XCB56362PV100 Freescale Semiconductor, XCB56362PV100 Datasheet - Page 109

• Manufacturer Part Number: XCB56362PV100
• Description: DSP Floating-Point 24-Bit 100MHz 100MIPS 144-Pin LQFP
• Manufacturer: Freescale Semiconductor

Specifications of XCB56362PV100

• Package: 144LQFP
• Numeric And Arithmetic Format: Floating-Point
• Maximum Speed: 100 MHz
• Ram Size: 33 KB
• Device Million Instructions Per Second: 100 MIPS

5
5.1
An estimation of the chip junction temperature, T
Where:
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and
a case-to-ambient thermal resistance.
Where:
R
change the case-to-ambient thermal resistance, R
the device, add a heat sink, change the mounting arrangement on the printed circuit board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on a PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where
the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the
device thermal performance may need the additional modeling capability of a system level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which
the package is mounted. Again, if the estimations obtained from R
the thermal performance is adequate, a system level model may be appropriate.
A complicating factor is the existence of three common ways for determining the junction-to-case thermal
resistance in plastic packages.
Freescale Semiconductor
θJC
is device-related and cannot be influenced by the user. The user controls the thermal environment to
Design Considerations
T
R
P
R
R
R
A
D
θJA
θJA
θJC
θCA
Thermal Design Considerations
= ambient temperature °C
= package junction-to-ambient thermal resistance °C/W
= power dissipation in package W
= package junction-to-ambient thermal resistance °C/W
= package junction-to-case thermal resistance °C/W
= package case-to-ambient thermal resistance °C/W
DSP56362 Technical Data, Rev. 4
T
R
J
θJA
=
T
=
A
θCA
J
+
R
, in °C can be obtained from the following equation:
(
θJC
. For example, the user can change the air flow around
P
D
+
×
R
R
θCA
θJA
)
θJA
do not satisfactorily answer whether
5-1