Product Brief
Development Kit
Embedded Computing
Intel
Express Chipset Family Development Kit
Product Overview
The Intel® Core™2 Duo processor and Mobile Intel® 4 Series Express
chipset family development kit provides outstanding flexibility for
developers of embedded applications by offering excellent graphics,
memory and I/O bandwidth, as well as remote asset management
capabilities, storage speed and reliability. The platform addresses
requirements of a broad range of embedded applications such as inter-
active clients, gaming platforms and industrial automation equipment.
The Mobile Intel® 4 Series Express chipset family offers an integrated
graphics engine, DDR3 or DDR2 system memory controller, and
support for Intel® Active Management Technology
Intel® Trusted Execution Technology (Intel® TXT), and Intel® Matrix
Storage Technology.
Intel® Core™2 Duo processor technology integrates two complete
execution cores in one physical package, providing advancements
in simultaneous computing for multi-threaded applications and multi-
tasking environments. Intel’s hafnium-based 45nm Hi-k silicon process
technology enables even more processor performance by doubling
transistor density and increasing cache size by up to 50 percent.
This platform is part of Intel’s comprehensive validation process,
which enables rapid deployment of next-generation platforms to
help developers maximize competitive advantage and minimize
development risks. This and other development kits from Intel provide
a working system with a range of performance options that can be
modified or used immediately for product development, and allow
software vendors to test BIOS and operating system software.
Product Highlights
•Development kits are offered with the Intel Core 2 Duo processors
• Chipset options include:
T9400,
– Intel® GM45 Graphics Memory Controller Hub (GMCH) in a
– Intel® GS45 GMCH in a 25 mm x 27 mm µFC-BGA package and
34 mm x 34 mm µFC-BGA package and Intel® I/O Controller
Hub (ICH) 9M-Enhanced in a 31 mm x 31 mm µ-BGA package
Intel® ICH9M-Enhanced in a 16 mm x 16 mm µ-BGA package
∆
SL9400
®
Core
∆
and SU9400
2
™
2 Duo Processor and Mobile Intel
∆
3
(see Order Information)
1
(Intel® AMT),
• 667, 800 or 1066 MHz FSB
• Intel® Graphics Media Accelerator; PCI Express* graphics support
• Dual-channel memory controller supports either:
Board Peripheral Features
• One (1) single-channel Serial Digital Video Output (SDVO) port
• x16 PCI Express graphics or dual-channel SDVO graphics interface
• Dual-channel 24-bit LVDS interface; BLI and LED backlight support
• One (1) VGA connector
• High-Definition Multimedia Interface (HDMI) and display port
• Five (5) x1 PCI Express connectors
• 12 USB 2.0 ports
• On-board 10/100/1000 Mb/s Ethernet
• One (1) RJ45 connector
• One (1) serial IrDA (infrared) port
– DDR2 667/800 MHz, non-ECC, SO-DIMM
– DDR3 800/1066 MHz, non-ECC, SO-DIMM
on x16 connector
supports high throughput for high-end graphics
connectors via extension card
®
4 Series