X25F047 Xicor, X25F047 Datasheet

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X25F047

Manufacturer Part Number
X25F047
Description
X25F047SPI SerialFlash with Block Lock TM Protection
Manufacturer
Xicor
Datasheet
FUNCTIONAL DIAGRAM
4K
FEATURES
• 1MHz Clock Rate
• SPI Modes (0,0 & 1,1)
• 512 x 8 Bits
• Low Power CMOS
• 1.8V to 3.6V or 5V “Univolt” Read and Program
• Block Lock Protection
• Built-in Inadvertent Program Protection
• Self-Timed Program Cycle
• High Reliability
• 8-Lead SOIC Package
• 8-Lead MSOP Package
• 8-Lead TSSOP Package
• 8-Pin Mini-DIP Package
7005-0.9 5/7/97 T4/C0/D1
Xicor, Inc. 1994, 1995, 1996 Patents Pending
—16 Byte Small Sector Program Mode
—<1 A Standby Current
—<3mA Active Current during Program
—<400 A Active Current during Read
Power Supply Versions
—Block Lock Protect 0, any 1/4, 1st 1/2, First or
—Power-Up/Power-Down Protection Circuitry
—Program Enable Latch
—Program Protect Pin
—5ms Program Cycle Time (Typical)
—Endurance: 100,000 Cycles/Byte
—Data Retention: 100 Years
—ESD: 2000V on all pins
Last Sector of SerialFlash Array
SCK
SO
CS
PP
SI
SPI SerialFlash with Block Lock
COMMAND
CONTROL
DECODE
PROGRAM CONTROL LOGIC
LOGIC
AND
X25F047
DECODE
LOGIC
X
1
DESCRIPTION
The X25F047 is a CMOS 4K-bit SerialFlash, internally
organized as 512 x 8. The X25F047 features a Serial
Peripheral Interface (SPI) and software protocol
allowing operation on a simple four-wire bus. The bus
signals are a clock input (SCK) plus separate data in (SI)
and data out (SO) lines. Access to the device is
controlled through a chip select (CS) input, allowing any
number of devices to share the same bus.
There are eight options for programmable, nonvolatile,
Block Lock Protection available to the end user. These
options are implemented via special instructions
programmed to the part. The X25F047 also features a
PP pin that can be used for hardwire protection of the
part, disabling all programming attempts, as well as a
Program Enable Latch that must be set before a program
operation can be initiated.
The X25F047 utilizes Xicor’s proprietary Direct Write
cell, providing a minimum endurance of 100,000 cycles
per sector and a minimum data retention of 100 years.
32
16
Y DECODE LOGIC
DATA REGISTER
HIGH VOLTAGE
SERIALFLASH
TM
CONTROL
(512 x 8)
ARRAY
Protection
8
Characteristics subject to change without notice
7005 FRM 01.3
512 x 8 Bit
TM

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X25F047 Summary of contents

Page 1

... TM Protection DESCRIPTION The X25F047 is a CMOS 4K-bit SerialFlash, internally organized as 512 x 8. The X25F047 features a Serial Peripheral Interface (SPI) and software protocol allowing operation on a simple four-wire bus. The bus signals are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled through a chip select (CS) input, allowing any number of devices to share the same bus ...

Page 2

... CS SO *SOIC Measurement PRINCIPLES OF OPERATION The X25F047 is a 512 x 8 SerialFlash designed to inter- face directly with the synchronous Serial Peripheral Inter- face (SPI) of many popular microcontroller families. The X25F047 contains an 8-bit instruction register accessed via the SI input, with data being clocked in on the rising edge of SCK ...

Page 3

... Enable” latch must first be set by issuing the PREN instruction (Table 1 and Figure 4 first taken LOW. Then the PREN instruction is clocked into the X25F047. After all eight bits of the instruction are transmitted, CS must then be taken HIGH. If the user continues the program operation without taking CS HIGH after issuing the PREN instruction, the program opera- tion will be ignored ...

Page 4

... BYTE) SI HIGH IMPEDANCE SO Operational Notes The X25F047 powers up in the following state: • The device is in the low power, standby state. • A HIGH to LOW transition required to enter an active state and receive an instruction. • SO pin is at high impedance. • The “Program Enable” latch is reset. ...

Page 5

... X25F047 Figure 3. Read Status Operation Sequence SCK READ STATUS INSTRUCTION SI NONVOLATILE WRITE IN PROGRESS SO Figure 4. Program Enable/Program Disable Sequence CS SCK HIGH DURING NONVOLATILE WRITE CYCLE INSTRUCTION (1 BYTE) HIGH IMPEDANCE 5 ... ... ... ...

Page 6

... X25F047 Figure 5. Sector Program Operation Sequence SCK PROGRAM INSTRUCTION SCK DATA BYTE Figure 6. Program Status Operation Sequence CS 0 SCK SI HIGH IMPEDANCE SO ABSOLUTE MAXIMUM RATINGS* Temperature under Bias ...................– +135 C Storage Temperature ........................– +150 C ...

Page 7

... This parameter is periodically sampled and not 100% tested. (3) t and t are the delays required from the time V PUR PUW are periodically sampled and not 100% tested. Supply Voltage Max. X25F047 +70 C X25F047-5 +85 C 7005 FRM T04 Limits Min. Max. Units – ...

Page 8

... X25F047 EQUIVALENT A.C. LOAD CIRCUIT 5V 2061 OUTPUT OUTPUT 3025 30pF 5288 A.C. CHARACTERISTICS (Over the recommended operating conditions, unless otherwise specified.) Data Input Timing Symbol f SCK t CYC t LEAD t LAG ( ( ( Data Output Timing Symbol Parameter ...

Page 9

... X25F047 Figure 7. Serial Output Timing CS SCK t V MSB OUT SO ADDR SI LSB IN Figure 8. Serial Input Timing CS t LEAD SCK MSB IN HIGH IMPEDANCE SO SYMBOL TABLE WAVEFORM INPUTS OUTPUTS Must be Will be steady steady May change Will change from Low to from Low to High High ...

Page 10

... X25F047 PACKAGING INFORMATION 8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S PIN 1 INDEX 0.010 (0.25) 0.020 (0.50) 0 – 8 0.016 (0.410) 0.037 (0.937) NOTE: ALL DIMENSIONS IN INCHES (IN P ARENTHESES IN MILLIMETERS) PIN 1 0.014 (0.35) 0.019 (0.49) 0.188 (4.78) 0.197 (5.00) (4X) 7 0.004 (0.19) 0.050 (1.27) 0.010 (0.25 0.0075 (0.19) 0.250" 0.010 (0.25) FOOTPRINT 10 0 ...

Page 11

... X25F047 PACKAGING INFORMATION 8-LEAD MINIATURE SMALL OUTLINE GULLWING PACKAGE TYPE M 0.012 + 0.006 / -0.002 0.040 (1.02 0.007 (0.18) 0.005 (0.13) NOTE: 1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS) 0.118 0.002 (3.00 0.05) (0.30 + 0.15 / -0.05) 0.118 0.002 (3.00 0.05) 0.030 (0.76) 0.0216 (0.55) 7 TYP 0.036 (0.91) 0.032 (0.81) 0.002 0.008 (0.20) 0.05) 0.004 (0.10) 0.150 (3.81) REF. 0.193 (4.90) REF. 11 0.0256 (0.65) TYP R 0.014 (0.36) ...

Page 12

... X25F047 PACKAGING INFORMATION See Detail “A” NOTE: ALL DIMENSIONS IN INCHES (IN P ARENTHESES IN MILLIMETERS) 8-LEAD PLASTIC, TSSOP, PACKAGE TYPE V .025 (.65) BSC .114 (2.9) .122 (3.1) .0075 (.19) .002 (.05) .0118 (.30) .006 (.15) 0 – 8 .019 (.50) .029 (.75) Detail A (20X) 12 .169 (4.3) .252 (6.4) BSC .177 (4.5) .047 (1.20) .010 (.25) Gage Plane Seating Plane ...

Page 13

... X25F047 PACKAGING INFORMATION 8-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P HALF SHOULDER WIDTH ON ALL END PINS OPTIONAL 0.015 (0.38) TYP. 0.010 (0.25) NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH 0.430 (10.92) 0.360 (9.14) PIN 1 INDEX PIN 1 0.300 (7.62) REF. SEATING PLANE 0.150 (3.81) 0.125 (3.18) ...

Page 14

... AE = 2.5 to 5.5V + 2.5 to 5.5V 4.5 to 5.5V + 4.5 to 5.5V 8-Lead SOIC/PDIP Blank = 8-Lead SOIC X25F047 8-Lead Plastic DIP XX Blank = 1.8 to 3.6V + 1.8 to 3.6V 2.5 to 5.5V + 2.5 to 5.5V 4.5 to 5.5V +70 C ...

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