TDA8541T/N1,112 NXP Semiconductors, TDA8541T/N1,112 Datasheet
TDA8541T/N1,112
Specifications of TDA8541T/N1,112
935211650112
TDA8541TD
Related parts for TDA8541T/N1,112
TDA8541T/N1,112 Summary of contents
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DATA SHEET TDA8541 1 W BTL audio amplifier Product specification Supersedes data of 1997 Feb 19 INTEGRATED CIRCUITS 1998 Apr 01 ...
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... NXP Semiconductors 1 W BTL audio amplifier FEATURES • Flexibility in use • Few external components • Low saturation voltage of output stage • Gain can be fixed with external resistors • Standby mode controlled by CMOS compatible levels • Low standby current • No switch-on/switch-off plops • ...
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... NXP Semiconductors 1 W BTL audio amplifier BLOCK DIAGRAM handbook, halfpage − 4 − IN− IN kΩ 2 SVR 20 kΩ 1 MODE STANDBY/MUTE LOGIC Fig.1 Block diagram. FUNCTIONAL DESCRIPTION The TDA8541( BTL audio power amplifier capable of delivering 1 W output power Ω load at THD = 10% using power supply. Using the MODE pin the device can be switched to standby and mute condition ...
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... NXP Semiconductors 1 W BTL audio amplifier LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL V supply voltage CC V input voltage I I repetitive peak output current ORM T storage temperature stg T operating ambient temperature amb V AC and DC short-circuit safe voltage ...
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... NXP Semiconductors 1 W BTL audio amplifier AC CHARACTERISTICS = 25 ° Ω kHz amb L SYMBOL PARAMETER P output power o THD total harmonic distortion G closed loop voltage gain v Z differential input impedance i V noise output voltage no SVRR supply voltage ripple rejection V output voltage in mute condition o Notes 1. Gain of the amplifier is 2 × ...
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... NXP Semiconductors 1 W BTL audio amplifier TEST AND APPLICATION INFORMATION Test conditions Because the application can be either Bridge-Tied Load (BTL) or Single-Ended (SE), the curves of each application are shown separately. The thermal resistance = 100 K/W for the DIP8 envelope; the maximum sine wave power dissipation for = 25 ° ...
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... NXP Semiconductors 1 W BTL audio amplifier BTL APPLICATION handbook, full pagewidth μF 11 kΩ μF R2 × ------- - Gain = handbook, halfpage I q (mA ∞ Fig function 1998 Apr 01 56 kΩ − TDA8541 SVR 2 MODE GND Fig.3 BTL application. MGD876 handbook, halfpage ( 100 μF 100 nF OUT − ...
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... NXP Semiconductors 1 W BTL audio amplifier 10 handbook, halfpage THD (%) 1 (1) −1 10 − 0 dB Ω. ( Ω. ( Fig.6 THD as a function of frequency. 2.5 handbook, halfpage P o (W) 2 (1) 1 THD = 10 Ω. ( Ω. ( Fig function 1998 Apr 01 MGD878 handbook, halfpage SVRR (dB) ( (Hz (1) G (2) G (3) G ...
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... NXP Semiconductors 1 W BTL audio amplifier 1.6 handbook, halfpage P (1) (W) 1.2 0.8 (2) 0 0.5 1 Sine wave of 1 kHz Ω. ( Ω. ( Fig. function handbook, halfpage V ms (V) 12 standby Fig. function 1998 Apr 01 MGD882 handbook, halfpage 1 MGL070 mute operating ( (V) 1 −1 10 − ...
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... NXP Semiconductors 1 W BTL audio amplifier SE APPLICATION handbook, full pagewidth μF 11 kΩ μF R2 Gain = ------- - R1 10 handbook, halfpage THD (%) 1 (1) (2) −1 10 (3) −2 10 −2 − kHz dB Ω Ω. ( Ω. ( Fig.14 THD as a function of P 1998 Apr 01 110 kΩ − TDA8541 SVR ...
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... NXP Semiconductors 1 W BTL audio amplifier −20 handbook, halfpage SVRR (dB) −40 (1) (2) −60 (3) − Ω Ω 7 100mV ( dB dB dB. v Fig.16 SVRR as a function of frequency. 1.6 handbook, halfpage P (W) 1.2 (1) (2) 0.8 0 Ω. ( Ω. ( Ω. ( Fig.18 Worst case power dissipation as a function of V ...
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... NXP Semiconductors 1 W BTL audio amplifier handbook, full pagewidth 1998 Apr 01 a. Top view. 6.8 kΩ MS 6.8 kΩ 1 TDA8541 1 μ kΩ μF 100 μF b. Component side. Fig.20 Printed-circuit board layout (BTL and SE). 12 Product specification 8 OUT + OUT − kΩ 100 MBH920 ...
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... NXP Semiconductors 1 W BTL audio amplifier PACKAGE OUTLINES SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 ...
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... NXP Semiconductors 1 W BTL audio amplifier DIP8: plastic dual in-line package; 8 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors 1 W BTL audio amplifier SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...