LM4836MTEX/NOPB National Semiconductor, LM4836MTEX/NOPB Datasheet - Page 17

• Manufacturer Part Number: LM4836MTEX/NOPB
• Description: IC AMP AUDIO PWR 2.2W AB 28TSSOP
• Manufacturer: National Semiconductor
• Series: Boomer®r
• Type: Class ABr

Specifications of LM4836MTEX/NOPB

• Output Type: 2-Channel (Stereo) with Stereo Headphones
• Max Output Power X Channels @ Load: 2.2W x 2 @ 3 Ohm; 95mW x 2 @ 32 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Bass Boost, Depop, Input Multiplexer, Mute, Shutdown, Thermal Protection, Volume Control
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP Exposed Pad, 28-eTSSOP, 28-HTSSOP
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Audio Amplifier Function: Headphone/Speaker
• Total Harmonic Distortion: 0.3@8Ohm@1W%
• Single Supply Voltage (typ): 3/5V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 74dB
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 28
• Package Type: TSSOP EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: *LM4836MTEX; *LM4836MTEX/NOPB; LM4836MTEX

Application Information
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATIONS
The LM4836’s exposed-DAP (die attach paddle) packages
(MTE and LQ) provide a low thermal resistance between the
die and the PCB to which the part is mounted and soldered.
This allows rapid heat transfer from the die to the surround-
ing PCB copper traces, ground plane and, finally, surround-
ing air. The result is a low voltage audio power amplifier that
produces 2.1W at ≤ 1% THD with a 4Ω load. This high power
is achieved through careful consideration of necessary ther-
mal design. Failing to optimize thermal design may compro-
mise the LM4836’s high power performance and activate
unwanted, though necessary, thermal shutdown protection.
The MTE and LQ packages must have their DAPs soldered
to a copper pad on the PCB. The DAP’s PCB copper pad is
connected to a large plane of continuous unbroken copper.
This plane forms a thermal mass and heat sink and radiation
area. Place the heat sink area on either outside plane in the
case of a two-sided PCB, or on an inner layer of a board with
more than two layers. Connect the DAP copper pad to the
inner layer or backside copper heat sink area with 32(4x8)
(MTE) or 6(3x2) (LQ) vias. The via diameter should be
0.012in–0.013in with a 1.27mm pitch. Ensure efficient ther-
mal conductivity by plating-through and solder-filling the
vias.
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier
share the same PCB layer, a nominal 2.5in
necessary for 5V operation with a 4Ω load. Heatsink areas
not placed on the same PCB layer as the LM4836 should be
5in
The last two area recommendations apply for 25˚C ambient
temperature. Increase the area to compensate for ambient
temperatures above 25˚C. In systems using cooling fans, the
LM4836MTE can take advantage of forced air cooling. With
an air flow rate of 450 linear-feet per minute and a 2.5in
exposed copper or 5.0in
the LM4836MTE can continuously drive a 3Ω load to full
power. The LM4836LQ achieves the same output power
level without forced air cooling. In all circumstances and
conditions, the junction temperature must be held below
150˚C to prevent activating the LM4836’s thermal shutdown
protection. The LM4836’s power de-rating curve in the Typi-
cal Performance Characteristics shows the maximum
power dissipation versus temperature. Example PCB layouts
for the exposed-DAP TSSOP and LQ packages are shown in
the Demonstration Board Layout section. Further detailed
and specific information concerning PCB layout, fabrication,
and mounting an LQ (LLP) package is available in National
Semiconductor’s AN1187.
PCB LAYOUT AND SUPPLY REGULATION
CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS
Power dissipated by a load is a function of the voltage swing
across the load and the load’s impedance. As load imped-
ance decreases, load dissipation becomes increasingly de-
pendent on the interconnect (PCB trace and wire) resistance
between the amplifier output pins and the load’s connec-
tions. Residual trace resistance causes a voltage drop,
which results in power dissipated in the trace and not in the
load as desired. For example, 0.1Ω trace resistance reduces
the output power dissipated by a 4Ω load from 2.1W to 2.0W.
This problem of decreased load dissipation is exacerbated
as load impedance decreases. Therefore, to maintain the
2
(min) for the same supply voltage and load resistance.
2
inner layer copper plane heatsink,
2
(min) area is
2
17
highest load dissipation and widest output voltage swing,
PCB traces that connect the output pins to a load must be as
wide as possible.
Poor power supply regulation adversely affects maximum
output power. A poorly regulated supply’s output voltage
decreases with increasing load current. Reduced supply
voltage causes decreased headroom, output signal clipping,
and reduced output power. Even with tightly regulated sup-
plies, trace resistance creates the same effects as poor
supply regulation. Therefore, making the power supply
traces as wide as possible helps maintain full output voltage
swing.
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4836 consists of two pairs of
operational amplifiers, forming a two-channel (channel A and
channel B) stereo amplifier. (Though the following discusses
channel A, it applies equally to channel B.) External resistors
R
internal 20kΩ resistors set Amp2A’s gain at −1. The LM4836
drives a load, such as a speaker, connected between the two
amplifier outputs, −OUTA and +OUTA.
Figure 1 shows that Amp1A’s output serves as Amp2A’s
input. This results in both amplifiers producing signals iden-
tical in magnitude, but 180˚ out of phase. Taking advantage
of this phase difference, a load is placed between −OUTA
and +OUTA and driven differentially (commonly referred to
as “bridge mode”). This results in a differential gain of
Bridge mode amplifiers are different from single-ended am-
plifiers that drive loads connected between a single amplifi-
er’s output and ground. For a given supply voltage, bridge
mode has a distinct advantage over the single-ended con-
figuration: its differential output doubles the voltage swing
across the load. This produces four times the output power
when compared to a single-ended amplifier under the same
conditions. This increase in attainable output power as-
sumes that the amplifier is not current limited or that the
output signal is not clipped. To ensure minimum output sig-
nal clipping when choosing an amplifier’s closed-loop gain,
refer to the Audio Power Amplifier Design section.
Another advantage of the differential bridge output is no net
DC voltage across the load. This is accomplished by biasing
channel A’s and channel B’s outputs at half-supply. This
eliminates the coupling capacitor that single supply, single-
ended amplifiers require. Eliminating an output coupling ca-
pacitor in a single-ended configuration forces a single-supply
amplifier’s half-supply bias voltage across the load. This
increases internal IC power dissipation and may perma-
nently damage loads such as speakers.
POWER DISSIPATION
Power dissipation is a major concern when designing a
successful single-ended or bridged amplifier. Equation (2)
states the maximum power dissipation point for a single-
ended amplifier operating at a given supply voltage and
driving a specified output load.
f
and R
i
P
set the closed-loop gain of Amp1A, whereas two
DMAX
= (V
A
DD
VD
)
2
= 2 * (R
/(2π
2
R
L
) Single-Ended
f
/R
i
)
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(1)
(2)