TDA1566TH/N1C,118 NXP Semiconductors, TDA1566TH/N1C,118 Datasheet

IC AMP AUDIO PWR 150W AB 24HSOP

TDA1566TH/N1C,118

Manufacturer Part Number
TDA1566TH/N1C,118
Description
IC AMP AUDIO PWR 150W AB 24HSOP
Manufacturer
NXP Semiconductors
Type
Class ABr
Datasheet

Specifications of TDA1566TH/N1C,118

Output Type
1-Channel (Mono) or 2-Channel (Stereo)
Package / Case
24-HSOP
Max Output Power X Channels @ Load
150W x 1 @ 1 Ohm; 75W x 2 @ 2 Ohm
Voltage - Supply
6.5 V ~ 18 V
Features
Depop, I²C, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type
Surface Mount
Product
Class-AB
Output Power
92 W
Available Set Gain
26 dB
Common Mode Rejection Ratio (min)
60 dB
Thd Plus Noise
0.2 %
Operating Supply Voltage
14.4 V
Maximum Power Dissipation
80000 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Audio Load Resistance
4 Ohms
Input Signal Type
Differential
Minimum Operating Temperature
- 40 C
Output Signal Type
Differential
Supply Type
Single
Supply Voltage (max)
18 V
Operational Class
Class-AB
Audio Amplifier Output Configuration
2-Channel Stereo
Audio Amplifier Function
Speaker
Single Supply Voltage (typ)
14.4V
Dual Supply Voltage (typ)
Not RequiredV
Power Supply Requirement
Single
Power Dissipation
80W
Rail/rail I/o Type
No
Single Supply Voltage (max)
18V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
24
Package Type
HSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935284624118
TDA1566TH/N1C-T
TDA1566TH/N1C-T
1. General description
2. Features
The TDA1566 is a car audio power amplifier with a complementary output stage realized
in BCDMOS. The TDA1566 has two Bridge Tied Load (BTL) output stages and comes in a
HSOP24 or DBS27P package.
The TDA1566 can be controlled with or without I
per channel and diagnostic trigger levels can be selected. Failure conditions as well as
load identification can be read with I
outputs of a BTL channel are connected with a DC or AC load and discriminates between
a speaker load, a line driver load and an open (unconnected) load.
The TDA1566 can be configured in a single BTL mode and drive a 1
BTL mode it is necessary to connect on the Printed-Circuit Board (PCB) the outputs of
both BTL channels in parallel.
I
I
I
I
I
I
I
I
I
I
I
I
I
TDA1566
I
92 W/1
Rev. 02 — 20 August 2007
Operates in I
TH version: four I
addresses controlled by one pin
Two 4
Low offset
Pop free off/standby/mute/operating mode transitions
Speaker fault detection
Selectable gain (26 dB and 16 dB)
In I
Independent short-circuit protection per channel
Loss of ground and open V
All outputs short-circuit proof to V
All pins short-circuit proof to ground
Temperature controlled gain reduction at high junction temperatures
2
N
N
N
N
N
N
C-bus controlled dual channel 46 W/2 , single channel
2
DC load detection: open, short and speaker or line driver present
AC load (tweeter) detection
Programmable trigger levels for DC and AC load detection
Per channel programmable gain (26 dB and 16 dB, selectable per channel)
Selectable diagnostic levels for clip detection and thermal pre-warning
Selectable information on the DIAG pin for clip information of each channel
separately and independent enabling of thermal-, offset- or load fault
C-bus mode:
or 2
amplifier with load diagnostic features
2
C-bus mode and non-I
capable BTL channels or one 1
2
C-bus addresses controlled by two pins; J version: two I
P
safe
2
P
C-bus. The load identification detects whether the
, GND and across the load
2
C-bus mode
2
C-bus. With I
capable BTL channel
2
C-bus control gain settings
Product data sheet
load. For the single
2
C-bus

Related parts for TDA1566TH/N1C,118

TDA1566TH/N1C,118 Summary of contents

Page 1

TDA1566 2 I C-bus controlled dual channel 46 W/2 , single channel 92 W/1 Rev. 02 — 20 August 2007 1. General description The TDA1566 is a car audio power amplifier with a complementary output stage realized in BCDMOS. The ...

Page 2

... NXP Semiconductors I Fault condition diagnosis per channel: short to ground, short to supply, shorted lead and speaker fault (wrongly connected) I Low battery voltage detection I TH version: pin compatible with the TDA8566TH1 3. Ordering information Table 1. Type number Package TDA1566TH TDA1566J 4. Block diagram Fig 1. Block diagram (TDA1566TH) ...

Page 3

... NXP Semiconductors Fig 2. Block diagram (TDA1566J) TDA1566_2 Product data sheet 2 I C-bus controlled dual channel/single channel amplifier ADS1 SDA MODE C-BUS SELECT 3 IN1 MUTE 26 dB IN1 MUTE 22 IN2 MUTE 26 dB IN2 MUTE 24 SVR Rev. 02 — 20 August 2007 TDA1566 V V SCL ...

Page 4

... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 3. Pin configuration for TDA1566TH (top view) TDA1566_2 Product data sheet 2 I C-bus controlled dual channel/single channel amplifier 24 TAB PROG 22 OUT2 21 20 PGND2 OUT2 19 TDA1566TH OUT1 18 17 PGND1 16 OUT1 1OHM CLIP 001aad006 Rev. 02 — 20 August 2007 ...

Page 5

... NXP Semiconductors Fig 4. Pin configuration for non mounting base TDA1566J (front) 5.2 Pin description Table 2. Symbol DIAG IN2+ IN2 SVR SCL SDA EN ADS2 ADS1 IN1+ IN1 SGND TDA1566_2 Product data sheet 2 I C-bus controlled dual channel/single channel amplifi ADS1 ...

Page 6

... NXP Semiconductors Table 2. Symbol CLIP V P1 1OHM OUT1+ PGND1 OUT1 OUT2+ PGND2 OUT2 PROG V P2 TAB Table 3. Symbol EN ADS1 IN1+ IN1 SGND DIAG V P1 1OHM n.c. OUT1+ n.c. PGND1 OUT1 n.c. OUT2+ PGND2 n.c. OUT2 n.c. PROG V P2 IN2+ IN2 SVR ...

Page 7

... NXP Semiconductors Table 3. Symbol SCL SDA TAB 6. Functional description 6.1 General Naming conventions used in this document: • Reference to bits in instruction bytes: IBx[Dy] refers to bit Dy of instruction byte x • Reference to bits in data bytes: DBx[Dy] refers to bit Dy of data byte x 6.1.1 Mode selection The ADS1 pin selects the I Section 6 ...

Page 8

... NXP Semiconductors Fig 5. Enable pin mode switching in I 6.1.2 Gain selection The TDA1566 features and gain setting. The 16 dB setting is referred to as line driver mode, the 26 dB setting is referred to as amplifier mode. the gain is selected. Table 6. Gain select 2 I C-bus ...

Page 9

... NXP Semiconductors 6.1.3 Balanced and unbalanced input sources The TDA1566 accepts balanced as well as unbalanced input signals. show the required hard or software setting and connection. Note that the unbalanced input source should be connected to the positive BTL channel input. Note that the J version accepts in non-I input source ...

Page 10

... NXP Semiconductors 6.1.5 Mute speed setting C-bus mode the amplifier can be muted slow (20 ms) or fast (0.1 ms). The mute speed is selected with IB2[D2]. See Section 6.4.2 mode transitions where slow and fast mute are applied. The operation modes are described in Table 10. ...

Page 11

... NXP Semiconductors R = 0.1 trip1 R = 1.05 trip2 R and R trip1 load will be interpreted as an amplifier load. The result of the DC load detection is stored in DB1[D4] and DB1[D5] for channel 1 and in DB2[D4] and DB2[D5] for channel 2, see Table 12. Open load bits DB1[D4] and DB2[D4 Don’t care Note that the DC load bits are only valid if DB3[D3 ...

Page 12

... NXP Semiconductors For instance at an output voltage peak the total impedance must be less than 10 to detect the AC coupled load or more than 13.4 detected. Values between 10 load detection is shown in DB1[D7] for channel 1 and DB2[D7] for channel 2. When IB1[D2 the AC load detection is enabled. The AC load detection can only be performed after the amplifi ...

Page 13

... NXP Semiconductors Note that in the J version no CLIP pin is available. Table 14. Diagnostic POR Low V P Clip detection Temperature pre-warning Short Speaker protection Offset detection Maximum temperature protection Load detection Following diagnostic information is only available via I • DC and AC load detection results, see • ...

Page 14

... NXP Semiconductors 6.3.4 Speaker protection To prevent damage of the speaker when one side of the speaker is connected to ground, see Figure Fig 9. Speaker protection condition When in one BTL channel the absolute value of the current through the output terminals differ The ‘speaker protection active’ diagnosis options for I listed in 6 ...

Page 15

... NXP Semiconductors offset threshold DB1[D2] read DB1[D2] = offset threshold DB1[D2] read DB1[D2] = Fig 10. Offset detection 6.4 I C-bus operation 2 6.4.1 I C-bus address with hardware address select Table 16. ADS1 open GND open [ write to TDA1566TH read from TDA1566TH. Table 17. ADS1 open GND [ write to TDA1566J read from TDA1566J. ...

Page 16

... NXP Semiconductors 6.4.2 Instruction bytes If R/W bit = 0, the TDA1566 expects 3 instruction bytes; IB1, IB2 and IB3. After a power-on reset, all instruction bits are set to zero channel 1 are used. The instruction bits labelled ‘reserved for test’ should be set to zero. Table 18. ...

Page 17

... NXP Semiconductors Table 19. Bit 6.5 Timing waveforms 6.5.1 Start-up and shutdown To prevent switch-on or switch-off pop noise, the capacitor on the SVR pin C for smooth start-up and shutdown. During start-up and shutdown the output voltage tracks the SVR voltage. With IB1[D7 the time constant made with the SVR capacitor can be increased to reduce turn on transients at the load ...

Page 18

... NXP Semiconductors For optimized pop performance it is recommended to keep the amplifier in mute until the SVR voltage has reached its final level. When the amplifier is switched off by pulling the EN pin LOW the amplifier is muted (fast mute) and the capacitor on the SVR pin will be discharged. With an SVR capacitor the off current is reached 2 s after the EN pin is switched to zero ...

Page 19

... NXP Semiconductors Table 20. Step 6.5.2 Engine start The DC-output voltage of the amplifier follows the voltage on the SVR pin. On the SVR pin a capacitor is connected which is used for start-up and shutdown timing as well as for DC load detection. If the supply voltage drops during engine start below 8.6 V the SVR capacitor will be discharged and the fast mute is activated to prevent audible transients at the output ...

Page 20

... NXP Semiconductors Table 21. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter I repetitive peak output current ORM I peak back gate current BGM V voltage on pin 1OHM 1OHM V voltage on pin voltage on pin IN1 IN1- V voltage on pin IN1+ IN1+ ...

Page 21

... NXP Semiconductors Table 21. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V electrostatic discharge voltage esd [1] The voltage on this pin is clamped by an ESD protection. If this pin is connected to V [2] The voltage on this pin is clamped by an ESD protection. ...

Page 22

... NXP Semiconductors Table 23. Characteristics …continued Refer to test circuit (see Figure 22); V otherwise specified. Symbol Parameter V output offset voltage O(offset) Mode select pin EN (see Figure V voltage on pin current on pin EN EN Start-up, shutdown and mute timing (see t wake-up time wake t mute off delay time ...

Page 23

... NXP Semiconductors Table 23. Characteristics …continued Refer to test circuit (see Figure 22); V otherwise specified. Symbol Parameter t mute to on delay time I d(mute-on) t slow mute delay time d(slow_mute) t fast mute delay time d(fast_mute) t time from amplifier (on-SVR) switch-on to SVR above C-bus interface and 1 ...

Page 24

... NXP Semiconductors Table 23. Characteristics …continued Refer to test circuit (see Figure 22); V otherwise specified. Symbol Parameter V HIGH-level input IH(SDA) voltage on pin SDA V LOW-level output OL(SDA) voltage on pin SDA f clock frequency clk V voltage on pin 1OHM 1OHM I current on pin 1OHM 1OHM I current on pin SCL ...

Page 25

... NXP Semiconductors Table 23. Characteristics …continued Refer to test circuit (see Figure 22); V otherwise specified. Symbol Parameter T average junction j(AV)(G( 0.5dB)) temperature for 0.5 dB gain reduction T difference in junction j(warn1-mute) temperature between pre-warning 1 and mute T difference in junction j(G( 0.5-40dB)) temperature between 0.5 dB and 40 dB gain ...

Page 26

... NXP Semiconductors Table 23. Characteristics …continued Refer to test circuit (see Figure 22); V otherwise specified. Symbol Parameter Amplifier P output power o THD total harmonic distortion TDA1566_2 Product data sheet 2 I C-bus controlled dual channel/single channel amplifi < amb Conditions 14 THD = 0 ...

Page 27

... NXP Semiconductors Table 23. Characteristics …continued Refer to test circuit (see Figure 22); V otherwise specified. Symbol Parameter channel separation cs SVRR supply voltage rejection ratio CMRR common-mode rejection ratio V maximum cm(max)(rms) common-mode voltage (RMS value) V RMS noise output n(o)(RMS) voltage G voltage gain amplifier ...

Page 28

... NXP Semiconductors 9.1 Performance diagrams All graphs THD (%) kHz measurement filter kHz. ( kHz. ( 100 Hz. Fig 12. THD as a function of output power 10 THD (%) 100 ; 80 kHz measurement filter kHz. L Fig 14. THD as a function of output voltage in line driver mode TDA1566_2 Product data sheet 2 I C-bus controlled dual channel/single channel amplifi ...

Page 29

... NXP Semiconductors 0 SVRR (dB) mute 100 SVR Fig 16. SVRR as a function of frequency (mute) TDA1566_2 Product data sheet 2 I C-bus controlled dual channel/single channel amplifier 001aad023 50 cs (dB 100 (Hz Fig 17. Channel separation as a function of frequency Rev. 02 — 20 August 2007 TDA1566 001aad024 (1), (2) (3) (3) ...

Page 30

... F Rs Zobel Zobel temperature/clip output LED R 3 1.5 k enable sense Jp device off device device operating mute legacy mode control TDA1566TH stereo NXP Semiconductors SRK ver. 1e © NXP B.V. 2007. All rights reserved. GND + GND 001aad688 ...

Page 31

... NXP Semiconductors Fig 19. PCB layout TDA1566TH, components bottom TDA1566_2 Product data sheet 2 I C-bus controlled dual channel/single channel amplifier top 1 12 Rev. 02 — 20 August 2007 TDA1566 24 13 001aad696 © NXP B.V. 2007. All rights reserved ...

Page 32

... NXP Semiconductors Fig 20. PCB layout TDA1566J, components top TDA1566_2 Product data sheet 2 I C-bus controlled dual channel/single channel amplifier ADS1 SDA SCL TDA1566J APPL-BOARD- -DB527 7322-448-07651 C11 IN1+ IN1+DC C12 IN1 IN1 DC SGND C13 IN2+ IN2+DC C14 IN2 IN2 DC C7 ...

Page 33

... NXP Semiconductors Fig 21. PCB layout TDA1566J, components bottom TDA1566_2 Product data sheet 2 I C-bus controlled dual channel/single channel amplifi Rev. 02 — 20 August 2007 TDA1566 001aad708 © NXP B.V. 2007. All rights reserved ...

Page 34

... NXP Semiconductors 10. Test information 2200 220 0.5R s 470 nF IN1+ C 0.5V in 0.5V in 470 nF IN1 0. 0.5R s 470 nF IN2 0.5V in 0.5V in 470 nF IN2 0. (1) The 220 nF capacitor should be placed close to the V 2 (2) In non-I C-bus mode the PROG pin should be left unconnected for 26 dB gain selection or connected via a resistor of 1500 to GND for 16 dB gain selection ...

Page 35

... NXP Semiconductors 2200 220 connected to microcontroller 0.5R s 470 nF IN1 0.5V in 0.5V in 470 nF IN1 11 0. 0.5R s 470 nF IN2 0.5V in 0.5V in 470 nF IN2 3 0. (1) The 220 nF capacitor should be placed close to the V (2) R defines the trip levels for the AC and DC load detection. ...

Page 36

... NXP Semiconductors 2200 220 0.5R s 470 nF IN1 0.5V in 0.5V in 470 nF IN1 11 0. 470 nF IN2 470 nF IN2 (1) The 220 nF capacitor should be placed close to the V 2 (2) In non-I C-bus mode the PROG pin should be left unconnected for 26 dB gain selection or connected via a resistor of 1500 to GND for 16 dB gain selection ...

Page 37

... NXP Semiconductors 2200 220 connected to microcontroller 0.5R s 470 nF IN1 0.5V in 0.5V in 470 nF IN1 11 0. 470 nF IN2 470 nF IN2 (1) The 220 nF capacitor should be placed close to the V (2) R defines the trip levels for the AC and DC load detection. PROG (3) CLIP is not available in the DBS27P version. ...

Page 38

... NXP Semiconductors 11. Package outline HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height pin 1 index DIMENSIONS (mm are the original dimensions) A (1) UNIT max. 0.08 0.53 3.5 mm 3.5 0.35 0.04 0.40 3.2 Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...

Page 39

... NXP Semiconductors DBS27P: plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm DIMENSIONS (mm are the original dimensions) (1) UNIT 4.65 0.60 0.5 29 4.35 0.45 0.3 28.8 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT827 Fig 27 ...

Page 40

... NXP Semiconductors 12. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However completely safe you must take normal precautions appropriate to handling integrated circuits. 13. Soldering 13.1 Introduction There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fi ...

Page 41

... NXP Semiconductors packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 24 Table 24. Package thickness (mm) < 2.5 2.5 Table 25. Package thickness (mm) < 1.6 1.6 to 2.5 > 2.5 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during refl ...

Page 42

... NXP Semiconductors 13.3.2 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. ...

Page 43

... NXP Semiconductors Table 26. Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Package Surface mount BGA, HTSSON..T LFBGA, SQFP, SSOP..T VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS [7] PLCC LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN ...

Page 44

... Release date TDA1566_2 20070820 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 23 “Characteristics” TDA1566_1 20060405 ...

Page 45

... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

Page 46

... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Functional description . . . . . . . . . . . . . . . . . . . 7 6.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6.1.1 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 7 6.1.2 Gain selection . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 6.1.2.1 I C-bus mode . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 6.1.2.2 Non-I C-bus mode . . . . . . . . . . . . . . . . . . . . . . 8 6 ...

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