NT5SV4M16DT-7K NANYA, NT5SV4M16DT-7K Datasheet

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NT5SV4M16DT-7K

Manufacturer Part Number
NT5SV4M16DT-7K
Description
64Mb synchronous DRAM
Manufacturer
NANYA
Datasheet

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Part Number
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Price
Part Number:
NT5SV4M16DT-7K
Manufacturer:
NANYA/南亚
Quantity:
20 000
NT5SV16M4DT
NT5SV8M8DT
NT5SV4M16DT
64Mb Synchronous DRAM
Features
Description
The NT5SV16M4DT, NT5SV8M8DT, and NT5SV4M16DT
are four-bank Synchronous DRAMs organized as 4Mbit x 4
I/O x 4 Bank, 2Mbit x 8 I/O x 4 Bank, and 1Mbit x 16 I/O x 4
Bank, respectively. These synchronous devices achieve
high-speed data transfer rates of up to 200MHz by employing
a pipeline chip architecture that synchronizes the output data
to a system clock. The chip is fabricated with NTC’s
advanced 64Mbit single transistor CMOS DRAM process
technology.
The device is designed to comply with all JEDEC standards
set for synchronous DRAM products, both electrically and
mechanically. All of the control, address, and data input/out-
put (I/O or DQ) circuits are synchronized with the positive
edge of an externally supplied clock.
RAS, CAS, WE, and CS are pulsed signals which are exam-
ined at the positive edge of each externally applied clock
(CK). Internal chip operating modes are defined by combina-
tions of these signals and a command decoder initiates the
necessary timings for each operation. A fourteen bit address
bus accepts address data in the conventional RAS/CAS mul-
REV 1.1
10/01
f
t
t
t
• High Performance:
CL
1. Terminated load. See AC Characteristics on page 16.
2. Unterminated load. See AC Characteristics on page 16.
• Single Pulsed RAS Interface
• Fully Synchronous to Positive Clock Edge
• Four Banks controlled by BS0/BS1 (Bank Select)
CK
CK
AC
AC
Clock
Frequency
Clock Cycle
CAS Latency
Clock Access
Time
Clock Access
Time
1
2
CL=3
166
5.4
---
6
-6K
CL=2 CL=3
133
7.5
5.4
143
5.4
---
7
-7K
CL=2
133
7.5
5.4
CL=3
143
5.4
-7
7
Units
MHz
CKs
ns
ns
ns
1
tiplexing style. Twelve row addresses (A0-A11) and two bank
select addresses (BS0, BS1) are strobed with RAS. Eleven
column addresses (A0-A9) plus bank select addresses and
A10 are strobed with CAS. Column address A9 is dropped on
the x8 device, and column addresses A8 and A9 are dropped
on the x16 device.
Prior to any access operation, the CAS latency, burst length,
and burst sequence must be programmed into the device by
address inputs A0-A11, BS0, BS1 during a mode register set
cycle. In addition, it is possible to program a multiple burst
sequence with single write cycle for write through cache oper-
ation.
Operating the four memory banks in an interleave fashion
allows random access operation to occur at a higher rate
than is possible with standard DRAMs. A sequential and gap-
less data rate of up to 200MHz is possible depending on
burst length, CAS latency, and speed grade of the device.
Simultaneous operation of both decks of a stacked device is
allowed, depending on the operation being done. Auto
Refresh (CBR) and Self Refresh operation are supported.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
• Programmable CAS Latency: 2, 3
• Programmable Burst Length: 1, 2, 4, 8, Full page
• Programmable Wrap: Sequential or Interleave
• Multiple Burst Read with Single Write Option
• Automatic and Controlled Precharge Command
• Data Mask for Read/Write control (x4, x8)
• Dual Data Mask for byte control (x16)
• Auto Refresh (CBR) and Self Refresh
• Suspend Mode and Power Down Mode
• Standard Power operation
• 4096 refresh cycles/64ms
• Random Column Address every CK (1-N Rule)
• Single 3.3V
• LVTTL compatible
• Package:
54-pin 400 mil TSOP-Type II
0.3V Power Supply
©
NANYA TECHNOLOGY CORP
. All rights reserved.

Related parts for NT5SV4M16DT-7K

NT5SV4M16DT-7K Summary of contents

Page 1

... Fully Synchronous to Positive Clock Edge • Four Banks controlled by BS0/BS1 (Bank Select) Description The NT5SV16M4DT, NT5SV8M8DT, and NT5SV4M16DT are four-bank Synchronous DRAMs organized as 4Mbit Bank, 2Mbit Bank, and 1Mbit Bank, respectively. These synchronous devices achieve ...

Page 2

... 54-pin Plastic TSOP(II) 400 mil 4Mbit Bank NT5SV16M4DT 2Mbit Bank NT5SV8M8DT 1Mbit Bank NT5SV4M16DT 2 NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice DQ7 DQ15 V V ...

Page 3

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Pin Description CK CKE CS RAS CAS WE BS1, BS0 A0 - A11 Input/Output Functional Description Symbol Type Polarity Positive CLK Input Edge CKE Input Active High CS Input Active Low RAS, CAS, Input Active Low WE BS0, BS1 Input — A11 Input — ...

Page 4

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Ordering Information Organization Part Number NT5SV16M4DT-6K 16M x 4 NT5SV16M4DT-7K NT5SV16M4DT-7 NT5SV8M8DT- NT5SV8M8DT-7K NT5SV8M8DT-7 NT5SV4M16DT- NT5SV4M16DT-7K NT5SV4M16DT-7 REV 1.1 10/01 Speed Grade Clock Frequency@CAS Latency 166MHz@CL3 133MHz@CL2 143MHz@CL3 133MHz@CL2 143MHz@CL3 100MHz@CL2 166MHz@CL3 133MHz@CL2 143MHz@CL3 133MHz@CL2 143MHz@CL3 ...

Page 5

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Block Diagram CKE Buffer CKE CLK CLK Buffer A11 BS0 BS1 A10 CS RAS CAS WE Cell Array, per bank, for 4Mb x 4 DQ: 4096 Row x 1024 Col (DQ0-DQ3). ...

Page 6

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Mode Register Operation (Address Input For Mode Set) BS1 BS0 A11 A10 Operation Mode Operation Mode M1 3 M12 M11 M10 REV 1.1 10/ CAS Latency Burst Type M3 Mode ...

Page 7

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Burst Mode Operation Burst mode operation is used to provide a constant flow of data to memory locations (write cycle), or from memory locations (read cycle). There are three parameters that define how the burst mode will operate. These parameters include burst sequence, burst length, and operation mode ...

Page 8

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Command Truth Table (See note 1) Function Device State Mode Register Set Idle Auto (CBR) Refresh Idle Entry Self Refresh Idle Idle (Self- Exit Self Refresh Refresh) See Current Single Bank Precharge State Table See Current ...

Page 9

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Clock Enable (CKE) Truth Table CKE Current State Previous Current Cycle Cycle Self Refresh Power Down All Banks Idle ...

Page 10

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Current State Truth Table Current State CS RAS CAS WE BS0,BS1 Idle ...

Page 11

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Current State Truth Table Current State CS RAS CAS WE BS0,BS1 Read with Auto Pre charge ...

Page 12

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Current State Truth Table Current State CS RAS CAS WE BS0,BS1 Write Recovering Write ...

Page 13

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Absolute Maximum Ratings Symbol Parameter V Power Supply Voltage DD V Power Supply Voltage for Output DDQ V Input Voltage IN V Output Voltage OUT T Operating Temperature (ambient Storage Temperature STG P Power Dissipation D I Short Circuit Output Current OUT 1. Stresses greater than those listed under “ ...

Page 14

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM DC Electrical Characteristics Symbol Input Leakage Current, any input I I(L) (0. All Other Pins Not Under Test = Output Leakage Current I O( disabled, 0.0V OUT Output Level (LVTTL Output “H” Level Voltage ( Output Level (LVTTL Output “ ...

Page 15

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Operating, Standby, and Refresh Currents Parameter Symbol Operating Current I CC1 I CC2P Precharge Standby Current in Power Down Mode I CC2PS I Precharge Standby Current CC2N in Non-Power Down Mode I CC2NS I No Operating Current CC3N (Active state: 4 bank) I CC3P Operating Current (Burst ...

Page 16

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM AC Characteristics ( + initial pause of 200 s, with DQM and CKE held high, is required after power-up. A Precharge All Banks command must be given followed by a minimum of two Auto (CBR) Refresh cycles before or after the Mode Register Set operation. ...

Page 17

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Clock and Clock Enable Parameters Symbol Parameter t Clock Cycle Time, CAS Latency = 3 CK3 t Clock Cycle Time, CAS Latency = 2 CK2 t Clock Access Time, CAS Latency = 3 AC3 (A) t Clock Access Time, CAS Latency = 2 AC2 (A) t Clock Access Time, CAS Latency = 3 ...

Page 18

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Read Cycle Symbol Parameter t Data Out Hold Time OH t Data Out to Low Impedance Time LZ t Data Out to High Impedance Time HZ3 t Data Out to High Impedance Time HZ2 t DQM Data Out Disable Latency DQZ 1. AC Output Load Circuit A. ...

Page 19

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Clock Frequency and Latency Symbol Parameter f Clock Frequency Clock Cycle Time CK t CAS Latency AA t Precharge Time RP t RAS to CAS Delay RCD t Bank Cycle Time RC t Minimum Bank Active Time RAS t Data In to Precharge ...

Page 20

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Package Dimensions (400mil; 54 lead; Thin Small Outline Package) 22.22 Lead #1 0.80 Basic REV 1.1 10/01 0.13 + 0.10 0.35 - 0.71REF 0.05 0.05 Min 20 NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice. Detail A Seating Plane 0.10 Detail A Gage Plane 0.25 Basic 0.5 0.1 © . All rights reserved. ...

Page 21

... NT5SV16M4DT NT5SV8M8DT NT5SV4M16DT 64Mb Synchronous DRAM Revision Log Rev 05/01 Preliminary Changed to Revision 1.0 Removed -75B speed grade 09/01 Added -7 speed grade. Removed Icc6 low power product grade. Changed to Revision 1.1 10/01 Changed tOH from 2.7ns to 3ns for all speed sort. REV 1.1 10/01 Contents of Modification 21 © NANYA TECHNOLOGY CORP NANYA TECHNOLOGY CORP ...

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