TDA8933BTW/N2,518 NXP Semiconductors, TDA8933BTW/N2,518 Datasheet - Page 17

IC AMP AUDIO 20.6W STER 32TSSOP

TDA8933BTW/N2,518

Manufacturer Part Number
TDA8933BTW/N2,518
Description
IC AMP AUDIO 20.6W STER 32TSSOP
Manufacturer
NXP Semiconductors
Type
Class Dr
Datasheet

Specifications of TDA8933BTW/N2,518

Output Type
1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power X Channels @ Load
20.6W x 1 @ 16 Ohm; 10.3W x 2 @ 8 Ohm
Voltage - Supply
10 V ~ 36 V, ±5 V ~ 18 V
Features
Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
Mounting Type
Surface Mount
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935285222518
TDA8933BTW/N2-T
TDA8933BTW/N2-T
NXP Semiconductors
11. Thermal characteristics
Table 9.
[1]
[2]
[3]
[4]
12. Static characteristics
Table 10.
V
TDA8933B_1
Preliminary data sheet
Symbol
R
R
Symbol
Supply
V
I
I
Series resistance output switches
R
Power-up input: pin POWERUP
V
I
V
V
P
q(tot)
I
P
P
I
IL
IH
th(j-a)
th(j-c)
DSon
j-lead
j-top
= 25 V, f
Measured on a JEDEC high K-factor test board (standard EIA/JESO 51-7) in free air with natural convection.
Measured on a two-layer application board (55 mm
Measured on a three-layer application board (70 mm
Strongly dependent on where the measurement is taken on the package.
osc
Thermal characteristics
Characteristics
Parameter
supply voltage
supply current
total quiescent current Operating mode; no load,
drain-source on-state
resistance
input voltage
input current
LOW-level input
voltage
HIGH-level input
voltage
Parameter
thermal resistance from
junction to ambient
thermal characterization
parameter from junction to
lead
thermal characterization
parameter from junction to
top of package
thermal resistance from
junction to case
= 320 kHz and T
[8]
Machine Model (MM); R
amb
[1]
= 25 C; unless specified otherwise.
Conditions
asymmetrical supply
symmetrical supply
Sleep mode
no snubbers or filter
connected
T
T
V
j
j
I
= 25 C
= 125 C
= 3 V
Conditions
free air natural convection
JEDEC test board
Two-layer application board
Three-layer application
board
free-air natural convection
Rev. 01 — 23 October 2008
s
40 mm), 35 m copper, FR4 base material in free air with natural convection.
= 0 ; C = 200 pF; L = 0.75 H.
50 mm), 35 m copper, FR4 base material in free air with natural convection.
Min
-
-
10
-
-
-
0
0
2
5
[1]
[2]
[3]
[4]
Min
-
-
-
-
-
-
Typ
25
0.6
40
380
545
-
1
-
-
12.5
Typ
47
48
30
-
-
4.0
Class D audio amplifier
TDA8933B
Max
36
1.0
50
-
-
6.0
20
0.8
6.0
Max
50
-
-
30
2
-
18
© NXP B.V. 2008. All rights reserved.
Unit
K/W
K/W
K/W
K/W
K/W
K/W
Unit
V
V
mA
mA
m
m
V
V
V
17 of 42
A

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