ISP1761BE STEricsson, ISP1761BE Datasheet - Page 148

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ISP1761BE

Manufacturer Part Number
ISP1761BE
Description
Manufacturer
STEricsson
Datasheet

Specifications of ISP1761BE

Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Package Type
LQFP
Rad Hardened
No
Lead Free Status / Rohs Status
Supplier Unconfirmed

Available stocks

Company
Part Number
Manufacturer
Quantity
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Part Number:
ISP1761BE
Manufacturer:
ST
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Company:
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Company:
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Part Number:
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Part Number:
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Manufacturer:
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NXP Semiconductors
Fig 32. Package outline SOT857-1 (TFBGA128)
ISP1761_5
Product data sheet
TFBGA128: plastic thin fine-pitch ball grid array package; 128 balls; body 9 x 9 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT857-1
VERSION
OUTLINE
max
1.1
A
ball A1
index area
ball A1
index area
0.25
0.15
A
1
M
K
H
D
B
T
P
F
R
N
G
C
A
L
J
E
0.85
0.75
A
2
IEC
1
2
0.35
0.25
b
3
4
e
5
9.1
8.9
D
6
7
8
MO-195
JEDEC
e
D
9.1
8.9
1
9
E
10
1/2 e
11
REFERENCES
12
0.5
e
13
Rev. 05 — 13 March 2008
14
0
b
15
7.5
e
16
1
JEITA
7.5
scale
e
2.5
1/2 e
2
B
e
0.15
E
w
A
v
v
e
M
M
2
5 mm
C
C
0.05
w
A
B
0.08
A
y
A
2
A
0.1
y
y
1
1
1
C
PROJECTION
Hi-Speed USB OTG controller
EUROPEAN
detail X
C
X
y
© NXP B.V. 2008. All rights reserved.
ISP1761
ISSUE DATE
04-05-05
04-06-22
SOT857-1
147 of 163

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