SAM3S4B Atmel Corporation, SAM3S4B Datasheet - Page 1094

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SAM3S4B

Manufacturer Part Number
SAM3S4B
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM3S4B

Flash (kbytes)
256 Kbytes
Pin Count
64
Max. Operating Frequency
64 MHz
Cpu
Cortex-M3
# Of Touch Channels
23
Hardware Qtouch Acquisition
No
Max I/o Pins
79
Ext Interrupts
79
Usb Transceiver
1
Quadrature Decoder Channels
1
Usb Speed
Full Speed
Usb Interface
Device
Spi
3
Twi (i2c)
2
Uart
4
Ssc
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
10
Adc Resolution (bits)
12
Adc Speed (ksps)
1000
Analog Comparators
1
Resistive Touch Screen
No
Dac Channels
2
Dac Resolution (bits)
12
Temp. Sensor
Yes
Crypto Engine
No
Sram (kbytes)
48
Self Program Memory
YES
Dram Memory
No
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
Yes / No
Timers
3
Output Compare Channels
3
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
42.1
42.2
1094
Soldering Profile
Packaging Resources
SAM3S
Table 42-18
Table 42-18. Soldering Profile
Note:
A maximum of three reflow passes is allowed per component.
Land Pattern Definition.
Refer to the following IPC Standards:
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5°C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25°C to Peak Temperature
• IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern
• Atmel Green and RoHS Policy and Package Material Declaration Data Sheet
Standards)
http://www.atmel.com/green/
The package is certified to be backward compatible with Pb/Sn soldering profile.
gives the recommended soldering profile from J-STD-020C.
http://landpatterns.ipc.org/default.asp
Green Package
3°C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260°C
6°C/sec. max.
8 min. max.
6500C–ATARM–8-Feb-11

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