SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 1225

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SAM9G10

Manufacturer Part Number
SAM9G10
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9G10

Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
266 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
1
Uart
4
Ssc
3
Sd / Emmc
1
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.08 to 1.32
Fpu
No
Mpu / Mmu
No/Yes
Timers
3
Output Compare Channels
3
Input Capture Channels
3
32khz Rtc
Yes
Calibrated Rc Oscillator
No
46.4
46.4.1
Table 46-5.
46.4.2
Table 46-6.
46.5
Table 46-7.
Note:
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11
Symbol
1/(t
Symbol
1/(t
Symbol
1/(t
C
C
t
I
P
I
ST
DDST
DD ON
ON
CRYSTAL
LEXT
CPPCK
CPMCK
CPMAIN
Clock Characteristics
Main Oscillator Characteristics
1. The C
(1)
)
)
)
Processor Clock Characteristics
Master Clock Characteristics
parasitic capacitance, package and board, must be calculated in order to reach 17.5 pF (minimum targeted load for the
oscillator) by taking into account the internal load C
tance must be: 17.5 pF - 4 pF = 13.5 pF which means that 27 pF is the target value (27 pF from xin to gnd and 27 pF from
xout to gnd). If 20 pF load is targeted, the sum of pad, package, board and external capacitances must be 20 pF - 4 pF = 16
pF which means 32 pF (32 pF from xin to gnd and 32 pF from xout to gnd).
Parameter
Crystal Oscillator Frequency
Crystal Load Capacitance
External Load Capacitance
Duty Cycle
Startup Time
Standby Current Consumption
Drive Level
Current Dissipation
Processor Clock Waveform Parameters
Master Clock Waveform Parameters
Main Oscillator Characteristics
CRYSTAL
Parameter
Processor Clock Frequency
Parameter
Master Clock Frequency
value is specified by the crystal manufacturer. In our case, C
The master clock is the maximum clock at which the system is able to run. It is given by the
smallest value of the internal bus clock and EBI clock.
Note:
1. For DDR2 usage only, there are no limitations to LP-DDR, SDRAM and mobile SDRAM.
Conditions
C
C
Standby mode
@ 12 MHz
@ 16 MHz
CRYSTAL
CRYSTAL
Conditions
VDDCORE = 0.9V
T = 85°C
Conditions
VDDCORE = 0.9V
T = 85°C
= 17.5 pF
= 20 pF
INT
(1)
. So, to target the minimum oscillator load of 17.5 pF, external capaci-
(1)
CRYSTAL
17.5
Min
125
125
12
40
Min
Min
(1)
(1)
must be between 17.5 pF and 20 pF. All
0.52
Typ
0.7
27
32
Max
Max
400
133
SAM9G35
SAM9G35
Max
0.55
150
1.1
16
20
60
2
1
Units
Units
MHz
MHz
MHz
Unit
μW
mA
mA
ms
pF
pF
pF
μA
%
1225
1225

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