SA58637BS,118 NXP Semiconductors, SA58637BS,118 Datasheet

IC AMP AUDIO 2.2W STER D 20HVQFN

SA58637BS,118

Manufacturer Part Number
SA58637BS,118
Description
IC AMP AUDIO 2.2W STER D 20HVQFN
Manufacturer
NXP Semiconductors
Type
Class Dr
Datasheet

Specifications of SA58637BS,118

Output Type
2-Channel (Stereo)
Package / Case
20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
Max Output Power X Channels @ Load
2.2W x 2 @ 8 Ohm
Voltage - Supply
2.2 V ~ 18 V
Features
Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type
Surface Mount
Product
Class-AB
Output Power
2.2 W
Available Set Gain
30 dB
Thd Plus Noise
0.15 %
Operating Supply Voltage
9 V
Supply Current
15 mA
Maximum Power Dissipation
2.2 W
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Audio Load Resistance
8 Ohms
Input Bias Current (max)
500 nA
Input Signal Type
Differential
Minimum Operating Temperature
- 40 C
Output Signal Type
Differential, Single
Supply Type
Single
Supply Voltage (max)
18 V
Supply Voltage (min)
2.2 V
Operational Class
Class-AB
Audio Amplifier Output Configuration
2-Channel Stereo
Output Power (typ)
2.2x2@8OhmW
Audio Amplifier Function
Speaker
Total Harmonic Distortion
0.15@8Ohm@0.5W%
Single Supply Voltage (typ)
9V
Dual Supply Voltage (typ)
Not RequiredV
Power Supply Requirement
Single
Power Dissipation
2.2W
Rail/rail I/o Type
No
Power Supply Rejection Ratio
50dB
Single Supply Voltage (min)
2.2V
Single Supply Voltage (max)
18V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
20
Package Type
HVQFN EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4356-2
935285742118
SA58637BS
SA58637BS-T
1. General description
2. Features
3. Applications
The SA58637 is a two-channel audio amplifier in an HVQFN20 package. It provides
power output of 2.2 W per channel with an 8
comprised of two Bridge-Tied Load (BTL) amplifiers with a complementary PNP-NPN
output stage and standby/mute logic. The SA58637 is housed in a 20-pin HVQFN
package, which has an exposed die attach paddle enabling reduced thermal resistance
and increased power dissipation.
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SA58637
2 2.2 W BTL audio amplifier
Rev. 01 — 25 February 2008
Low junction-to-ambient thermal resistance using exposed die attach paddle
Gain can be fixed with external resistors from 6 dB to 30 dB
Standby mode controlled by CMOS-compatible levels
Low standby current < 10 A
No switch-on/switch-off plops
High power supply ripple rejection: 50 dB minimum
ElectroStatic Discharge (ESD) protection
Output short circuit to ground protection
Thermal shutdown protection
Professional and amateur mobile radio
Portable consumer products: toys and games
Personal computer remote speakers
load at 9 V supply. The internal circuit is
Product data sheet

Related parts for SA58637BS,118

SA58637BS,118 Summary of contents

Page 1

SA58637 2 2.2 W BTL audio amplifier Rev. 01 — 25 February 2008 1. General description The SA58637 is a two-channel audio amplifi HVQFN20 package. It provides power output of 2.2 W per channel with an 8 comprised ...

Page 2

... NXP Semiconductors 4. Quick reference data Table specified. Symbol stb P o THD+N PSRR [1] With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by R [2] Power supply rejection ratio is measured at the output with a source impedance of R The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail ...

Page 3

... NXP Semiconductors 6. Block diagram Fig 1. SA58637_1 Product data sheet SA58637 15 INL 14 INL+ V CCL INR 13 INR+ V CCR SVR MODE 4 SELECT 5 8 n.c. GND GND Block diagram of SA58637 Rev. 01 — 25 February 2008 SA58637 2 2.2 W BTL audio amplifi CCL CCR OUTL OUTL+ STANDBY/MUTE LOGIC ...

Page 4

... NXP Semiconductors 7. Pinning information 7.1 Pinning Fig 2. 7.2 Pin description Table 3. Symbol OUTL+ MODE SVR SELECT n.c. OUTR+ RGND GND V CCR OUTR INR INR+ INL+ INL OUTL V CCL LGND [1] Pins and 19 are connected to the lead frame and also to the substrate. They may be kept floating. ...

Page 5

... NXP Semiconductors 8. Functional description The SA58637 is a two-channel BTL audio amplifier capable of delivering 2 power delivering 2 supply. Using the MODE pin, the device can be switched to standby and mute condition. The device is protected by an internal thermal shutdown protection mechanism. The gain can be set within a range external feedback resistors. ...

Page 6

... NXP Semiconductors Table 4. Voltage levels at control pins at V Control pin MODE [4] HVCC [4] HVCC [4] HVCC [1] HIGH = V [2] n.c. = not connected or floating. [ don’t care. [4] HVCC = 1.5 V < V [5] LOW = V 9. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). ...

Page 7

... NXP Semiconductors Table 7. Static characteristics amb L Symbol Parameter V output voltage O V differential output voltage offset O(offset) I input bias current IB V voltage on pin MODE MODE I current on pin MODE MODE V voltage on pin SELECT SELECT I input current on pin SELECT I(SELECT) [1] With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by R ...

Page 8

... NXP Semiconductors 13. Application information 13.1 BTL application amb 22 kHz. The single-ended input and BTL differential output diagram is shown in Fig 3. SA58637_1 Product data sheet = kHz INL INL INR INR SVR 3 MODE 2 SELECT 4 R2 Gain left = 2 ------ - R1 R4 Gain right = 2 ------ - R3 Pins and 19 connected to ground. ...

Page 9

... NXP Semiconductors 14. Test information 14.1 Static characterization The quiescent current has been measured without any load impedance Figure 6 levels of the mute and standby respectively depends on the supply voltage level (mA Fig 4. Quiescent current as a function of supply voltage Fig 6. Voltage on pin MODE as a function of supply voltage ...

Page 10

... NXP Semiconductors V SELECT (V) (1) Left channel on (2) Left channel standby (3) Right channel on (4) Right channel standby (5) Left channel + right channel on Fig 7. SA58637_1 Product data sheet Voltage on pin SELECT as a function of supply voltage Rev. 01 — 25 February 2008 SA58637 2 2.2 W BTL audio amplifier ...

Page 11

... NXP Semiconductors 14.2 BTL dynamic characterization The total harmonic distortion-plus-noise (THD+ function of frequency was measured with a low-pass filter of 80 kHz. The value of capacitor C3 influences the behavior of PSRR at low frequencies; increasing the value of C3 increases the performance of PSRR. 10 THD+N (%) 1 ( dB. ...

Page 12

... NXP Semiconductors uses FR-4 type application boards with 28 oz) copper traces with solder coating. The demo board (see the IC and provides a mounting pad to solder to the die attach paddle of the HVQFN20 package ...

Page 13

... NXP Semiconductors (1) 64.5 mm (2) 32.3 mm (3) No heat spreader. Fig 11. Power dissipation as a function of ambient temperature The characteristics curves Figure 15a and the demo PCB shown in function of output power” and supply voltage. Worst case power dissipation is shown in shows that the part delivers typically 2.8 W per channel for THD using 8 ...

Page 14

... NXP Semiconductors ( Fig 13. Worst case power dissipation as a function of supply voltage 2 10 THD+N (%) kHz Fig 15. Total harmonic distortion-plus-noise as a function of output power SA58637_1 Product data sheet 001aah747 (W) ( (V) CC Fig 14. Output power as a function of supply voltage 002aac284 THD+N ( Rev. 01 — 25 February 2008 2 2.2 W BTL audio amplifi ...

Page 15

... NXP Semiconductors 14.4 General remarks The frequency characteristics can be adapted by connecting a small capacitor across the feedback resistor. To improve the immunity of HF radiation in radio circuit applications, a small capacitor can be connected in parallel with the feedback resistor ( this creates a low-pass filter. 14.5 SA58637BS PCB demo The application demo board may be used for evaluation single-ended input, BTL differential output confi ...

Page 16

SA58637BS Rev5 Audio Amplifier GND OUTL GND VCC/2 VCC MODE GND SEL VCC SELECT OUTR+ Fig 16. SA58637BS PCB demo VCC OUTL INL GND ...

Page 17

... NXP Semiconductors 15. Package outline HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 0.85 mm terminal 1 index area terminal 1 20 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0 0.2 0.00 0.3 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included ...

Page 18

... NXP Semiconductors 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...

Page 19

... NXP Semiconductors 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...

Page 20

... NXP Semiconductors Fig 18. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 17. Abbreviations Table 11. Acronym BTL CMOS DAP ESD HF NPN PCB PNP RMS SE THD 18. Revision history Table 12 ...

Page 21

... NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. ...

Page 22

... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Functional description . . . . . . . . . . . . . . . . . . . 5 8.1 Power amplifi 8.2 Mode select pin (MODE 8.3 SELECT output configuration . . . . . . . . . . . . . . 5 9 Limiting values ...

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