PCA9558PW,118 NXP Semiconductors, PCA9558PW,118 Datasheet - Page 23
![IC I2C SMBUS 8BIT I/O 28TSSOP](/photos/6/52/65262/568-28-tssop_sot361-1_sml.jpg)
PCA9558PW,118
Manufacturer Part Number
PCA9558PW,118
Description
IC I2C SMBUS 8BIT I/O 28TSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.PCA9558PW112.pdf
(27 pages)
Specifications of PCA9558PW,118
Package / Case
28-TSSOP
Applications
PC's, PDA's
Interface
I²C
Voltage - Supply
3 V ~ 3.6 V
Mounting Type
Surface Mount
Logic Family
PCA9558
Number Of Lines (input / Output)
8.0 / 8.0
Propagation Delay Time
21 ns
Operating Supply Voltage
3 V to 3.6 V
Operating Temperature Range
0 C to + 70 C
Input Voltage
5 V
Logic Type
I2C, SMBus
Maximum Clock Frequency
400 KHz
Mounting Style
SMD/SMT
Number Of Input Lines
8.0
Number Of Output Lines
8.0
Output Voltage
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935269433118
PCA9558PW-T
PCA9558PW-T
PCA9558PW-T
PCA9558PW-T
NXP Semiconductors
PCA9558_4
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 14.
Table 15.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 14
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
15
23.
Rev. 04 — 14 April 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
23) than a SnPb process, thus
220
220
8-bit I
350
2
C-bus/SMBus I/O port
> 2000
260
245
245
PCA9558
© NXP B.V. 2009. All rights reserved.
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