HSMP-3824-G Avago Technologies US Inc., HSMP-3824-G Datasheet - Page 8
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HSMP-3824-G
Manufacturer Part Number
HSMP-3824-G
Description
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HSMP-3824-G.pdf
(10 pages)
Specifications of HSMP-3824-G
Lead Free Status / Rohs Status
Compliant
Package Dimensions
Outline 23 (SOT-23)
Package Characteristics
Lead Material ....................................................... Copper (SOT-323); Alloy 42 (SOT-23)
Lead Finish ............................................................................ Tin 100% (Lead-free option)
Maximum Soldering Temperature ............................................... 260°C for 5 seconds
Minimum Lead Strength . ............................................................................. 2 pounds pull
Typical Package Inductance ..........................................................................................2 nH
Typical Package Capacitance ................................................. 0.08 pF (opposite leads)
Ordering Information
Specify part number followed by option. For example:
HSMP - 382x - XXX
Option Descriptions
-BLKG = Bulk, 100 pcs. per antistatic bag
-TR1G = Tape and Reel, 3000 devices per 7" reel
-TR2G = Tape and Reel, 10,000 devices per 13" reel
Tape and Reeling conforms to Electronic Industries RS-481, “ Taping of Surface
Mounted Components for Automated Placement. ”
8
E
A1
Notes:
XXX-package marking
Drawings are not to scale
e2
e
XXX
e1
D
B
E1
A
SYMBOL
A1
E1
e1
e2
B
D
A
C
e
E
L
0.000
DIMENSIONS (mm)
MIN.
0.79
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
Bulk or Tape and Reel Option
Part Number; x = Lead Code
Surface Mount PIN
C
0.100
MAX.
1.20
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
L
Outline SOT-323 (SC-70)
E
A1
Notes:
XXX-package marking
Drawings are not to scale
e
XXX
e1
D
B
E1
A
SYMBOL
A1
E1
e1
A
B
C
D
e
E
L
DIMENSIONS (mm)
MIN.
0.80
0.00
0.15
0.08
1.80
1.10
1.80
0.26
0.65 typical
1.30 typical
C
MAX.
1.00
0.10
0.40
0.25
2.25
1.40
2.40
0.46
L