TE28F640J3D75 Intel, TE28F640J3D75 Datasheet - Page 13

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TE28F640J3D75

Manufacturer Part Number
TE28F640J3D75
Description
Manufacturer
Intel
Datasheet

Specifications of TE28F640J3D75

Cell Type
NOR
Density
64Mb
Access Time (max)
75ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
23/22Bit
Operating Supply Voltage (typ)
3/3.3V
Sync/async
Asynchronous
Package Type
TSOP
Program/erase Volt (typ)
2.7 to 3.6V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
8M/4Mword
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TE28F640J3D75
Manufacturer:
INTEL
Quantity:
37
Numonyx™ Embedded Flash Memory (J3 v. D)
Table 1:
3.2
Figure 5:
Table 2:
November 2007
308551-05
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Package Height (32, 64, 128- Mbit)
Package Height (256- Mbit)
Ball Height
Package Body Thickness (32, 64, 128- Mbit)
Parameter
Corner
Ball A1
56-Lead TSOP Dimension Table
Easy BGA Mechanical Specifications
Easy BGA Package Dimensions Table (Sheet 1 of 2)
A2
Easy BGA Package (32, 64, 128 and 256 Mbit)
Parameter
A
G
B
C
D
E
F
H
1
A1
2
Top View - Plastic Backside
Complete Ink Mark Not Shown
3
Symbol
4
D
N
q
Y
Z
5
6
7
A
A
A1
A2
Symb
ol
8
0.150
Min
0.250
E
Min
Millimeters
A
A
G
0.250
B
C
D
E
F
H
Nom
56
Seating
8
Plane
0.780
Nom
Millimeters
7
b
Bottom View - Ball Side Up
6
0.100
0.350
Max
1.200
1.300
5
Max
4
3
Note
0.006
Min
s
2
0.0098
1
Y
Min
S
1
Inches
0.010
Nom
e
56
Ball A1
Corner
0.0307
S
Inches
2
Nom
Datasheet
0.004
0.014
0.0472
0.0512
Max
Max
13

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