PCA9540BD,112 NXP Semiconductors, PCA9540BD,112 Datasheet
PCA9540BD,112
Specifications of PCA9540BD,112
935276035112
PCA9540BD
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PCA9540BD,112 Summary of contents
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PCA9540B 2-channel I Rev. 04 — 3 September 2009 1. General description The PCA9540B is a 1-of-2 bidirectional translating multiplexer, controlled via the I The SCL/SDA upstream pair fans out to two SCx/SDx downstream pairs, or channels. Only one SCx/SDx ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information +85 C amb Type number Topside Package mark Name PCA9540BD PA9540B SO8 PCA9540BDP 9540B TSSOP8 PCA9540BGD 40B XSON8U 4. Block diagram SD0 SD1 SC0 SC1 SCL SDA Fig 1. PCA9540B_4 Product data sheet Description plastic small outline package; 8 leads; body width 3.9 mm plastic thin shrink small outline package ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 2. Fig 4. 5.2 Pin description Table 2. Symbol SCL SDA V DD SD0 SC0 V SS SD1 SC1 PCA9540B_4 Product data sheet 1 8 SCL SC1 2 7 SDA SD1 PCA9540BD SD0 4 5 SC0 002aae713 Pin configuration for SO8 ...
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... NXP Semiconductors 6. Functional description Refer to 6.1 Device addressing Following a START condition the bus master must output the address of the slave it is accessing. The address of the PCA9540B is shown in Fig 5. The last bit of the slave address defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation ...
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... NXP Semiconductors Table 6.3 Power-on reset When power is applied reset condition until V and the PCA9540B registers and I states (all zeroes), causing all the channels to be deselected. Thereafter, V lowered below 0 reset the device. 6.4 Voltage translation The pass gate transistors of the PCA9540B are constructed such that the V ...
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... NXP Semiconductors Figure 7, we see that V 3 lower so the PCA9540B supply voltage could be set to 3.3 V. Pull-up resistors can then be used to bring the bus voltages to their appropriate levels (see More Information can be found in application note AN262, “PCA954X family of I multiplexers and switches” . ...
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... NXP Semiconductors 7.3 System configuration A device generating a message is a ‘transmitter’, a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see SDA SCL ...
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... NXP Semiconductors 7.5 Bus transactions SDA START condition Fig 12. Write control register SDA START condition Fig 13. Read control register 8. Application design-in information Fig 14. Typical application PCA9540B_4 Product data sheet slave address R/W slave address SDA SDA SCL SCL 2 I C-bus/SMBus master ...
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... NXP Semiconductors 9. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to ground (V Symbol tot T stg T amb [1] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 125 C ...
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... NXP Semiconductors 10. Static characteristics Table 5. Static characteristics +85 C; unless otherwise specified. SS amb See Table 6 for Symbol Parameter Supply V supply voltage DD I supply current DD I standby current stb V power-on reset voltage POR Input SCL; input/output SDA V LOW-level input voltage IL V HIGH-level input voltage ...
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... NXP Semiconductors Table 6. Static characteristics +85 C; unless otherwise specified. SS amb See Table 5 for Symbol Parameter Supply V supply voltage DD I supply current DD I standby current stb V power-on reset voltage POR Input SCL; input/output SDA V LOW-level input voltage IL V HIGH-level input voltage ...
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... NXP Semiconductors 11. Dynamic characteristics Table 7. Dynamic characteristics Symbol Parameter t propagation delay PD f SCL clock frequency SCL t bus free time between a STOP and BUF START condition t hold time (repeated) START HD;STA condition t LOW period of the SCL clock LOW t HIGH period of the SCL clock ...
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... NXP Semiconductors SDA t BUF t LOW SCL t HD;STA P S Fig 15. Definition of timing on the I PCA9540B_4 Product data sheet HD;DAT HIGH SU;DAT 2 C-bus Rev. 04 — 3 September 2009 PCA9540B 2 2-channel I C-bus multiplexer t t HD;STA SU;STA SU;STO Sr 002aaa986 © NXP B.V. 2009. All rights reserved. ...
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... NXP Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 mm 0.5 0.00 0.15 1.9 OUTLINE VERSION IEC SOT996 Fig 18. Package outline SOT996-2 (XSON8U) ...
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... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 19. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Abbreviations Table 10. Acronym CDM ESD HBM 2 I C-bus I/O IC LSB MM POR SMBus PCA9540B_4 Product data sheet ...
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... NXP Semiconductors 15. Revision history Table 11. Revision history Document ID Release date PCA9540B_4 20090903 • Modifications: Added XSON8U package offering (affects information”, PCA9540B_3 20090528 PCA9540B_2 20040929 (9397 750 13731) PCA9540B_1 20040413 (9397 750 12918) PCA9540B_4 Product data sheet Data sheet status Product data sheet Section 2 “ ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Device addressing . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Control register . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2.1 Control register definition . . . . . . . . . . . . . . . . . 4 6.3 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.4 Voltage translation . . . . . . . . . . . . . . . . . . . . . . Characteristics of the I 7 ...