ISPLSI2064VE-135LT44I Lattice Semiconductor Corp., ISPLSI2064VE-135LT44I Datasheet

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ISPLSI2064VE-135LT44I

Manufacturer Part Number
ISPLSI2064VE-135LT44I
Description
135 MHz 3.3V in-system prommable superFAST high density PLD
Manufacturer
Lattice Semiconductor Corp.
Datasheet

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ISPLSI2064VE-135LT44I
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• SuperFAST HIGH DENSITY PROGRAMMABLE LOGIC
• 3.3V LOW VOLTAGE 2064 ARCHITECTURE
• HIGH-PERFORMANCE E
• IN-SYSTEM PROGRAMMABLE
• 100% IEEE 1149.1 BOUNDARY SCAN TESTABLE
• THE EASE OF USE AND FAST SYSTEM SPEED OF
• LEAD-FREE PACKAGE OPTIONS
Copyright © 2004 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
2064ve_09
Features
— 2000 PLD Gates
— 64 and 32 I/O Pin Versions, Four Dedicated Inputs
— 64 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
— Small Logic Block Size for Random Logic
— 100% Functional, JEDEC and Pinout Compatible with
— Interfaces with Standard 5V TTL Devices
— Electrically Erasable and Reprogrammable
— Non-Volatile
— 100% Tested at Time of Manufacture
— Unused Product Term Shutdown Saves Power
— 3.3V In-System Programmability (ISP™) Using
— Open-Drain Output Option for Flexible Bus Interface
— Increased Manufacturing Yields, Reduced Time-to-
— Reprogram Soldered Devices for Faster Prototyping
PLDs WITH THE DENSITY AND FLEXIBILITY OF FPGAs
— Enhanced Pin Locking Capability
— Three Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Programmable Output Slew Rate Control
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
f
t
Boundary Scan Test Access Port (TAP)
Capability, Allowing Easy Implementation of Wired-OR
or Bus Arbitration Logic
Market and Improved Product Quality
Machines, Address Decoders, etc.
ispLSI 2064V Devices
Interconnectivity
max = 280MHz Maximum Operating Frequency
pd = 3.5ns Propagation Delay
2
CMOS
®
TECHNOLOGY
1
The ispLSI 2064VE is a High Density Programmable
Logic Device available in 64 and 32 I/O-pin versions. The
device contains 64 Registers, four Dedicated Input pins,
three Dedicated Clock Input pins, two dedicated Global
OE input pins and a Global Routing Pool (GRP). The
GRP provides complete interconnectivity between all of
these elements. The ispLSI 2064VE features in-system
programmability through the Boundary Scan Test Ac-
cess Port (TAP) and is 100% IEEE 1149.1 Boundary
Scan Testable. The ispLSI 2064VE offers non-volatile
reprogrammability of the logic, as well as the intercon-
nect, to provide truly reconfigurable systems.
The basic unit of logic on the ispLSI 2064VE device is the
Generic Logic Block (GLB). The GLBs are labeled A0,
A1…B7 (see Figure 1). There are a total of 16 GLBs in the
ispLSI 2064VE device. Each GLB is made up of four
macrocells. Each GLB has 18 inputs, a programmable
AND/OR/Exclusive OR array, and four outputs which can
be configured to be either combinatorial or registered.
Inputs to the GLB come from the GRP and dedicated
inputs. All of the GLB outputs are brought back into the
GRP so that they can be connected to the inputs of any
GLB on the device.
Functional Block Diagram
Description
A0
A2
A3
A1
High Density SuperFAST™ PLD
A4
GLB
ispLSI
3.3V In-System Programmable
Output Routing Pool (ORP)
B7
A5
Global Routing Pool
Output Routing Pool (ORP)
Logic
Array
Input Bus
(GRP)
D Q
D Q
D Q
D Q
B6
Input Bus
A6
®
B5
A7
2064VE
B4
August 2004
B0
B3
B2
B1
0139A/2064V

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ISPLSI2064VE-135LT44I Summary of contents

Page 1

... Interconnectivity • LEAD-FREE PACKAGE OPTIONS Copyright © 2004 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. ...

Page 2

Functional Block Diagram Figure 1. ispLSI 2064VE Functional Block Diagram (64-I/O and 32-I/O Versions) Input Bus Output Routing Pool (ORP) Megablock I I/O 2 I/O 3 I/O 4 I/O 5 Global Routing Pool ...

Page 3

Absolute Maximum Ratings Supply Voltage V cc ................................................... Input Voltage Applied ..................................... -0.5 to +5.6V Off-State Output Voltage Applied .................. -0.5 to +5.6V Storage Temperature ..................................... -65 to 150°C Case Temp. with Power Applied .................... -55 to 125°C Max. Junction ...

Page 4

Switching Test Conditions Input Pulse Levels Input Rise and Fall Time Input Timing Reference Levels Output Timing Reference Levels Output Load 3-state levels are measured 0.5V from steady-state active level. Output Load Conditions (see Figure 2) TEST CONDITION A Active ...

Page 5

External Timing Parameters 3 TEST PARAMETER # COND Data Propagation Delay, 4PT Bypass, ORP Bypass pd1 Data Propagation Delay pd2 f max A 3 Clock Frequency with Internal Feedback f – 4 Clock Frequency ...

Page 6

External Timing Parameters 3 TEST PARAMETER # COND Data Propagation Delay, 4PT Bypass, ORP Bypass pd1 Data Propagation Delay pd2 Clock Frequency with Internal Feedback max f – 4 Clock Frequency ...

Page 7

Internal Timing Parameters 2 PARAMETER # Inputs Input Buffer Delay t 21 Dedicated Input Delay din GRP t grp 22 GRP Delay GLB Product Term Bypass Path Delay (Combinatorial) 4ptbpc Product ...

Page 8

Internal Timing Parameters 2 PARAMETER # Inputs t 20 Input Buffer Delay Dedicated Input Delay din GRP t 22 GRP Delay grp GLB Product Term Bypass Path Delay (Combinatorial) 4ptbpc Product ...

Page 9

Timing Model I/O Cell Ded. In #21 I/O Delay I/O Pin #20 (Input) #45 Reset Y0,1,2 GOE 0 Derivations of su, h and co from the Product Term Clock Logic + Reg ...

Page 10

Power Consumption Power consumption in the ispLSI 2064VE device de- pends on two primary factors: the speed at which the device is operating and the number of Product Terms Figure 3. Typical Device Power Consumption vs fmax I CC can ...

Page 11

Signal Descriptions Signal Name RESET Active Low (0) Reset pin resets all the registers in the device. GOE 0, GOE1 Global Output Enable input pins. Y0, Y1, Y2 Dedicated Clock Input – These clock inputs are connected to one ...

Page 12

Signal Locations ...

Page 13

Signal Configuration ispLSI 2064VE 100-Ball caBGA Signal Diagram (0.8mm Ball Pitch/10.0 x 10.0mm Body Size I/O I I/O I I/O I I/O I ...

Page 14

Pin Configuration ispLSI 2064VE 100-Pin TQFP Pinout Diagram (0.5mm Lead Pitch/14.0 x 14.0mm Body Size ...

Page 15

Pin Configuration ispLSI 2064VE 44-Pin PLCC Pinout Diagram (0.05in Lead Pitch/0.65 x 0.65in Body Size) I/O 28 I/O 29 I/O 30 I/O 31 GOE1/Y0 VCC BSCAN TDI/IN 0 I/O 0 I/O 1 I/O 2 Pin Configuration ispLSI 2064VE 44-Pin TQFP ...

Page 16

Part Number Description ispLSI 2064VE XXX X XXXXX Device Family Device Number Speed f 280 = 280 MHz max f 200 = 200 MHz max f 135 = 135 MHz max f 100 = 100 MHz max ispLSI 2064VE Ordering ...

Page 17

Ordering Information (Cont.) Lead-Free Packaging FAMILY fmax (MHz) tpd (ns) 280 3.5 280 3.5 200 4.5 200 4.5 ispLSI 135 7.5 135 7.5 100 10 100 10 FAMILY fmax (MHz) tpd (ns) 135 7.5 ispLSI 135 7.5 Specifications ...

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