24AA64 Microchip Technology Inc., 24AA64 Datasheet

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24AA64

Manufacturer Part Number
24AA64
Description
Manufacturer
Microchip Technology Inc.
Datasheet

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Device Selection Table
Features:
• Single-supply with operation down to 1.7V for
• Low-power CMOS technology:
• 2-wire serial interface, I
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz and 400 kHz clock compatibility
• 1 MHz clock for FC versions
• Page write time 5 ms, typical
• Self-timed erase/write cycle
• 32-byte page write buffer
• Hardware write-protect
• ESD protection > 4,000V
• More than 1 million erase/write cycles
• Data retention > 200 years
• Factory programming available
• Packages include 8-lead PDIP, SOIC, TSSOP,
• Pb-free and RoHS compliant
• Temperature ranges:
© 2007 Microchip Technology Inc.
* 24XX64 is used in this document as a generic part
number for the 24AA64/24LC64/24FC64 devices.
Note 1:
Number
24AA64/24FC64 devices, 2.5V for 24LC64
devices
- Active current 1 mA, typical
- Standby current 1 μA, typical
MSOP and DFN
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
24AA64
24LC64
24FC64
Part
2:
100 kHz for V
400 kHz for V
Range
1.7-5.5
2.5-5.5
1.7-5.5
V
CC
CC
CC
2
C™ compatible
Max. Clock
<2.5V
<2.5V
Frequency
400 kHz
1 MHz
400 kHz
64K I
(2)
(1)
24AA64/24LC64/24FC64
2
Ranges
Temp.
C
I, E
I
I
Serial EEPROM
Description:
The Microchip Technology Inc. 24AA64/24LC64/
24FC64 (24XX64*) is a 64 Kbit Electrically Erasable
PROM. The device is organized as a single block of 8K
x 8-bit memory with a 2-wire serial interface. Low-volt-
age design permits operation down to 1.7V, with
standby and active currents of only 1 μA and 1 mA,
respectively. It has been developed for advanced, low-
power applications such as personal communications
or data acquisition. The 24XX64 also has a page write
capability for up to 32 bytes of data. Functional address
lines allow up to eight devices on the same bus, for up
to 512 Kbits address space. The 24XX64 is available in
the standard 8-pin PDIP, surface mount SOIC, TSSOP,
DFN and MSOP packages.
Package Types
Block Diagram
V
SDA
A0
A1
A2
SS
I/O
Control
V
V
Logic
CC
SS
I/O
1
2
3
4
SCL
PDIP, MSOP
WP
Memory
V
Control
8
7
6
5
A2
A0
A1
SS
Logic
1
2
3
4
V
WP
SCL
SDA
CC
DFN
V
A0
A1
A2
SS
XDEC
8
7
6
5
V
WP
SCL
SDA
SOIC, TSSOP
1
2
3
4
CC
DS21189L-page 1
Sense Amp.
R/W Control
Generator
EEPROM
Latches
Array
YDEC
Page
HV
8
7
6
5
V
WP
SCL
SDA
CC

Related parts for 24AA64

24AA64 Summary of contents

Page 1

... Microchip Technology Inc. 24AA64/24LC64/24FC64 2 ™ C Serial EEPROM Description: Temp. The Microchip Technology Inc. 24AA64/24LC64/ Ranges 24FC64 (24XX64 Kbit Electrically Erasable PROM. The device is organized as a single block 8-bit memory with a 2-wire serial interface. Low-volt age design permits operation down to 1.7V, with standby and active currents of only 1 μ ...

Page 2

... ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................6.5V CC All inputs and outputs w.r.t. V ......................................................................................................... -0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins ......................................................................................................................................................≥ † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device ...

Page 3

... This eliminates the need for This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site at www.microchip.com. © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 Electrical Characteristics: Industrial (I +1.7V to 5.5V T ...

Page 4

... AC CHARACTERISTICS Param. Sym. Characteristic No Output valid from clock AA (Note Bus free time: Time the bus BUF must be free before a new transmission can start 15 T Output fall time from V OF minimum to V maximum IL ≤ 100 Input filter spike suppression ...

Page 5

... SCL SDA Start Condition © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 3.4 Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal ...

Page 6

... Device Addressing A control byte is the first byte received following the Start condition from the master device (Figure 3-2). The control byte consists of a four-bit control code. For the 24XX64, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0) ...

Page 7

... After a byte Write command, the internal address counter will point to the address location following the one that was just written. © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 4.2 Page Write The write control byte, word address and the first data byte are transmitted to the 24XX64 in the same way byte write ...

Page 8

... FIGURE 4-1: BYTE WRITE S Bus Activity T Control Master A Byte SDA Line Bus Activity x = “don’t care” bit FIGURE 4-2: PAGE WRITE S T Control Bus Activity A Byte Master SDA Line ...

Page 9

... If the cycle is complete, the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 5-1 for a flow diagram of this operation. © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 FIGURE 5-1: ACKNOWLEDGE POLLING FLOW Send Write Command ...

Page 10

... READ OPERATION Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the control byte is set to one. There are three basic types of read operations: current address read, random read and sequential read. 6.1 Current Address Read ...

Page 11

... Bus Activity x = “don’t care” bit FIGURE 6-3: SEQUENTIAL READ Bus Activity Control Data n Master Byte SDA Line Bus Activity © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 S T Address Address A High Byte Low Byte ...

Page 12

... PIN DESCRIPTIONS The descriptions of the pins are listed in Table 7-1. TABLE 7-1: PIN FUNCTION TABLE Name PDIP SOIC SDA 5 5 SCL 7.1 A0, A1, A2 Chip Address Inputs The A0, A1 and A2 inputs are used by the 24XX64 for multiple device operation ...

Page 13

... SOIC (3.90 mm) XXXXXXXT XXXXYYWW NNN 8-Lead SOIC (5.28 mm) XXXXXXXX T/XXXXXX YYWWNNN 8-Lead TSSOP XXXX TYWW NNN 8-Lead MSOP XXXXXT YWWNNN 8-Lead 2x3 DFN XXX YWW NN © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 Example: 24LC64 e I/P 3 13F 0527 Example: 24LC64I 0527 13F Example: 24LC64 e I/SM 3 ...

Page 14

... Line Marking Codes Part Number TSSOP MSOP 24AA64 4AB 4A64T 24LC64 4LB 4L64T 24FC64 4FB 4F64T Note Temperature grade (I, E) Legend: XX...X Part number or part number code T Temperature ( Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘ ...

Page 15

... Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 ...

Page 16

... Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch Overall Height Molded Package Thickness § Standoff Overall Width ...

Page 17

... Mold Draft Angle Top Mold Draft Angle Bottom Notes: 1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 β Units ...

Page 18

... Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width ...

Page 19

... Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 ...

Page 20

... Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE TOP VIEW A3 Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length ...

Page 21

... Added DFN package. Revision K Revised Sections 7.1 and 7.4. Revision L Added 24FC64 Part; Revised Device Selection Table; Revised Features Section; Deleted Rotated TSSOP Package; Revised Table 1-2; Revised Table 7-1; Revised Package Information; Replaced Package Drawings; Revised Product ID Section. © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 DS21189L-page 21 ...

Page 22

... NOTES: DS21189L-page 22 © 2007 Microchip Technology Inc. ...

Page 23

... To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • ...

Page 24

... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: 24AA64/24LC64/24FC64 Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...

Page 25

... Plastic Micro Small Outline (MSOP), 8-lead MC = 2x3 DFN, 8-lead © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 Examples: 24AA64-I/P: a) 1.7V, PDIP package b) 24AA64-I/SN: Industrial Temperature, 2 1.7V, SOIC package C Serial EEPROM 2 24AA64-I/SM: Industrial Temperature, C Serial EEPROM c) 1.7V Serial EEPROM d) 24AA64T-I/ST: Industrial Temperature Serial EEPROM 1.7V, e) 24LC64-I/P: Industrial Temperature, 2.5V, PDIP package f) 24LC64-E/SN: Extended Temperature, 2 ...

Page 26

... NOTES: DS21189L-page 26 © 2007 Microchip Technology Inc. ...

Page 27

... Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. © 2007 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, K ...

Page 28

... Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2007 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris ...

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