TDA8024T Philips Semiconductors, TDA8024T Datasheet
TDA8024T
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TDA8024T Summary of contents
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DATA SHEET TDA8024 IC card interface Product specification Supersedes data of 2003 Aug 19 INTEGRATED CIRCUITS 2004 July 12 ...
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... Philips Semiconductors IC card interface CONTENTS 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 ORDERING INFORMATION 5 QUICK REFERENCE DATA 6 BLOCK DIAGRAM 7 PINNING 8 FUNCTIONAL DESCRIPTION 8.1 Power supply 8.2 Voltage supervisor 8.2.1 Without external divider on pin PORADJ (or with TDA8024AT) 8.2.2 With an external divider on pin PORADJ (not for the TDA8024AT) 8.2.3 Application examples 8 ...
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... NUMBER NAME TDA8024T SO28 plastic small outline package; 28 leads; body width 7.5 mm TDA8024AT SO28 plastic small outline package; 28 leads; body width 7.5 mm TDA8024TT TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm 2004 July 12 2 APPLICATIONS IC card readers for banking and GND) ...
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... Philips Semiconductors IC card interface 5 QUICK REFERENCE DATA SYMBOL PARAMETER Power supplies V supply voltage DD V DC/DC converter supply DDP voltage I supply current DD I DC/DC converter supply DDP current Card supply V card supply voltage (including CC ripple voltage) V ripple voltage on V CC(ripple)(p-p) (peak-to-peak value) I card supply current ...
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... Philips Semiconductors IC card interface 6 BLOCK DIAGRAM 100 SUPPLY INTERNAL R1 REFERENCE 18 PORADJ (1) VOLTAGE SENSE R2 23 OFF 20 RSTIN 19 CMDVCC 3 5V/3V 1 CLKDIV1 2 CLKDIV2 CLOCK CIRCUITRY 24 XTAL1 OSCILLATOR 25 XTAL2 27 AUX1UC TDA8024 28 AUX2UC 26 I/OUC 22 GND (1) Optional external resistor bridge. If this bridge is not required pin 18 should be connected to ground; see Section 8.2.2. Pin 18 is not connected in the TDA8024AT ...
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... Philips Semiconductors IC card interface 7 PINNING SYMBOL PIN TYPE CLKDIV1 1 I CLKDIV2 2 I 5V/ PGND I DDP I/O UP PRES 9 I PRES 10 I I/O 11 I/O AUX2 12 I/O AUX1 13 I/O CGND 14 S CLK 15 I/O RST PORADJ 18 I CMDVCC 19 I RSTIN ...
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... PGND DDP TDA8024TT PRES 9 20 PRES I/O AUX2 12 17 AUX1 CGND 001aab431 Fig.3 Pin configuration TDA8024TT. AUX2UC AUX1UC I/OUC XTAL2 XTAL1 OFF GND V DD RSTIN CMDVCC PORADJ V CC RST CLK ...
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... Philips Semiconductors IC card interface 8 FUNCTIONAL DESCRIPTION Throughout this document it is assumed that the reader is familiar with ISO7816 terminology. 8.1 Power supply The supply pins for the IC are the range of 2.7 to 6.5 V. All signals interfacing with the system controller are referred to V should also supply the system controller. All card reader contacts remain inactive during power-on or power-off ...
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... Philips Semiconductors IC card interface 8.2.2 W ITH AN EXTERNAL DIVIDER ON PIN TDA8024AT) FOR THE If an external resistor bridge is connected to pin PORADJ (R1 and R2 in Fig.1), then the following occurs: The internal threshold voltage V external voltage and by the hysteresis, therefore ------ - th2(ext)(rise) bridge R2 R1 ...
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... Philips Semiconductors IC card interface 8.3 Clock circuitry The card clock signal (CLK) is derived from a clock signal input to pin XTAL1 or from a crystal operating MHz connected between pins XTAL1 and XTAL2. The clock frequency can be f XTAL Frequency selection is made via ...
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... Philips Semiconductors IC card interface (V) ( (1) Current. (2) Voltage. Fig.6 I/O, AUX1 and AUX2 output voltage and current as functions of time during a LOW-to-HIGH transition. 8.5 Inactive mode After a Power-on reset, the circuit enters the inactive mode. A minimum number of circuits are active while ...
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... Philips Semiconductors IC card interface handbook, full pagewidth CMDVCC I/O CLK RSTIN RST I/OUC Fig.7 Activation sequence using RSTIN and CMDVCC. handbook, full pagewidth CMDVCC I/O CLK RSTIN RST I/OUC 2004 July act ...
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... Philips Semiconductors IC card interface 8.7 Active mode When the activation sequence is completed, the TDA8024 will be in its active mode. Data is exchanged between the card and the microcontroller via the I/O lines. The TDA8024 is designed for cards without V required to program or erase the internal non-volatile memory) ...
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... Philips Semiconductors IC card interface 8.9 V generator CC The V generator has a capacity to supply continuously and internal overload detector operates at approximately 120 mA. Current samples to the detector are internally filtered, allowing spurious current pulses up to 200 mA with a duration in the order drawn by the card without causing deactivation ...
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... Philips Semiconductors IC card interface handbook, full pagewidth OFF PREST RST CLK I Fig.11 Emergency deactivation sequence (card extraction). 2004 July Product specification TDA8024 MDB057 ...
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... PARAMETER R thermal resistance from junction th(j-a) to ambient TDA8024T TDA8024AT TDA8024TT Note 1. This figure was obtained using the following PCB technology: FR, 4 layers, 0.5 mm thickness, class 5, copper thickness 35 m, Ni/Go plating, ground plane in internal layers 2004 July 12 CONDITIONS pins XTAL1, XTAL2, 5V/3V, RSTIN, AUX1UC, AUX2UC, I/OUC, ...
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... Philips Semiconductors IC card interface 12 CHARACTERISTICS DDP amb otherwise specified. SYMBOL PARAMETER Temperature T ambient temperature amb Supplies V supply voltage DD V DC/DC converter supply DDP voltage I supply current DD I DC/DC converter supply DDP current V falling threshold voltage on th2 V DD ...
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... Philips Semiconductors IC card interface SYMBOL PARAMETER DC/DC converter f clock frequency CLK V threshold voltage for th(vd-vf) voltage doubler to change to voltage follower V output voltage on pin V UP(av) (average value) Card supply voltage (pin V ); note external capacitance on VCC pin card supply voltage CC (including ripple voltage) V ripple voltage on V ...
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... Philips Semiconductors IC card interface SYMBOL PARAMETER Crystal oscillator (pins XTAL1 and XTAL2 external capacitance on XTAL1 C pins XTAL1 and XTAL2 XTAL2 f crystal frequency XTAL f frequency applied on XTAL1 pin XTAL1 V LOW-level input voltage on IL pin XTAL1 V HIGH-level input voltage IH on pin XTAL1 Data lines (pins I/O, I/OUC, AUX1, AUX2, AUX1UC and AUX2UC) ...
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... Philips Semiconductors IC card interface SYMBOL PARAMETER Data lines to microcontroller (pins I/OUC, AUX1UC and AUX2UC; with integrated 11 k pull-up resistors LOW-level output voltage OL V HIGH-level output voltage OH V LOW-level input voltage IL V HIGH-level input voltage IH I HIGH-level input leakage LIH ...
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... Philips Semiconductors IC card interface SYMBOL PARAMETER t fall time f duty factor (except for f ) XTAL SR slew rate Control inputs (pins CLKDIV1, CLKDIV2, CMDVCC, RSTIN and 5V/3V); note 6 V LOW-level input voltage IL V HIGH-level input voltage IH I LOW-level input leakage LIL current I HIGH-level input leakage ...
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... Philips Semiconductors IC card interface Notes 1. All parameters remain within limits but are tested only statistically for the temperature range. When a parameter is specifi function external bridge is used then, to avoid any disturbance recommended to connect pin 18 to ground. Pin 18 is not connected in the TDA8024AT 3 ...
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... Philips Semiconductors IC card interface handbook, full pagewidth 100 (1) 100 nF (1) 100 nF 100 k 3.3 V (1) These capacitors must be of the low ESR-type and be placed near the IC (within 100 mm). (2) TDA8024 and the microcontroller must use the same V (3) Make short, straight connections between CGND, C5 and the ground connection to the capacitor. ...
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... Philips Semiconductors IC card interface 14 PACKAGE OUTLINES SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... Philips Semiconductors IC card interface TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... Philips Semiconductors IC card interface 15 SOLDERING 15.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages ...
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... Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “ ...
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... July 12 (2)(3) This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specifi ...
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... Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. ...