LX1992-02W EVAL KIT MICROSEMI, LX1992-02W EVAL KIT Datasheet - Page 10
LX1992-02W EVAL KIT
Manufacturer Part Number
LX1992-02W EVAL KIT
Description
Manufacturer
MICROSEMI
Datasheet
1.LX1992-02W_EVAL_KIT.pdf
(11 pages)
Specifications of LX1992-02W EVAL KIT
Lead Free Status / Rohs Status
Supplier Unconfirmed
Copyright © 2000
Rev. 1.1b, 2005-03-03
DU
LM
A2
H
TM
N
E
8-Pin Miniature Shrink Outline Package (MSOP)
8-Pin Plastic MLP-Micro Exposed Pad
A3
Θ
A
D
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
D
G
C
B
L2
A
A1
L
L2
P
K
P A C K A G E D I M E N S I O N S
Internally Connected
together, but isolated
from all other terminals
Linfinity Microelectronics Division
e
D2
®
Microsemi
K
b
E2
M
L
Note:
D2
1. Dimensions do not include mold flash or
Dim
Dim
A1
A2
A3
E2
L2
D
Θ
A
E
K
b
e
L
G
M
A
B
C
D
H
K
N
P
J
L
protrusions;
0.155mm(.006”) on any side.
shall not include solder coverage.
High Efficiency LED Driver
P
RODUCTION
2.85
2.90
0.25
0.38
0.13
0.40
0.05
4.75
0.80
0.00
0.65
0.15
0.28
2.90
2.90
1.52
1.02
0.20
0.20
MIN
MIN
M
M
0°
0
–
0.65 BSC
0.95 BSC
0.65 BSC
ILLIMETERS
ILLIMETERS
these
3°
MAX
D
3.05
3.10
1.10
0.40
0.64
0.18
0.70
0.15
5.05
MAX
1.00
0.05
0.75
0.25
0.38
3.10
3.10
2.08
1.31
0.60
0.13
12°
ATA
*
shall
S
HEET
0.009
0.015
0.005
0.016
0.002
0.187
Lead dimension
.112
.114
MIN
0.031
0.000
0.025
0.005
0.011
0.114
0.114
0.060
0.040
0.008
0.008
not
MIN
0.025 BSC
0.037 BSC
–
0°
0.025 BSC
0
I
NCHES
I
NCHES
3°
exceed
0.043
0.160
0.025
0.007
0.027
0.006
0.198
MAX
.120
.122
LX1992
0.039
0.002
0.029
0.009
0.015
0.122
0.122
0.082
0.052
0.023
0.005
MAX
12°
*
Page 10