PXAH40KFBE NXP Semiconductors, PXAH40KFBE Datasheet - Page 21

PXAH40KFBE

Manufacturer Part Number
PXAH40KFBE
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PXAH40KFBE

Cpu Family
XA
Device Core
80C51
Device Core Size
16b
Frequency (max)
30MHz
Interface Type
USART
Program Memory Type
ROMLess
Program Memory Size
Not Required
# I/os (max)
32
Number Of Timers - General Purpose
2
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.97V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PXAH40KFBE
Manufacturer:
TriQuint
Quantity:
1 200
Part Number:
PXAH40KFBE
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
PXAH40KFBE
Manufacturer:
NXP
Quantity:
4 974
Part Number:
PXAH40KFBE,557
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Philips Semiconductors
Clock Output
The ClkOut pin allows easier external bus interfacing in some
situations. This output reflects the XTALIn clock input to the XA
(referred to internally as CClk or System Clock), but is delayed to
match the external bus outputs and strobes. The default is for
1999 Sep 24
Single-chip 16-bit microcontroller
NOTE:
The 16-bit wide RAM does not need the A0 pin from the processor. During byte writes to the RAM, the A0 value will cause
either BLE or BHE pin to go active from the XA-H3, but not to both. For all Word Writes, Word Reads, Code Fetches, and
Byte Reads, both BLE and BHE will go active.During DRAM cycles only, the appropriate CAS Address will be multiplexed
onto pins A17 – A7 after the assertion of RAS and prior to the assertion of BHE (CASH) and BLE (CASL.) See AC timing
diagrams and the XA-H4 User Manual for complete details.
XA-H4
D15–D0
A19–A0
BHE
CS0
CS1
CS2
CS3
BLE
WE
OE
Figure 4. Typical system bus configuration
21
ClkOut to be output enabled at reset, but it may be turned off
(tri-state disabled) by software via the MICFG MMR.
WARNING: The capacitive loading on this output must not
exceed 40 pf.
A16–A0
A17–A9
D15–D0
A17–A8
D15–D0
A15–A1
D15–D0
D7–D0
CS
OE
A16–A0
D7–D0
RAS
CASL
CASH
OE
WE
A8–A0
D15–D0
RAS
CASL
CASH
OE
WE
A9–A0
D15–D0
RAS
CASL
CASH
WE
A15–A1
D15–D0
256 k x 16 DRAM
(MT4C1M16C3)
32 k x 16 SRAM
1 M x 16 DRAM
128 k x 8 ROM
(HM514260DI)
Preliminary specification
XA-H4
SU01275

Related parts for PXAH40KFBE