SAM3S1B Atmel Corporation, SAM3S1B Datasheet - Page 1053

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SAM3S1B

Manufacturer Part Number
SAM3S1B
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM3S1B

Flash (kbytes)
64 Kbytes
Pin Count
64
Max. Operating Frequency
64 MHz
Cpu
Cortex-M3
# Of Touch Channels
23
Hardware Qtouch Acquisition
No
Max I/o Pins
34
Ext Interrupts
34
Usb Transceiver
1
Quadrature Decoder Channels
1
Usb Speed
Full Speed
Usb Interface
Device
Spi
3
Twi (i2c)
2
Uart
4
Ssc
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
10
Adc Resolution (bits)
12
Adc Speed (ksps)
1000
Analog Comparators
1
Resistive Touch Screen
No
Dac Channels
2
Dac Resolution (bits)
12
Temp. Sensor
Yes
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
YES
Dram Memory
No
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
Yes / No
Timers
3
Output Compare Channels
3
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
41.4.5
Table 41-20. XIN32 Clock Electrical Characteristics (In Bypass Mode)
Note:
6500C–ATARM–8-Feb-11
Symbol
1/(t
t
t
t
t
t
C
R
V
V
CPXIN32
CHXIN32
CLXIN32
CLCH
CHCL
XIN32_IL
XIN32_IH
IN
IN
CPXIN32
1. These characteristics apply only when the 32768 kHz XTAL Oscillator is in bypass mode (i.e., when OSCBYPASS: = 1 in
)
32.768 kHz XIN32 Clock Input Characteristics in Bypass Mode
SUPC_MR and XTALSEL = 1 in the SUPC_CR registers.
Parameter
XIN32 Clock Frequency
XIN32 Clock Period
XIN32 Clock High Half-period
XIN32 Clock Low Half-period
Rise Time
Fall Time
XIN32 Input Capacitance
XIN32 Pull-down Resistor
V
V
XIN32
XIN32
Input Low-level Voltage
Input High-level Voltage
V
XIN_IL
V
XIN_IH
t
CPXIN
Conditions
(1)
(1)
(1)
(1)
t
CPXIN
0.7 x V
t
CLCH
Min
-0.3
400
400
22
11
11
3
t
DDIO
CPXIN
t
CHXIN
0.3 x V
V
DDIO
Max
44
6
5
+0.3
DDIO
t
CHCL
SAM3S
Units
kHz
pF
µs
µs
µs
ns
ns
V
V
1053

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