DSP56301PW80B1 Freescale Semiconductor, DSP56301PW80B1 Datasheet - Page 40
DSP56301PW80B1
Manufacturer Part Number
DSP56301PW80B1
Description
Manufacturer
Freescale Semiconductor
Datasheet
1.DSP56301PW80B1.pdf
(124 pages)
Specifications of DSP56301PW80B1
Device Core Size
24b
Format
Fixed Point
Clock Freq (max)
80MHz
Mips
80
Device Input Clock Speed
80MHz
Ram Size
24KB
Program Memory Size
Not RequiredKB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
208
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant
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Specifications
2-14
Notes:
No.
115
116
117
118
119
Address valid to RD
assertion
RD assertion pulse width
RD deassertion to address
not valid
TA setup before RD or WR
deassertion
TA hold after RD or WR
deassertion
1.
2.
3.
4.
5.
6.
Characteristics
WS is the number of wait states specified in the BCR.
Timings 100, 107 are guaranteed by design, not tested.
All timings for 100 MHz are measured from 0.5 · Vcc to 0.5 · Vcc
Timing 118 is relative to the deassertion edge of RD or WR even if TA remains active.
Timings 110, 111, and 112, are not helpful and are not specified for 100 MHz.
V
CC
4
= 3.3 V ± 0.3 V; T
Note: Address lines A[0–23] hold their state after a
read or write operation. AA[0–3] do not hold their
state after a read or write operation.
A[0–23]
D[0–23]
AA[0–3]
WR
RD
TA
Table 2-8.
J
Symbol
= –40°C to +100°C, C
Figure 2-12.
SRAM Read and Write Accesses
DSP56301 Technical Data, Rev. 10
113
0.25 × T
1.25 × T
2.25 × T
(WS + 0.25) × T
L
= 50 pF
0.25 × T
Expression
0.5 × T
C
C
− 2.0 [1 ≤ WS ≤ 3]
− 2.0 [4 ≤ WS ≤ 7]
C
SRAM Read Access
− 2.0 [WS ≥ 8]
104
C
C
− 4.0
+ 2.0
C
1
−4.0
100
105
116
3,6
(Continued)
Min
11.6
13.6
26.1
118
2.3
1.1
5.1
0
80 MHz
Data
In
Max
—
—
—
—
—
—
—
Freescale Semiconductor
117
106
119
10.5
20.5
Min
1.0
8.5
0.5
4.5
0
100 MHz
Max
—
—
—
—
—
—
—
Unit
ns
ns
ns
ns
ns
ns
ns
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