IRF1902TR International Rectifier Corp., IRF1902TR Datasheet

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IRF1902TR

Manufacturer Part Number
IRF1902TR
Description
Manufacturer
International Rectifier Corp.
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF1902TR
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRF1902TRPBF
Manufacturer:
IR
Quantity:
20 000
l
l
l
l
Absolute Maximum Ratings
Thermal Resistance
These N-Channel
International Rectifier utilize advanced processing
techniques to achieve the extremely low on-resistance
per silicon area. This benefit provides the designer
with an extremely efficient device for use in battery
and load management applications..
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple
devices can be used in an application with dramatically
reduced board space. The package is designed for
vapor phase, infrared, or wave soldering techniques.
Description
www.irf.com
V
I
I
I
P
P
V
T
Symbol
R
R
D
D
DM
DS
D
D
GS
J,
@ T
@ T
JL
JA
Ultra Low On-Resistance
N-Channel MOSFET
Surface Mount
Available in Tape & Reel
@T
@T
T
STG
A
A
A
A
= 70°C
= 25°C
= 25°C
= 70°C
Drain- Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
Junction-to-Drain Lead
Junction-to-Ambient
HEXFET
power MOSFET
Parameter
Parameter
ƒ
ƒ
ƒ
GS
GS
s from
@ 4.5V
@ 4.5V
G
S
S
S
V
20V
DSS
1
2
3
4
T o p V ie w
Typ.
–––
–––
R
HEXFET
DS(on)
170@V
8
-55 to + 150
7
6
5
85@V
Max.
0.02
± 12
4.2
3.4
2.5
1.6
20
17
D
D
D
D
A
A
GS
max (m
GS
®
IRF1902
= 4.5V
= 2.7V
Power MOSFET
Max.
20
50
SO-8
PD - 94282A
4.0A
3.2A
mW/°C
I
Units
Units
°C/W
D
W
°C
V
A
V
11/15/01
1

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IRF1902TR Summary of contents

Page 1

Ultra Low On-Resistance N-Channel MOSFET l Surface Mount l l Available in Tape & Reel Description These N-Channel HEXFET power MOSFET International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides ...

Page 2

IRF1902 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source ...

Page 3

VGS TOP 7.0V 5.0V 4.5V 3.5V 3.0V 2.7V 2.5V 10 BOTTOM 2.25V 2.25V 1 20µs PULSE WIDTH Tj = 25°C 0.1 0 Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 100. 25°C ...

Page 4

IRF1902 10000 0V, C iss = rss = oss = 1000 Ciss Coss 100 Crss ...

Page 5

T , Case Temperature C Fig 9. Maximum Drain Current Vs. Case Temperature 100 D = 0.50 0.20 10 0.10 0.05 0.02 1 0.01  SINGLE PULSE (THERMAL RESPONSE) 0.1 ...

Page 6

IRF1902 0.15 0.14 0.13 0.12 0.11 0.10 0.09 0. 4.2A 0.07 0.06 0.05 0.04 2.0 4.0 V GS, Gate -to -Source Voltage (V) Fig 12. Typical On-Resistance Vs. Gate Voltage ...

Page 7

250µA 1.0 0.5 -75 -50 - Temperature ( °C ) Fig 15. Typical Threshold Voltage Vs. Junction Temperature www.irf.com 100 125 150 ...

Page 8

IRF1902 SO-8 Package Details 0.25 [.010 NOT ES: 1. DIMENSIONING & T OLERANCING PER AS ME Y14.5M-1994. 2. ...

Page 9

SO-8 Tape and Reel . . ...

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