93LC66 Microchip Technology Inc., 93LC66 Datasheet

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93LC66

Manufacturer Part Number
93LC66
Description
93LC661K/2K/4K 2.5V Microwire Serial EEPROM
Manufacturer
Microchip Technology Inc.
Datasheet

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Device Selection Table
Features
• Low power CMOS technology
• ORG pin to select word size for ‘66C version
• 512 x 8-bit organization ‘A’ ver. devices (no ORG)
• 256 x 16-bit organization ‘B’ ver. devices (no
• Self-timed ERASE/WRITE cycles (including
• Automatic ERAL before WRAL
• Power on/off data protection circuitry
• Industry standard 3-wire serial I/O
• Device status signal (READY/BUSY)
• Sequential READ function
• 1,000,000 E/W cycles
• Data retention > 200 years
• Temperature ranges supported:
Pin Function Table
 2003 Microchip Technology Inc.
CS
CLK
DI
DO
V
NC
ORG
V
ORG)
auto-erase)
SS
CC
Part Number
- Industrial (I)
- Automotive (E)
Name
93AA66A
93AA66B
93LC66A
93LC66B
93AA66C
93LC66C
93C66A
93C66B
93C66C
4K Microwire
V
No internal connection
Memory Configuration
CC
1.8-5.5
1.8-5-5
2.5-5.5
2.5-5.5
4.5-5.5
4.5-5.5
1.8-5.5
2.5-5.5
4.5-5.5
Serial Data Output
Serial Data Clock
Serial Data Input
Range
-40°C to +85°C
-40°C to +125°C
Power Supply
Chip Select
Function
Ground
ORG Pin
Yes
Yes
Yes
No
No
No
No
No
No
®
-Compatible Serial EEPROM
93AA66A/B/C, 93LC66A/B/C,
Word Size
8 or 16-bit
8 or 16-bit
8 or 16-bit
16-bit
16-bit
16-bit
8-bit
8-bit
8-bit
Description
The Microchip Technology Inc. 93XX66A/B/C devices
are 4K bit low voltage serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93AA66C, 93LC66C or 93C66C are dependent
upon external logic levels driving the ORG pin to set
word size. For dedicated 8-bit communication, the
93AA66A, 93LC66A or 93C66A devices are available,
while the 93AA66B, 93LC66B and 93C66B devices
provide dedicated 16-bit communication. Advanced
CMOS technology makes these devices ideal for low
power, non-volatile memory applications. The entire
93XX Series is available in standard packages includ-
ing 8-lead PDIP and SOIC, and advanced packaging
including 8-lead MSOP, 6-lead SOT-23, and 8-lead
TSSOP. Pb-free (Pure Matte Sn) finish is also
available.
Package Types (not to scale)
Microwire is a registered trademark of National Semiconductor.
* ORG pin is NC on A/B devices
CLK
DO
CS
DI
CLK
V
NC
CS
Temp Ranges
CC
TSSOP/MSOP
ROTATED SOIC
(ex: 93LC66BX)
1
2
3
4
(ST, MS)
1
2
3
4
I, E
I, E
I, E
I, E
I, E
I, E
I
I
I
8
7
6
5
8
7
6
5
ORG*
V
DO
DI
V
NC
ORG*
V
SS
CC
SS
93C66A/B/C
P, SN, ST, MS, OT
P, SN, ST, MS, OT
P, SN, ST, MS, OT
P, SN, ST, MS, OT
P, SN, ST, MS, OT
P, SN, ST, MS, OT
CLK
V
DO
DO
CS
SS
DI
P, SN, ST, MS
P, SN, ST, MS
P, SN, ST, MS
DI
Packages
PDIP/SOIC
1
2
3
4
1
2
3
SOT-23
DS21795A-page 1
(P, SN)
(OT)
6
5
4
8
7
6
5
V
CS
CLK
V
NC
ORG*
V
CC
CC
SS

Related parts for 93LC66

93LC66 Summary of contents

Page 1

... ORG pin to set word size. For dedicated 8-bit communication, the 93AA66A, 93LC66A or 93C66A devices are available, while the 93AA66B, 93LC66B and 93C66B devices provide dedicated 16-bit communication. Advanced CMOS technology makes these devices ideal for low power, non-volatile memory applications ...

Page 2

... ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† .............................................................................................................................................................................7.0V SS All inputs and outputs w.r.t. V ......................................................................................................... -0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins ......................................................................................................................................................≥ † NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied ...

Page 3

... AC CHARACTERISTICS All parameters apply over the specified ranges unless otherwise noted. Param. Symbol Parameter No. CLK A1 F Clock frequency CKH A2 T Clock high time CKL A3 T Clock low time CSS A4 T Chip select setup time CSH A5 T Chip select hold time ...

Page 4

... FIGURE 1-1: SYNCHRONOUS DATA TIMING CSS CLK IL V DIS (READ (PROGRAM Note relative to CS. TABLE 1-1: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX66B OR 93XX66C WITH ORG = 1) Instruction SB Opcode ERASE ERAL EWDS EWEN READ WRITE WRAL TABLE 1-2: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX66A OR 93XX66C WITH ORG = 0) ...

Page 5

... FUNCTIONAL DESCRIPTION When the ORG* pin is connected to V organization is selected. When it is connected to ground, the (x8) organization is selected. Instructions, addresses and write data are clocked into the DI pin on the rising edge of the clock (CLK). The DO pin is normally held in a HIGH-Z state except when reading data from the device, or when checking the READY/ BUSY status during a programming operation ...

Page 6

... ERASE The ERASE instruction forces all data bits of the speci- fied address to the logical “1” state brought low following the loading of the last address bit. This falling edge of the CS pin initiates the self-timed program- ming cycle, except on ‘93C’ devices where the rising edge of CLK before the last address bit initiates the write cycle ...

Page 7

... ERASE ALL (ERAL) The Erase All (ERAL) instruction will erase the entire memory array to the logical “1” state. The ERAL cycle is identical to the ERASE cycle, except for the different opcode. The ERAL cycle is completely self-timed and commences at the falling edge of the CS, except on ‘ ...

Page 8

... ERASE/WRITE DISABLE And ENABLE (EWDS/EWEN) The 93XX66A/B/C powers up in the ERASE/WRITE Disable (EWDS) state. All Programming modes must be preceded by an ERASE/WRITE Enable (EWEN) instruc- tion. Once the EWEN instruction is executed, program- ming remains enabled until an EWDS instruction is executed or Vcc is removed from the device ...

Page 9

... The WRITE instruction is followed by 8 bits (If ORG is low or A-version devices bits (If ORG pin is high or B-version devices) of data which are written into the specified address. For 93AA66A/B/C and 93LC66A/B/C devices, after the last data bit is clocked into DI, the falling edge of CS initiates the self-timed auto-erase and programming cycle ...

Page 10

... WRITE ALL (WRAL) The Write All (WRAL) instruction will write the entire memory array with the data specified in the command. For 93AA66A/B/C and 93LC66A/B/C devices, after the last data bit is clocked into DI, the falling edge of CS initiates the self-timed auto-erase and programming cycle ...

Page 11

... PIN DESCRIPTIONS TABLE 3-1: PIN DESCRIPTIONS SOIC/PDIP/ Name MSOP/TSSOP CS 1 CLK ORG/ 3.1 Chip Select (CS) A high level selects the device; a low level deselects the device and forces it into Standby mode. However, a programming cycle which is already in progress will be completed, regardless of the Chip Select (CS) input signal ...

Page 12

... PACKAGING INFORMATION 4.1 Package Marking Information 8-Lead MSOP (150 mil) XXXXXXT YWWNNN 6-Lead SOT-23 XXNN 8-Lead PDIP XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC XXXXXXXX XXXXYYWW NNN 8-Lead TSSOP XXXX TYWW NNN Legend: XX...X Part number T Temperature Blank Commercial ...

Page 13

... Plastic Micro Small Outline Package (MS) (MSOP (F) β Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint (Reference) Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...

Page 14

... Plastic Small Outline Transistor (CH) (SOT-23 β Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...

Page 15

... Plastic Dual In-line (P) – 300 mil (PDIP β eB Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width ...

Page 16

... Plastic Small Outline (SN) – Narrow, 150 mil (SOIC 45° c β Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness ...

Page 17

... Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP β Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width ...

Page 18

... NOTES: DS21795A-page 18  2003 Microchip Technology Inc. ...

Page 19

... ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape Internet Explorer ...

Page 20

... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: 93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...

Page 21

... Microwire Serial EEPROM 93AA66B: 4K 1.8V Microwire Serial EEPROM 93AA66C: 4K 1.8V Microwire Serial EEPROM w/ORG 93LC66A: 4K 2.5V Microwire Serial EEPROM 93LC66B: 4K 2.5V Microwire Serial EEPROM 93LC66C: 4K 2.5V Microwire Serial EEPROM w/ORG 93C66A: 4K 5.0V Microwire Serial EEPROM 93C66B: 4K 5.0V Microwire Serial EEPROM 93C66C ...

Page 22

... NOTES: DS21795A-page 22  2003 Microchip Technology Inc. ...

Page 23

... Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.  2003 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, K MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U ...

Page 24

... Italy Microchip Technology SRL Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 03/25/03  2003 Microchip Technology Inc. ...

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