconductors 8.2 Direct I In direct I communicates with the serial controller through the SCL and SDA lines. The serial controller has a built- this mode, an external I (Status, Control, Interrupt, and so on) through the ...

Page 15

Philips Semiconductors In UART mode, the OTG Controller is allowed to connect a UART to the DAT/VP and SE0/VM pins of the ISP1301. UART mode is entered by setting the UART_EN bit in the Mode Control 1 register. UART mode ...

Page 16

Philips Semiconductors Table 6: USB functional modes: I/O values [1] USB mode Bit DAT_SE0 VP_VM unidirectional 0 bidirectional 0 0 DAT_SE0 unidirectional 1 bidirectional 1 1 [1] Some of the modes and signals are provided to achieve backward compatibility with ...

Page 17

Philips Semiconductors Table 9: Suspend [1] Can be controlled by using either the SUSPEND pin or the SUSPEND_REG bit. Table 10: USB mode DAT_SE0 VP_VM 9.2 Differential receiver Table 11 used in the column heading ...

Page 18

Philips Semiconductors Table 12: USB mode DAT_SE0 DAT_SE0 DAT_SE0 DAT_SE0 DAT_SE0 DAT_SE0 DAT_SE0 DAT_SE0 VP_VM VP_VM VP_VM VP_VM VP_VM VP_VM VP_VM VP_VM [1] Can be controlled by using either the SUSPEND pin or the SUSPEND_REG bit. ISP1301_3 Product data sheet ...

Page 19

Philips Semiconductors 10. Serial controller 10.1 Register map Table 13 Table 13: Serial controller registers Register Width (bits) Vendor ID 16 Product ID 16 Version ID 16 Mode Control 1 8 Mode Control 2 8 OTG Control 8 OTG Status ...

Page 20

Philips Semiconductors Table 16: Version ID register: bit description Bit Symbol VERSIONID[15:0] R 10.1.2 Mode control registers 10.1.2.1 Mode Control 1 register (Set/Clear: 04h/05h) The bit allocation of the Mode Control 1 register is given in Table ...

Page 21

Philips Semiconductors Table 20: Bit 10.1.3 OTG registers 10.1.3.1 OTG Control register (Set/Clear: 06h/07h) Table 21 Table 21: OTG Control register: bit allocation Bit 7 Symbol VBUS_ VBUS_ CHRG DISCHRG Reset ...

Page 22

Philips Semiconductors 10.1.3.2 OTG Status register (Read: 10h) Table 23 Table 23: OTG Status register: bit allocation Bit 7 Symbol B_SESS_ B_SESS_ VLD END Reset 0 Access R Table 24: Bit 10.1.4 Interrupt related registers ...

Page 23

Philips Semiconductors Table 27: Interrupt Latch register: bit allocation Bit 7 Symbol CR_INT BDIS_ ACON Reset 0 Access R/S/C R/S/C Table 28: Bit 10.1.4.3 Interrupt Enable Low register (Set/Clear: 0Ch/0Dh) This register ...

Page 24

Philips Semiconductors Table 31: Interrupt Enable High register: bit allocation Bit 7 Symbol CR_INT BDIS_ ACON Reset 0 Access R/S/C R/S/C Table 32: Bit 10.2 Interrupts Table 26 Table 26 an interrupt ...

Page 25

Philips Semiconductors command to the ISP1301 to assert the DP pull-up. An alternative method is for the A-device transceiver to automatically assert the DP pull-up after detecting an SE0 from the B-device. The sequence of events is: After finishing data ...

Page 26

Philips Semiconductors 11. Clock wake-up scheme The following subsections explain the ISP1301 clock stop timing, events triggering the clock to wake up, and the timing of the clock wake-up. 11.1 Power-down event The clock is stopped when the GLOBAL_PWR_DN bit ...

Page 27

Philips Semiconductors Fig 9. Clock wake- Fig 10. Clock wake- change (1) Fig 11. Clock wake- change (2) Fig 12. Clock wake-up by data line SRP When an event is triggered and the clock ...

Page 28

Philips Semiconductors 2 12. I C-bus protocol For detailed information, refer to The I 2 12.1 I C-bus byte transfer format Table 33: [ Start. [ Acknowledge. [ Stop. 2 12.2 I ...

Page 29

Philips Semiconductors Table 36: Byte Write data K ACK P 12.3.2 Multiple-byte write Figure 13 Table 37: Byte S Device select ACK Register address K ACK Write data K ACK Write data ACK : Write data K ...

Page 30

Philips Semiconductors S device select S device select write data Fig 13. Writing data to the ISP1301 registers 12.4 Read format A read operation can be performed in two ways: • Current address read: to read the ...

Page 31

Philips Semiconductors Fig 14. Current address read 12.4.2 Random address read 12.4.2.1 Single read Figure 15 Table 39: SDA line S Device select ACK Register address K ACK Device select ACK S Read data K No ACK P 12.4.2.2 Multiple ...

Page 32

Philips Semiconductors Table 40: SDA line Read data ACK P S device select wr S device select wr read data Fig 15. Random address read ISP1301_3 Product data sheet Transfer format description for ...

Page 33

Philips Semiconductors 13. Limiting values Table 41: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input/output supply voltage CC(I/O) V input voltage I I latch-up current lu V electrostatic ...

Page 34

Philips Semiconductors 15. Static characteristics Table 43: Static characteristics: supply pins CC(I/O) Symbol Parameter Charge pump disabled V output voltage from internal 3.3 V ...

Page 35

Philips Semiconductors Table 45: Static characteristics: analog I/O pins DP and CC(I/O) Symbol Parameter Input levels V differential input sensitivity DI V differential ...

Page 36

Philips Semiconductors Table 47: Static characteristics: charge pump CC(I/O) Symbol Parameter Current I load current load Voltage V output voltage on pin V O(VBUS) ...

Page 37

Philips Semiconductors 16. Dynamic characteristics Table 48: Dynamic characteristics: reset and clock CC(I/O) Symbol Parameter Reset t external RESET_N pulse width W(RESET_N) Internal clock ...

Page 38

Philips Semiconductors Table 50: Dynamic characteristics: analog I/O pins DP and CC(I/O) otherwise specified. Symbol Parameter t driver enable delay to HIGH PZH ...

Page 39

Philips Semiconductors OE_N/INT_N Fig 20. SIE interface bus turnaround timing Fig 21. Load on pins DP and DM Fig 22. Load on pins DP and DM for enable time and disable time Fig 23. Load on pins VM, SE0/VM, VP, ...

Page 40

Philips Semiconductors Table 51: Characteristics of I/O stages of I Symbol Parameter f SCL clock frequency SCL t hold time for the START condition HD;STA t LOW period of the SCL clock (SCL)L t HIGH period of the SCL clock ...

Page 41

... Fig 25. Application diagram for the OTG Controller with the DAT_SE0 SIE interface V CC(I/ SW1 CC(I/O) SW- C10 0 100 k V ADR/PSW CC(I/ SDA CGND 2 23 SCL RESET_N INT_N SPEED BUS 6 19 ISP1301BS VREG3V3 SUSPEND AGND 8 17 OE_N/INT_N DAT/ RCV SE0/ DGND 0 0.1 F GND USB MINI-AB 2 ...

Page 42

... Fig 26. Application diagram for the OTG Controller with the VP_VM SIE interface V CC(I/ SW1 V SW-PB CC(I/ C10 0 100 ADR/PSW V CC(I/ SDA CGND 23 2 SCL RESET_N C1 0 INT_N SPEED BUS 19 6 ISP1301BS VREG3V3 SUSPEND AGND 17 8 OE_N/INT_N DAT/ SE0/VM RCV DGND 0 0.1 F GND USB MINI-AB 2 RECEPTACLE R7 V ...

Page 43

Philips Semiconductors 18. Package outline HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 0.85 mm terminal 1 index area terminal 1 24 index area ...

Page 44

Philips Semiconductors 19. Soldering 19.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

Page 45

Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

Page 46

Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

Page 47

Philips Semiconductors 22. Revision history Table 54: Revision history Document ID Release date ISP1301_3 20060221 • Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • Updated ...

Page 48

Philips Semiconductors 23. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 49

Philips Semiconductors 28. Tables Table 1: Ordering information . . . . . . . . . . . . . . . . . . . . .2 Table 2: Pin description . . . . . . . ...

Page 50

Philips Semiconductors 29. Figures Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Fig 2. Pin configuration ...

Page 51

Philips Semiconductors 30. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

Page 52

Philips Semiconductors 19.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 44 19.5 Package related soldering information . . . . . . 44 ...

Related keywords