CBR02C508C3GAC Kemet, CBR02C508C3GAC Datasheet - Page 5

• Manufacturer Part Number: CBR02C508C3GAC
• Description: CAP CER 0.5PF 25V NP0 0201
• Manufacturer: Kemet
• Series: CBRr

Specifications of CBR02C508C3GAC

• Capacitance: 0.50pF
• Voltage - Rated: 25V
• Tolerance: ±0.25pF
• Temperature Coefficient: C0G, NP0
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: RF, Microwave, High Frequency
• Ratings: -
• Package / Case: 0201 (0603 Metric)
• Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
• Height - Seated (max): -
• Thickness (max): 0.013" (0.33mm)
• Lead Spacing: -
• Features: High Q, Low Loss
• Lead Style: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 399-6137-2

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications – CBR Series
Table 2 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351 (mm)
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of 0603(1608) and 0805(2012) case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp, and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40 degrees C, and maximum storage humidity not
exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts, and
atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock should be used promptly,
preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
Case
Size
0201
0402
0603
0805
(in.)
Case
(mm)
Size
0603
1005
1608
2012
0.38
0.50
0.90
1.00
C
Maximum (Most) Land
0.56
0.72
1.35
1.15
Density Level A:
Y
Protrusion
0.52
1.55
0.72
1.10
X
2.20
4.00
4.40
1.80
V1
2.60
1.00
1.20
2.10
V2
0.33
0.45
0.80
0.90
C
Median (Nominal) Land
0.46
0.62
0.95
1.15
Density Level B:
Y
Protrusion
0.42
0.62
1.00
1.45
X
1.50
1.90
3.50
3.10
V1
0.80
2.00
1.00
1.50
V2
0.60
0.28
0.40
0.75
C
Minimum (Least) Land
0.36
0.52
0.75
0.95
Density Level C:
Y
C1030-1 • 4/6/2011
Protrusion
0.32
0.52
0.90
1.35
X
1.20
1.60
2.40
2.80
V1
0.60
0.80
1.20
1.70
V2
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