BUK9635-55A NXP Semiconductors, BUK9635-55A Datasheet

Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology

BUK9635-55A

Manufacturer Part Number
BUK9635-55A
Description
Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BUK9635-55A
Manufacturer:
NXP
Quantity:
42 000
GENERAL DESCRIPTION
N-channel enhancement mode logic
level field-effect power transistor in a
plastic
TO220AB and SOT404 . Using
’trench’ technology which features
very low on-state resistance. It is
intended for use in automotive and
general
applications.
PINNING
TO220AB & SOT404
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
THERMAL RESISTANCES
February 2000
Philips Semiconductors
TrenchMOS
Logic level FET
SYMBOL
V
V
I
I
I
P
T
SYMBOL
R
R
R
tab/mb drain
D
D
DM
V
V
stg
DS
DGR
tot
th j-mb
th j-a
th j-a
PIN
GS
GSM
1
2
3
, T
j
envelope
DESCRIPTION
gate
drain
source
purpose
PARAMETER
Drain-source voltage
Drain-gate voltage
Gate-source voltage
Non-repetitive gate-source voltage
Drain current (DC)
Drain current (DC)
Drain current (pulse peak value)
Total power dissipation
Storage & operating temperature
PARAMETER
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient(TO220AB)
Thermal resistance junction to
ambient(SOT404)
available
transistor
switching
in
QUICK REFERENCE DATA
PIN CONFIGURATION
SYMBOL
V
I
P
T
R
D
j
DS
tot
DS(ON)
1
2
3
SOT404
CONDITIONS
-
R
-
t
T
T
T
T
-
CONDITIONS
-
in free air
Minimum footprint, FR4
board
p
mb
mb
mb
mb
GS
mb
50 S
PARAMETER
Drain-source voltage
Drain current (DC)
Total power dissipation
Junction temperature
Drain-source on-state
resistance
= 25 ˚C
= 100 ˚C
= 25 ˚C
= 25 ˚C
= 20 k
1
tab
TO220AB
1 2 3
V
V
GS
GS
= 10 V
= 5 V
SYMBOL
TYP.
MIN.
- 55
60
50
-
-
-
-
-
-
-
-
-
g
MAX.
Product specification
175
55
34
85
35
32
MAX.
MAX.
BUK9535-55A
BUK9635-55A
133
175
1.8
55
55
10
15
34
24
85
-
-
d
s
Rev 1.000
UNIT
UNIT
K/W
K/W
K/W
UNIT
˚C
W
m
m
V
V
V
V
A
A
A
˚C
W
V
A

Related parts for BUK9635-55A

BUK9635-55A Summary of contents

Page 1

... Total power dissipation tot T Junction temperature j R Drain-source on-state DS(ON) resistance PIN CONFIGURATION tab SOT404 CONDITIONS - ˚ 100 ˚ ˚ ˚ CONDITIONS - in free air Minimum footprint, FR4 board 1 Product specification BUK9535-55A BUK9635-55A MAX 175 SYMBOL TO220AB s MIN. MAX 133 - 175 TYP. MAX ...

Page 2

... Measured from contact screw on tab to centre of die(TO220AB) Measured from upper edge of drain tab to centre of die(SOT404) Measured from source lead to source bond pad CONDITIONS -dI /dt = 100 - Product specification BUK9535-55A BUK9635-55A MIN. TYP. MAX. UNIT 1.5 2 ...

Page 3

... CONDITIONS 120 140 160 180 = f 0.1 0.01 120 140 160 180 1E- Product specification BUK9535-55A BUK9635-55A MIN. TYP ˚C mb 1000 ID/A RDS(ON)=VSD/ID 100 VSD/V Fig.3. Safe operating area & f single pulse; parameter Zth/(K/W) 0.5 0.2 0.1 0.05 0.02 0 1E-05 1E-03 ...

Page 4

... gfs ˚C. Fig.9. Typical transconductance 2.5 1.5 0 ˚C. Fig.10. Normalised drain-source on-state resistance Product specification BUK9535-55A BUK9635-55A o Tj/C= 175 VGS/V Fig.8. Typical transfer characteristics conditions parameter ID f(I ); conditions Rds(on) normalised to 25degC -100 - 100 Tmb / degC ...

Page 5

... Fig.14. Typical turn-on gate-charge characteristics mA 100 Sub-Threshold Conduction IF/A 98 Ciss Coss Crss 10 100 , Fig.16. Normalised avalanche energy rating. iss oss rss = MHz 5 Product specification BUK9535-55A BUK9635-55A 5 VDS = 14V f(Q ); conditions parameter Tj/C= 150 0.0 0.5 1.0 VSDS/V Fig ...

Page 6

... Avalanche Time Fig.18. Maximum permissible repetitive avalanche current(I ) versus avalanche time(t AV inductive loads. February 2000 VDD + VDS - VGS -ID/100 T.U. shunt BV V DSS (ms) ) for unclamped AV 6 Product specification BUK9535-55A BUK9635-55A + RD VDS - RG T.U.T. Fig.19. Switching test circuit. VDD Rev 1.000 ...

Page 7

... Epoxy meets UL94 V0 at 1/8". February 2000 10,3 max 3,7 2,8 3,0 13,5 min 1 max (2x) 0,9 max (3x) 2,54 2,54 Fig.20. SOT78 (TO220AB); pin 2 connected to mounting base. 7 Product specification BUK9535-55A BUK9635-55A 4,5 max 1,3 5,9 min 0,6 2,4 Rev 1.000 15,8 max ...

Page 8

... Epoxy meets UL94 V0 at 1/8". February 2000 2 scale max. 0.85 0.64 1.60 10.30 2.90 15.40 11 2.54 0.60 0.46 1.20 9.70 2.10 14.80 REFERENCES IEC JEDEC EIAJ 8 Product specification BUK9535-55A BUK9635-55A 2 -PAK); 3 leads SOT404 mounting base 2.60 2.20 EUROPEAN ISSUE DATE PROJECTION 98-12-14 99-06-25 Rev 1.000 ...

Page 9

... Philips for any damages resulting from such improper use or sale. February 2000 11.5 9.0 2.0 3.8 5.08 Fig.22. SOT404 : soldering pattern for surface mounting. 9 Product specification BUK9535-55A BUK9635-55A 17.5 Rev 1.000 ...

Related keywords