PXAH40KFBE NXP Semiconductors, PXAH40KFBE Datasheet - Page 4

• Manufacturer Part Number: PXAH40KFBE
• Manufacturer: NXP Semiconductors

Specifications of PXAH40KFBE

• Cpu Family: XA
• Device Core: 80C51
• Device Core Size: 16b
• Frequency (max): 30MHz
• Interface Type: USART
• Program Memory Type: ROMLess
• Program Memory Size: Not Required
• # I/os (max): 32
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.97V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
PIN CONFIGURATION
1999 Sep 24
DRAM CAS bits
NOTE: Address lines output during
various DRAM CAS cycles are shown
in parenthesis. See DRAM Controller
chapter in User Manual for details.
Single-chip 16-bit microcontroller
A16 (A7_A20_A21)
A17 (A8_A18_A19)
A8 (A19_A20)
A15 (A6_A22)
A9 (A0_A18)
A7 (A21_22)
A10 (A1)
A12 (A3)
A13 (A4)
A14 (A5)
A11 (A2)
VDD
VDD
VSS
VSS
A18
A19
A0
A1
A2
A3
A4
A5
A6
D0
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
1
2
3
4
5
6
7
8
9
MOLD MARK
K = 30 MHz, F = –40 to +85 C, BE = LQFP pkg
Current Part = PXAH40KFBE
LQFP Package = SOT407-1
Base Part Number PXAH4
Top View 100 Pin LQFP
XA-H4
4
MOLD MARK
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
Preliminary specification
P1.7_BRG2_Sync2
P1.6_RTS2
P1.5_CTS2
P1.4_CD2
P1.3_TRClk2
P1.2_RTClk2
P1.1_TxD2
P1.0_RxD2
P3.7_Int1_TRClk1
P3.6_TxD1
P3.5_RxD1
P3.4_CTS1
P3.3_Timer1_BRG1_Sync1
VDD
XTALOUT
XTALIN
VSS
P3.2_Timer0_ResetOut
P3.1_CS5_RAS5_RTS1
P3.0_CS4_RAS4_RTClk1
Reset_In
BLE_CASL
BHE_CASH
WAIT_Size16
OE
SU01269
XA-H4