NE58633BS,115 NXP Semiconductors, NE58633BS,115 Datasheet - Page 23

• Manufacturer Part Number: NE58633BS,115
• Description: IC AMP AUDIO .04W STER D 32HVQFN
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of NE58633BS,115

• Output Type: Headphones, 2-Channel (Stereo)
• Package / Case: 32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
• Max Output Power X Channels @ Load: 40mW x 2 @ 16 Ohm
• Voltage - Supply: 0.9 V ~ 1.7 V
• Features: Depop, Differential Inputs, Microphone, Mute, Short-Circuit Protection
• Mounting Type: Surface Mount
• Product: Class-D
• Output Power: 40 mW
• Available Set Gain: 100 dB
• Common Mode Rejection Ratio (min): 30 dB
• Thd Plus Noise: 1 %
• Operating Supply Voltage: 0.9 V to 1.7 V
• Supply Current: 5 mA
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 32 Ohms
• Input Offset Voltage: 1 mV
• Input Signal Type: Differential
• Minimum Operating Temperature: 0 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 1.7 V
• Supply Voltage (min): 0.9 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935283227115; NE58633BS-G; NE58633BS-G

NXP Semiconductors
NE58633_3
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 7.
Table 8.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
8
21.
Rev. 03 — 19 January 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
Noise reduction class-D headphone driver amplifier
3
3
)
)
Figure
350 to 2000
260
250
245
21) than a SnPb process, thus
≥ 350
220
220
245
> 2000
260
245
NE58633
© NXP B.V. 2010. All rights reserved.
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